表面裝貼工藝技術(shù)(1)(編輯修改稿)
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【文章內(nèi)容簡(jiǎn)介】 MLC MULTILAYER CERAMIC CAPACITY ? ? ? , , ? PCB +PCB ? ? THT ? SOT23 SOT89 D SOT23 SOT89 D ? IC SSI MSI LSIVLSI ? IC IC IC PTH pin through hole SMT IC Categories Typical Sample (not to scale) Pin Counts Lead Pitches [mm] OKI Suffix New Suffix (New Products) Remarks DIP (Dualinline Package) 8, 14, 16,18, 20, 22, 24, 28, 32, 36, 40, 42, 48 RS RA 100mil pitch type SDIP (Skinny Dualinline Package) no image 20, 22 RS RC 100mil pitch type SDIP (Shrink Dualinline Package) 30, 42, 64 SS RB 70mil pitch type IC ? BGA
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