【正文】 e mark on tantalum capacitor body. Correct Polarity/ 正確的極性 Wrong Polarity/ 極性反 Cathode mark on ponent body. Cathode mark on PCB. Wrong Polarity:/極性反 44 Wrong Orientation/ Polarity 反向 , 極性反 Correct direction/ 正確的方向 Wrong Orientation/反向 IC direction mark on the device body. IC direction mark on PCB. Wrong Orientation/ 反向 : The IC is populated in inverse direction on the PCB. IC被反方向組裝在線路板上 45 Countermeasure/ 對策 1. Wrong placement machine program : Check and correct the machine program. 貼片機程序錯誤 : 檢查和更正機器程序 2. Manual placement in reverse direction: 手工放置元件錯誤 a) Avoid manual placement ponents 避免手工放置元件 b) Need special inspection for the manual placement prior to reflow (document control). 爐前需要特別檢查那些手工放置的元件 (文件控制 ) 3. Disordered orientation in the tray/reel of the ining material: 卷裝或盤裝來料元件的不規(guī)則放置． a) Inspect before loading it to SMT. 上料前檢查來料 b) Feedback to vendor to take corrective actions. 反饋給供應(yīng)商采取改善行動 Wrong Orientation/ Polarity 反向 , 極性反 46 Solder Hole/ 錫洞 ? Blow holes, pinholes, voids 吹孔 , 針孔 ,空洞 47 Solder Hole/ 錫洞 Countermeasure/ 對策 1. Insufficient preheat: Reflow profile optimize. 預(yù)熱時間不足 : 優(yōu)化回流曲線設(shè)置 . 2. Ramp up is too fast : Resetup the reflow profile to make it optimize. 升溫速率太快 : 重設(shè)回流曲線圖使之最優(yōu)化 . 3. Excess flux in solder paste: properly to increase preheat time and temperature. 錫膏助焊劑含量過多 : 適當(dāng)增加預(yù)熱時間和溫度值 . 4. Damp PCB: Bake the PCB before loading it to SMT. PCB受潮 : SMT組裝前烘烤 PCB板 . 5. Component feet oxidation: Bake it before SMT or require vacuum packing on ining : 烘烤或者來料真空包裝 . 6. Attached flux residue on ponent foot: Sort out the defect part. 元件腳有助焊劑殘渣 : 挑選出缺陷來料 . 48 Solder Projections/ 錫尖 ? Solder projection violates assembly maximum height requirements or lead protrusion requirements. 焊錫毛刺違反組裝的最大高度要求或引腳凸出要求 . ? Solder projection violates minimum electrical clearance. 焊錫毛刺違反最小電氣間隙 . 49 Solder Projections/ 錫尖 Countermeasure/ 對策 1. Less flux on board : Increase the flux spray rate on board before go through wave soldering (wave solder). 助焊劑不足 : 增加助焊劑的噴射量 2. Low conveyor ramp: Raise the conveyor ramp per actual status (wave solder). 傳送帶角度過小 : 根據(jù)實際情況校正傳送帶角度 3. Excess preheat temperature and time (flux dry off): Optimize wave soldering profile. (Wave solder) 預(yù)熱過度（助焊劑過度揮發(fā)） : 優(yōu)化波峰曲線 (波峰焊 ) 4. Caused by rework: Standardize operator handling and enhance visual inspection. 返修中產(chǎn)生 : 規(guī)范員工操作加強目檢 . 50 a. Long lead / Short lead 腳長 /腳短 b. Missing Component 元件丟失 c. Exposed Copper 露銅 d. Surface Scratched 外觀劃傷 Countermeasure/ 對策 Take corrective action and preventive action after investigated. 調(diào)查后采取相應(yīng)的改善措施和預(yù)防措施． Others 其它 51 Thank You End 52 謝謝觀看 /歡迎下載 BY FAITH I MEAN A VISION OF GOOD ONE CHERISHES AND THE ENTHUSIASM THAT PUSHES ONE TO SEEK ITS FULFILLMENT REGARDLESS OF OBSTACLES. BY FAITH I BY FAIT