防靜電環(huán)氧地坪工程施工設(shè)計(jì)方案(編輯修改稿)
2025-05-20 07:14 本頁(yè)面
【文章內(nèi)容簡(jiǎn)介】 strength (minimum 25 N/mm2) with a minimum pull off strength of N/mm2.混凝土基面必須密實(shí)和有足夠的抗壓強(qiáng)度（最小25 N/mm2）， N/mm2。Substrate needs to be dry, moisture content ≤4%. Test method: Sika174。Tramex meter or CM measurement. A waterproofing layer must be installed under the concrete base，or vapor going up will result in epoxy layer bubbling and delamination. 2 mm Sikafloor 81 EpoCem system need to be applied as a moisture barrier.基層須干燥，含水率≤4%，測(cè)試方法：Sika174。Tramex儀或CM測(cè)量法?；炷粱鶎酉马氃O(shè)置防水層，否則存在水汽上升導(dǎo)致環(huán)氧層起泡、脫落風(fēng)險(xiǎn)。建議施工2mm Sikalfoor 81 EpoCem系統(tǒng)作為防潮層。The substrate must be clean and free of all contaminants such as dirt, oil, grease, coatings and surface treatments, etc.基面必須清潔、無(wú)任何污染物，如：灰塵、油、油脂、涂層和表面處理等。Measure Application Conditions 施工條件測(cè)量Substrate Temperature: +10℃ min. / +30℃ max.基面溫度：最低+10℃/最高+30℃Ambient Temperature +10℃ min. / +30℃ max.環(huán)境溫度：最低+10℃/最高+30℃Relative Air Humidity: 80% . max.相對(duì)空氣濕度：最高80%相對(duì)濕度Dew Point: The substrate and uncured floor must be at least 3℃ above dew point to reduce the risk of condensation or blooming on the floor finish.露點(diǎn)：基面和未固化的地面溫度必須至少高于露點(diǎn)3℃，以防水汽凝結(jié)形成斑點(diǎn)。Substrate Preparation 基面處理reclean the floor surface, degrease agent will be used where necessary.清潔地表，必要時(shí)使用清潔劑；Carry out surface preparation by using shot blasting machine (dust free self enclosed steel shot blasting unit) and hand tools to remove
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