【正文】 標(biāo)準(zhǔn)儀器相差無幾 [6]。使用圖標(biāo)和連線，可以通過編程對前面板上的對象進(jìn)行控制。 （ 2）開發(fā)與維護(hù)的費(fèi)用低，系統(tǒng)組建時(shí)間短。 （ 1）第一代模擬儀器 這類儀器在某些實(shí)驗(yàn)室仍能看到，是以電磁感應(yīng)基本定律為基礎(chǔ)的指針式儀器，如指針式萬用表，指針式電壓表等，這類指針式儀器借助指針來顯示最 后結(jié)果。這些新的制式都基于 CDMA（碼分多址）技術(shù)，在帶寬利用和數(shù)據(jù)通信方面都有進(jìn)一步發(fā)展。 這種手機(jī)有多種制式，如 NMT， AMPS， TACS，但是基本上使用頻分復(fù)用方式只能進(jìn)行語音通信，收訊效果不穩(wěn)定，且保密性不足，無線帶寬利用不充分。 BSS 主要負(fù)責(zé)無線信息的發(fā)送與接收及無線資源管理，同時(shí)與 NSS 相連，實(shí)現(xiàn)移動(dòng)用戶間或移動(dòng)用戶與固定網(wǎng)絡(luò)用戶之間的通信連接，傳送信息系統(tǒng)和用戶信息等。從 80 年代以來，移動(dòng)通信技術(shù)已經(jīng)從第一代（模擬系統(tǒng)）和第二代（ GSM）的發(fā)展， 達(dá)到通信領(lǐng)域市場容量的40％至 50％，成了國際上最受重視的領(lǐng)域，從 1995 年到 2020 年，中國移動(dòng)通信用戶年平均增長率接近 100％，中國移動(dòng)電話用戶增至 億戶，（截止到 2020 年 10 月）飛速發(fā)展的市場，不僅引來了世界上最新的通信產(chǎn)品，而且也使中國成為通信技術(shù)創(chuàng)新最活躍的國家之一。在這次大會(huì)上就成立了一個(gè)在歐洲電信標(biāo)準(zhǔn)學(xué)會(huì)（ ETSI）技術(shù)委員會(huì)下的“移動(dòng)特別小組 （ Group Special Mobile） ”簡稱 “ GSM” ，來制定 有關(guān)的標(biāo)準(zhǔn)和建議書。s advantages of using groups is huge, makes the GSM system in 3G work mature stage, GSM system is still meet the basic munication needs of an option. In order to understand the principle of the GSM system, using the knowledge from books to, bined with the actual, put the book to the school the knowledge for solving practical problems, to use this design, so as to cultivate their own, software design and hardware design capability. Mobile phone design generally refers to software design, hardware design and prises a mechanical structure design, appearance design three major areas. At the same time, mobile phone design is gradually being mobile phone manufacturing industry value chain important one annulus. This paper introduces the basic structure of GSM work and current situation, the basic operation of LabView module and characteristic and function, wireless munication chip GTM900C function and characteristic, the use of AT mand, using LabView software to build the PC machine and the wireless munication module interface and program debugging. The design mainly uses the virtual mobile phone interface procedures, through the virtual mobile phone interface control hardware circuit for realizing mobile phone dialing call, call, send and receive text messages and other basic munication function. The hardware is posed of GTM900C module, power supply module, control module. Keywords: GSM munication； mobile terminals； wireless munication system platform； GTM900C 目 錄 第一章 前言 ............................................................................................................................... 1 課題的研究目的及其意義 .............................................................................................. 1 GSM 系統(tǒng)歷史背景 ....................................................................................................... 1 移動(dòng)通信的發(fā)展?fàn)顩r及未來 ........................................................................................... 3 GSM 移動(dòng)通信系統(tǒng)基本 組成原理簡述 ........................................................................... 4 系統(tǒng)組成結(jié)構(gòu) .............................................................................................. 4 系統(tǒng)的接口 ................................................................................................. 4 手機(jī)終端的發(fā)展 ............................................................................................................ 6 目前手機(jī) ............................................................................................................ 6 未來手機(jī) ............................................................................................................ 7 LabView 發(fā)展及其優(yōu)點(diǎn) .................................................................................................. 8 的發(fā)展 ................................................................................................... 8 虛擬儀器的功能和特點(diǎn) ....................................................................................... 9 第二章 LabView 圖形化編程語言 ...............................................................................................11 LabView 簡介 ...............................................................................................................11 LabView 構(gòu)建程序框圖 .................................................................................................11 前面板 ...............................................................................................................11 流程圖 .............................................................................................................. 12 圖標(biāo)與連接器 ................................................................................................... 13 LabView 的操作模板 .................................................................................................... 13 工具模板（ Tools Palette） ................................................................................. 13 控制模板（ Control Palette） .............................................................................. 14 功能模板 (Functions Palette)................................................................................ 15 虛擬儀器的構(gòu)成 .......................................................................................................... 17 通用儀器硬件平臺(tái) ............................................................................................ 17 軟件結(jié)構(gòu) .......................................................................................................... 18 創(chuàng)建手機(jī)界面的 VI 程序 .............................................................................................. 19 前面板 .............................................................................................................. 19 程序框圖設(shè)計(jì) ................................................................................................... 20 最終程序（函數(shù)面板部 分） .............................................................................. 25 程序調(diào)試方法 .............................................................................................................. 25 第三章 無線通訊模塊的設(shè)計(jì)與開發(fā) .......................................................................................... 27 硬件介紹及原理圖 ........................