【正文】 ight Integrator光能累積器.Light Intensity光強(qiáng)度.Limiting Current Density極限電流密度.Liquid Crystal Display (LCD)液晶顯示器.Liquid Dielectrics液態(tài)介質(zhì).Liquid Photoimagible Solder Mask, (LPSM)液態(tài)感光防焊綠漆.Local Area Network區(qū)域性網(wǎng)路.Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor損失因素.Loss Tangent (TanδDK)損失正切.Lot Size批量.Luminance發(fā)光強(qiáng)度.Lyophilic親水性膠體. 純金則24k金為100%的鈍金.KauriButanol Value考立丁醇值().,裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board鍵盤(pán).Kiss Pressure吻壓, 低壓.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.(1克拉(鑽石)=*****K*****Kapton聚亞醯胺軟板.Karat克拉聯(lián)合電子元件工程委員會(huì).Engineering Council)JLeadJ型接腳.Job Shop專業(yè)工廠.Joule焦耳.Jumper Wire跳線.Junction接(合)面,接頭.JustInTime(JIT)適時(shí)供應(yīng),及時(shí)出現(xiàn). *****J*****JEDEC(Joint Electronic Device *****I*****. Socket勣體電路器插座.Icicle錫尖.Illuminance照度.Image Transfer影像轉(zhuǎn)移.Immersion Plating浸鍍.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.InCircuit Testing組裝板電測(cè).Inclusion異物,夾雜物.Indexing Hole基準(zhǔn)孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert, Insertion插接.Inspection Overlay套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)勣體電路器.Inter Face介面.Interconnection互連.Intermetallic Compound (IMC)介面共化物.Internal Stress內(nèi)應(yīng)力.Interposer互邊導(dǎo)電物.Interstitial ViaHole(IVH)局部層間導(dǎo)通孔.Invar殷鋼(%Fe,36%Ni,%C).Ion Cleanliness離子清潔度.Ion Exchange Resins離子交換樹(shù)脂.Ion Migration離子遷移.Ionizable (Ionic) Contaimination離子性污染.Ionization游離,電離.Ionization Voltage (Corona Level)電離化電壓(電纜內(nèi)部狹縫空氣中,引起其電離所施加之最小電壓).IPC美國(guó)印刷電路板協(xié)會(huì).Isolation隔離性,隔絕性.*****H*****Halation環(huán)暈.Half Angle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC氟碳化物的一種商品名.Hard Anodizing硬陽(yáng)極化.Hard Chrome Plating鍍硬鉻.Hard Soldering硬焊.Hardener (Curing Agent)硬化劑(或Curing Agent).Hardness硬度.HaringBlum Cell海固槽.Harness電纜組合.Hay Wire跳線.Heat Cleaning燒潔.Heat Dissipation散熱.Heat Distortion Point (Temp)熱變形點(diǎn)(溫度).Heat Sealing熱封.Heat Sink Plane散熱層.Heat Transfer Paste導(dǎo)熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空氣塵粒過(guò)瀘機(jī).Hipot Test 高壓電測(cè).HiRel高度靠度.Hit 擊(鑽孔時(shí)鑽針每一次刺下的動(dòng)作).Holding Time停置時(shí)間.Hole Breakout孔位破出.Hole Counter數(shù)孔機(jī).Hole Density孔數(shù)密度.Hole Preparation通孔準(zhǔn)備.Hole Pull Strength孔壁強(qiáng)度.Hole Void破洞.Hook 切削刀緣外凸.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風(fēng)手焊.HTE(High Temperature Elongation)高溫延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成電路.Hydraulic Bulge Test液壓鼓起試驗(yàn).Hydrogen Embrittlement氫脆.Hydrogen Overvoltage氫過(guò)(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸溼性.Hypersorption超吸咐.*****G*****G10由連續(xù)玻纖所織成的玻纖布與環(huán)氧樹(shù)脂粘結(jié)劑所復(fù)合成的材料.Gage, Gauge量規(guī).Gallium Arsenide (GaAs)砷化鎵.Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).Galvanic Series賈凡尼次序(電動(dòng)次序).Galvanizing鍍鋅.GAP第一面分離,長(zhǎng)刃斷開(kāi).Gate Array閘列,閘極陣列.Gel Time膠化時(shí)間.Gelation Particle膠凝點(diǎn).Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線路圖形與孔位,所發(fā)展一系列完整的軟體檔案).Ghost Image陰影.Gilding鍍金 (現(xiàn)為:Glod Plating).Glass Fiber玻纖.Glass Fiber Protrusion/Gouging, Groove玻纖突出/挖破.Glass Transition Temperature, Tg玻璃態(tài)轉(zhuǎn)化溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測(cè)試法.Glycol (Ethylene Glycol)乙二醇.Golden Board測(cè)試用標(biāo)準(zhǔn)板.Grain Size結(jié)晶粒度.Grass Leak 大漏.Grid標(biāo)準(zhǔn)格.Ground Plane /Earth Plane接地層.Ground Plane Clearance接地空環(huán).Guide Pin導(dǎo)針.Gull /Wing Lead鷗翼引腳., 貼平式 導(dǎo)體.Flush Point閃火點(diǎn).Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination銅箔壓板法.Foot殘足(干膜殘余物).Foot Print (Land Pattern)腳墊.Foreign Material 外來(lái)物,異物.FormtoList布線說(shuō)明清單.Four Point Twisting四點(diǎn)扭曲法.Free Radical自由基.Freeboard干舷.Frequency頻率.Frit 玻璃熔料.FullyAdditive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔錫層.Fusing熔合.Fusing Fluid助熔液.*****F*****Fabric綱布.Face Bonding反面朝下結(jié)合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布線/扇入布線.Farad 法拉.Farady法拉第.Fatigue Strength抗疲勞強(qiáng)度.Fault缺陷.Fault Plane斷層面.Feed Through Hole導(dǎo)通孔.Feeder 進(jìn)料器.Fiber Exposure玻纖顯露.Fiducial Mark基準(zhǔn)記號(hào).Filament纖絲.Fill緯向.Filler填充料.Fillet內(nèi)圓填角.Film底片.Film Adhesive接著膜,粘合膜.Filter過(guò)濾器.Fine Line細(xì)線.Fine Pitch密腳距,密線距,密墊距.Fineness粒度, 純度.Finger手指.Finishing終修(飾).Finite Element Method有限要素分析法.First Article首產(chǎn)品.First PassYield初檢良品率.Fixture夾具.Flair刃角變形.Flame Point自燃點(diǎn).Flame Resistant耐燃性.Flammability Rate燃性等級(jí).Flare扇形崩口.Flash Plating閃鍍.Flashover閃絡(luò).Flat Cable扁平排線.Flat Pack扁平封裝(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)軟板.Flexural Failure撓曲損壞.Flexural Module彎曲模數(shù), 抗撓性模數(shù) .Flexural Strength抗撓強(qiáng)度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨沖程印刷.Flow Soldering (Wave Soldering)流焊.Fluorescence熒光.Flurocarbon Resin碳氟樹(shù)脂.Flush Conductor嵌入式線路*****E*****EBeam (Electron Beam)電子束.Eddy Current渦電流.Edge Spacing板邊空地.EdgeBoard Connector板邊(金手指)承接器.EdgeBoard Contact板邊金手指.EdgeDip Solderability Test板邊焊錫性測(cè)試.EDTA乙二胺四乙酸.Effluent排放物.Eglass電子級(jí)玻璃.Elastomer彈性體.Electric Strength(耐)電性強(qiáng)度.Electrodeposition電鍍.Electrodeposition Photoresist電著光阻, 電泳光阻.Electroforming電鑄.ElectrolessDeposition無(wú)電鍍.Electrolytic Tough Pitch電解銅..ElectrolyticCleaning電解清洗.Electromigration電遷移.Electrophoresis電泳動(dòng), 電滲.Electrotinning鍍錫.ElectroWinning電解冶煉.Elongation 延伸性, 延伸率.Embossing凸出性壓花.EMF(Electromotive Force)電動(dòng)勢(shì).EMI(Electromagnetic Interference)電磁干擾.Emulsion乳化.Emulsion Side藥膜面.Encapsulating膠囊.Encroachment沾污,侵犯.End Tap封頭.Entek有機(jī)護(hù)銅處理.Entrapment夾雜物.Entry Material蓋板.Epoxy Resin環(huán)氧樹(shù)脂.Etch Factor蝕刻因子.Etchant蝕刻劑(液).Etchback回蝕.Etching Indicator蝕刻指標(biāo).Etching Resist蝕刻阻劑.Eutetic Composition共融組成.Exotherm放熱(曲線).Exposure曝光.Eyelet鉚眼.*****D*****Daisy Chained Design菊瓣設(shè)計(jì).Datum Reference基準(zhǔn)參考.Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水.Delamination分離.Dendritic Growth 枝狀生長(zhǎng)