pcb印制電路板設(shè)計(jì)常用名詞-展示頁(yè)
2025-05-22 22:33本頁(yè)面
【正文】 warpwise5 緯向：weftwise, fillingwise5 織物經(jīng)緯密度：thread count5 織物組織：weave structure5 平紋組織：plain structure5 壞布：grey fabric60、 稀松織物：woven scrim6 弓緯：bow of weave6 斷經(jīng)：end missing6 缺緯：mispicks6 緯斜：bias6 折痕：crease6 云織：waviness6 魚眼：fish eye6 毛圈長(zhǎng)：feather length6 厚薄段：mark70、 裂縫：split7 捻度：twist of yarn7 浸潤(rùn)劑含量：size content7 浸潤(rùn)劑殘留量：size residue7 處理劑含量：finish level7 浸潤(rùn)劑：size7 偶聯(lián)劑：couplint agent7 處理織物：finished fabric7 聚酰胺纖維：polyarmide fiber7 聚酯纖維非織布：nonwoven polyester fabric80、 浸漬絕緣縱紙：impregnating insulation paper8 聚芳酰胺纖維紙：aromatic polyamide paper8 斷裂長(zhǎng)：breaking length8 吸水高度：height of capillary rise8 濕強(qiáng)度保留率：wet strength retention8 白度：whitenness8 陶瓷：ceramics8 導(dǎo)電箔：conductive foil8 銅箔：copper foil8 電解銅箔：electrodeposited copper foil (ed copper foil)90、 壓延銅箔：rolled copper foil9 退火銅箔：annealed copper foil9 壓延退火銅箔：rolled annealed copper foil (ra copper foil)9 薄銅箔：thin copper foil 9 涂膠銅箔：adhesive coated foil9 涂膠脂銅箔：resin coated copper foil (rcc)9 復(fù)合金屬箔：posite metallic material9 載體箔：carrier foil9 殷瓦：invar9 箔（剖面）輪廓：foil profile100、 光面：shiny side10 粗糙面：matte side10 處理面：treated side10 防銹處理：stain proofing10 雙面處理銅箔：double treated foil四、 設(shè)計(jì) 原理圖：shematic diagram 邏輯圖：logic diagram 印制線路布設(shè)：printed wire layout 布設(shè)總圖：master drawing 可制造性設(shè)計(jì)：designformanufacturability 計(jì)算機(jī)輔助設(shè)計(jì)：puteraided design.(cad) 計(jì)算機(jī)輔助制造：puteraided manufacturing.(cam) 計(jì)算機(jī)集成制造：puter integrat manufacturing.(cim) 計(jì)算機(jī)輔助工程：puteraided engineering.(cae) 計(jì)算機(jī)輔助測(cè)試：puteraided test.(cat)1 電子設(shè)計(jì)自動(dòng)化：electric design automation .(eda)1 工程設(shè)計(jì)自動(dòng)化：engineering design automaton .(eda2)1 組裝設(shè)計(jì)自動(dòng)化：assembly aided architectural design. (aaad)1 計(jì)算機(jī)輔助制圖：puter aided drawing1 計(jì)算機(jī)控制顯示：puter controlled display .(ccd)1 布局：placement1 布線：routing1 布圖設(shè)計(jì)：layout1 重布：rerouting 模擬：simulation2 邏輯模擬：logic simulation2 電路模擬：circit simulation2 時(shí)序模擬：timing simulation2 模塊化：modularization2 布線完成率：layout effeciency2 機(jī)器描述格式：machine descriptionm format .(mdf)2 機(jī)器描述格式數(shù)據(jù)庫(kù)：mdf databse2 設(shè)計(jì)數(shù)據(jù)庫(kù)：design database2 設(shè)計(jì)原點(diǎn)：design origin 優(yōu)化（設(shè)計(jì)）：optimization (design)3 供設(shè)計(jì)優(yōu)化坐標(biāo)軸：predominant axis3 表格原點(diǎn)：table origin3 鏡像：mirroring3 驅(qū)動(dòng)文件：drive file3 中間文件：intermediate file3 制造文件：manufacturing documentation3 隊(duì)列支撐數(shù)據(jù)庫(kù)：queue support database3 組件安置：ponent positioning3 圖形顯示：graphics dispaly 比例因子：scaling factor4 掃描填充：scan filling4 矩形填充：rectangle filling4 填充域：region filling4 實(shí)體設(shè)計(jì)：physical design4 邏輯設(shè)計(jì)：logic design4 邏輯電路：logic circuit4 層次設(shè)計(jì)：hierarchical design4 自頂向下設(shè)計(jì)：topdown design4 自底向上設(shè)計(jì)：bottomup design50、 線網(wǎng)：net5 數(shù)字化：digitzing5 設(shè)計(jì)規(guī)則檢查：design rule checking5 走（布）線器：router (cad)5 網(wǎng)絡(luò)表：net list5 計(jì)算機(jī)輔助電路分析：puteraided circuit analysis5 子線網(wǎng)：subnet5 目標(biāo)函數(shù)：objective function5 設(shè)計(jì)后處理：post design processing (pdp)5 交互式制圖設(shè)計(jì)：interactive drawing design60、 費(fèi)用矩陣：cost metrix6 工程圖：engineering drawing6 方塊框圖：block diagram6 迷宮：moze6 組件密度：ponent density
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