熱源自動(dòng)測(cè)試儀設(shè)計(jì)外文翻譯(參考版)
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【正文】 命名 A=晶片表面接觸面積 ， 米 B=突出 高 度，米 C=相關(guān)系數(shù) Cp=在恒壓比熱容、 J /公斤 ?K Fo=傅里葉數(shù) g=重力加速度、米 /秒 Hc=高度的芯片 ， 米 h=傳熱系數(shù)、 W / m2K k=流體的導(dǎo)熱系數(shù)、 W / m?K l=長(zhǎng)度的熱源、米 n=指數(shù) Nul=奴塞爾數(shù) Q=流量、立方米 /秒 References 1 Xu, G. P., Tso, C. P., and Tou, K. W., 1996, “A Review on Direct Liquid Cooling Channel Flow With SinglePhase for Electronic Systems, ” J. Elec tronic Manufacturing, 6, pp. 115–125. 2 Mudawar, I, 1992, “Directimmersion Cooling for High Power Electronic Chips,” Proc. 1992 Intersociety Conference on Thermal Phenomenon, pp. 74– 84. 3 Mudawar, I., and Maddox, D. E., 1989, “Enhancement of Critical Heat Flux From High Power Microelectronic Heat Sources in a Flow Channel,” Heat Transfer in Electronics1989, R. K. Shah, ed., HTDVol. 111, ASME, New York, pp. 51–58. 4 Incropera, F. P., Kerby, J. S., Moffatt, D. F., and Ramadhyani, S., 1986, “Con vection Heat Transfer from Discrete Heat Sources in a Rectangular Channel,” Int. J. Heat Mass Transfer, 29, pp. 1051–1058. 5 Gersey, C. O., and Mudawar, I., 1993, “Nucleate Boiling and Critical Heat Flux from Protruded Chip Arrays during Flow Boiling,” J. Electron. Packag., 115, pp. 78–88. 6 Keyhani, M., Prasad, V., and Cox, R., 1988, “An Experimental Study of Natu ral Convection in a Vertical Cavity with Discrete Heat Sources,” J. Heat Trans fer, 110, pp. 616–624. 7 Siegel, R., 1960, “Heat Transfer for Laminar Flow in Ducts with Arbitrary Time Variations in Wall Temperature,” J. Appl. Mech., 82E, pp. 241–249. 8 Siegel, R., and Sparrow, E. M., 1959 “Transient Heat Transfer for Laminar Forced Convection in the Thermal Entrance Region of Flat Ducts,” J. Heat Transfer, 81C, pp. 29–36. 9 Siegel, R., 1959, “Transient Heat Transfer for Laminar Slug Flow in Ducts,” J. Appl
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