線路板pcb專(zhuān)業(yè)英語(yǔ)詞匯(制造、測(cè)試、缺陷名等)-資料下載頁(yè)
2025-06-10 01:50本頁(yè)面
【正文】 g 不潤(rùn)濕 Microsectioning 顯微剖切 Porosity test孔隙率試驗(yàn) Cleanliness 清潔度 Ionic cleanliness離子清潔度 Ionizable contaminant 離子污染 Nonionic contaminant 非離子污染 Organic contamination 有機(jī)污染 Outgassing 排氣 Selfextinguishing 自熄性 Chemical resistance 耐化學(xué)性 bleeding滲出 6. 組裝 surface mount technology (SMT) 表面組裝技術(shù) surface mount ponent(SMC) 表面組裝元件 chip scale package (CSP) / chip scale mounting 芯片級(jí)組裝 flip chip package (FCP) 倒芯片封裝 soldering 焊接 reflow soldering 再流焊 wave soldering 波峰焊 assembly density 組裝密度 lead引線 lead foot / lead引腳（腿） lead pitch引腳節(jié)距 fine pitch devices (FPD)精細(xì)節(jié)距器件 node連接節(jié)點(diǎn) chip carrier芯片載體 ball grid array (BGA)球柵陣列 chip / die / dice裸芯片 flip chip倒裝芯片 active devices (parts)有源器件 passive devices (parts)無(wú)源器件 embedded ponent埋入元件 addon ponent附加元件 integrated circuit (IC)集成電路 resin flux樹(shù)脂（松香）助焊劑 bond焊（連）接 electrical bridging電橋接 dross焊渣 residue 殘留物 stress relief消除應(yīng)力 印制電路技術(shù)英語(yǔ)縮略語(yǔ)ALIVH (any layer inner via hole)任意層內(nèi)部導(dǎo)通孔 AOI (automatic optional inspection)自動(dòng)光學(xué)檢驗(yàn) BGA (ball grill array)球柵陣列 BUM (buildup multilayer)積層式多層板 BUT (buildup technology)積層式技術(shù) CAM (puter aided manufacturing)計(jì)算機(jī)輔助制造 CCL (copper clad laminate)覆銅箔層壓板 CMT (chip mount technology)芯片安裝技術(shù) CNC (puter numerical control)計(jì)算機(jī)數(shù)字控制 COB (chiponboard)載芯片板 CPCA (China Printed Circuit Association)中國(guó)印制電路行業(yè)協(xié)會(huì) CSP (chip scale packaging)芯片級(jí)封裝 DI (direct imaging)直接成像法 DIW (deionized water)去離子水 DSB (doublesided board)雙面印制板 DP (delivered panel)發(fā)貨拼板 EMI (electromagnetic interference)電磁干擾 EMS(electronic manufacturing service)電子制造部門(mén) FCP (flip chip packaging)倒芯片封裝 FPT (finepitch technology)精細(xì)間距技術(shù) HAL (hot air levelling)熱風(fēng)整平 IC (integrated circuit)集成電路 IPC (institute for interconnecting and packaging electronic ciruit (US))（美國(guó)）電子電路互連與封裝協(xié)會(huì) IVH (inner (interstitial) via hole)內(nèi)部導(dǎo)通孔 KGB (known good board)已知好板 LCD (liquid crysal display)液晶顯示器 MCM (multichip module)多芯片組件/多芯片模塊 MLB (multilayer board)多層板 NC (numerical control)數(shù)字控制 OEM(original equipment manufacturer)原設(shè)備制造商 OSP (organic solderability preservatives)有機(jī)保護(hù)劑 PC (process control)過(guò)程控制 PI (polyimide)聚酰亞銨 PTFE (polytetrafluoetylene or teflon)聚四氟乙烯（特氟隆） PTH (plated through hole)鍍通孔/金屬化孔 PWA (printed wiring assembly)印制線路組裝件 PWB (printed wiring board)印制線路板 PCB? (printed circuit board)印制電路板 RCC (resin coated copper foil)涂樹(shù)脂銅箔 RFI (radiofrequency interference)射頻干擾 SMOBC (solder mask on bare copper)裸銅箔阻焊工藝 SMT (surface mounting technology)表面安裝技術(shù) SPC (statistical process control)統(tǒng)計(jì)過(guò)程控制 TG (glass transition temperature)玻璃化溫度
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