【正文】 .mmC) Largest hole size that can be drilled and plated through in a diameter land while maintaining an annular ring of in large/small boards 1) Largest board size (across diagonal)Size mm 2) Largest hole diameterSize mm 3) Smallest board size (across diagonal)Size mm 4) Largest hole diameterSize mmD) Surface mount land pattern 。 .mmB) Smallest platedthrough hole (PTH) and tolerance consistently produced in thickness material or multilayer board 1) Minimum PTH diameterSize mmTol 177。 .mm 5) Outer layers (additive plating)Size mmTol 177。 .mm 3) Outer layers (plated)Size mmTol 177。 min/max working areaPHOTOTOOL CAPABILITYYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) AOI of phototoolB) AOI CAD reference (CAM)C) PhotoplottingD) Photo reductionsE) Film scan and conversionF) Film processing airdried forcedried processed in automatic processorG) Media types silver halide film glass diazoDRILLING EQUIPMENTYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) ManualB) Optical (single spindle)C) . drillROUTING EQUIPMENTYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Edge bevelerB) Hand router (pin router)C) . routerD) . driller/routerE) Scoring (profile)F) Scoring (straight line)MECHANICAL EQUIPMENTYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Punch pressB) ShearC) Milling machineHOLE PREPARATION (DESMEAR)YESNOEQUIPMENTQTYEQUIPMENT LIMITSA) PermagnateB) PlasmaC) MechanicalD) EtchbackPRIMARY IMAGE APPLICATIONYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Dry filmB) Hand screeningC) Machine screeningD) Wet filmE) Liquid photoimageableTYPE OF TREATMENT FOR MULTILAYER INNERLAYERSYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Black oxideB) Red oxideBrown oxideC) Copper scrubD) DurabondE) OtherLAMINATIONYESNOMATERIALQTYAPPLICATION TECHNIQUEA) High pressureB) High temperatureC) VacuumD) Vacuum assistE) Foil heat assistF) Separate cooldownELECTROLESS COPPER PLATINGYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Fully additive applicationB) Electroless deposition (semiadditive)C) Throughhole and viaCOPPER ELECTROPLATINGYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Copper sulfateB) PyrophosphateC) Copper fluoborateD) OtherTIN/LEAD SURFACE PLATINGS/COATINGSYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Tin/lead electroplatedB) Immersion tin or tin/lead (electroless)C) Hot air solder leveled (HASL)FUSING PROCESSESYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) . reflowB) Hot oil reflowC) Horizontal (hot air level)D) Vertical (hot air level)NICKEL SURFACE PLATINGYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Electroless nickelB) Electroplated nickelGOLD SURFACE PLATINGYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Electroless goldB) Electroplated goldPALLADIUM SURFACE PLATINGYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Electroless palladium (immersion)B) Electroplated palladiumSOLDERMASKYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Screened deposited imageB) Dry film photoimageableC) Liquid photoimageableD) Dry film/liquid binationORGANIC SURFACE PROTECTIONYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) BenzotriazoleOSPEntekB) ImidazoleC) BenzimidazoleMICROSECTION CAPABILITYYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) ManualB) Single cavity automatedC) Multiple cavity automatedD) Plating thickness analysisCHEMICAL ANALYSISYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Etching chemistryB) Plating chemistryC) Effluent (PPM) analysisELECTRICAL TEST EQUIPMENTYESNOEQUIPMENTQTYEQUIPMENT LIMITSA) Continuity and shortsB) Fixture developmentC) Flying probe testD) Impedance controlMASTER EQUIPMENT LISTINGDATE COMPLETED 5/16/2006FORM MQP 10Please plete a Master Equipment List. You may use your own form or the MQP Form 10.IDENTIFICATIONEQUIPMENT NAME/DESCRIPTIONMANUFACTURERTYPE/MODELEQUIPMENT LIMITSACCURACYCALIBRATION FREQUENCYREMARKS