杜邦產(chǎn)品介紹(參考版)
2025-01-08 16:08本頁面
【正文】 CopperClad Laminates FNC RA 9 1 0 FNC DNC RA RA Cu. ED Cu. 1 1 mil PI 2 2 mil PI 7 1/2 mil PI 1 1 oz. Cu. 2 2 oz. Cu. 9 1/2 oz. Cu. m Q A m Part IV: 演講完畢，謝謝觀看！ 。m Adhesive 35 35181。 Coverlay FNC C 5 1 0 20 FNC DNC C Coverlay 5 Coverlay 1 1 mil PI 2 2 mil PI No Meaning 15 15181。 ? FNC series – CopperClad Laminates ? UL Approved ? Good Flexure Endurance ? Roll Form Packaging (250/500mm x 100M) ? Ex. FNCRA110, FNC110 – Coverlay ? UL Approved ? Roll Form Packaging ? Ex. FNCC510, FNCC51020 m ? DNC series – UL Approved – Least Repellency – Good Peeling Strength – Excellent Heat Humidity Resistance – Excellent Transparency – Same Product Offering as FNC Teclam 174。 ? FR continue... – Sheet Adhesive ? Roll Form Packaging. (24” x 250’) ? UL Approved ? Ex. FR0100, FR0200 – Bond Ply ? Roll Form Packaging. (24” x 250’) ? UL Approved ? Ex. FR0111, FR0212 m Pyralux 174。 m 軟性電路板之主要基材 ? Copper Clad Laminates (銅箔基材 ) – SingleSided .(單面銅箔基材 ) Adhesive Conductor Dielectric Substrate m – DoubleSided . .(雙面銅箔基材 ) Conductor Dielectric Substrate Adhesive 軟性電路板之主要基材 m – AdhesiveLess . .(無膠銅箔基材 ) Dielectric Substrate Conductor 軟性電路板之主要基材 m ? Coverlay(覆蓋膜 ) 軟性電路板之主要基材 m Dielectric Substrate Adhesive 離型紙 Adhesive Kapton ? Stiffner (補強材 ) 軟性電路板之主要基材 Dielectric Substrate Adhesive m ? Bondply Dielectric Substrate Adhesive Adhesive 軟性電路板之主要基材 m Mylar Adhesive Kapton Adhesive ? Sheet Adhesive ?
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