【正文】 T ot al F ai l u r e C os t / T ot al S al e s V al u eA ut om ot i ve 9 4 , 7 1 2 / 1 2 , 3 8 4 , 0 3 9 H om e A p p l i a nc e 2 0 2 , 3 7 0 / 9 , 2 2 6 , 9 0 1 A udi o V i de o 1 4 , 1 8 9 / 7 6 9 , 7 0 4 P e rs ona l Ca re $ Bus E qui p 5 5 , 1 5 7 / 7 , 4 4 5 , 4 1 5 P ow e r T ool s 1 7 1 , 0 9 3 / 9 , 0 5 8 , 5 7 9 Ba s i c 50,2 68 Re Ins p e c t i on 379 A ppr ai s al Cos t * (22,55 2)Total 5 6 5 , 6 1 6 / 3 8 , 8 8 4 , 6 3 8 2) I n t e r n al F ai l u r e C os t / T ot al S al e s V al u eA ut om ot i ve 7 8 , 5 1 3 / 1 2 , 3 8 4 , 0 3 9 H om e A p p l i a nc e 7 1 , 9 1 6 / 9 , 2 2 6 , 9 0 1 A udi o V i de o 1 3 , 9 7 9 / 7 6 9 , 7 0 4 P e rs ona l Ca re $ Bus E qui p 2 4 , 3 0 8 / 7 , 4 4 5 , 4 1 5 P ow e r T ool s 9 8 , 7 9 2 / 9 , 0 5 8 , 5 7 9 Ba s i c 50,2 68 Re Ins p e c t i on 379 A ppr ai s al Cos t * (22,55 2)Total 3 1 5 , 6 0 3 / 3 8 , 8 8 4 , 6 3 8 3) E xt e r n al F ai l u r e C os t / T ot al S al e s V al u eA ut om ot i ve 1 6 , 1 9 9 / 1 2 , 3 8 4 , 0 3 9 H om e A p p l i a nc e 1 3 0 , 4 5 4 / 9 , 2 2 6 , 9 0 1 A udi o V i de o 210 / 7 6 9 , 7 0 4 P e rs ona l Ca re $ Bus E qui p 3 0 , 8 4 9 / 7 , 4 4 5 , 4 1 5 P ow e r T ool s 7 2 , 3 0 1 / 9 , 0 5 8 , 5 7 9 Total 2 5 0 , 0 1 3 / 3 8 , 8 8 4 , 6 3 8 COQ/Sales % is a normalized index by off setting the differences in sales volume, so that an apple to apple parison is possible. 質(zhì)量成本收集與分析 COQ Training The COQ for Industry Leaders D at e: 4 /1 /9 6C OQ/S al es % To t al Pre ve nt ion A pp ra is al Int er nal sc ra p Ex t er nal sc ra pM is si les/Sp ace 7. 6 1. 7 4. 4 1. 2 0. 3Tr an spo r ta tion e qu ipm en t 3. 9 0. 3 1. 8 1. 3 0. 5M ach ine r y 4. 4 0. 5 1. 0 1. 8 1. 1M et al Fab r ic at ion 4. 9 0. 5 1. 7 1. 9 0. 8Electron ic s 10 .4 2. 2 4. 6 2. 8 0. 8In strum en ts 7. 3 1. 2 2. 1 1. 8 2. 2C he m ic als/Ph arm . 4. 8 0. 7 1. 1 2. 0 1. 0R ub be r /P lastic 14 .7 0. 4 2. 3 9. 5 2. 5A ve ra ge 6. 5 0. 8 2. 3 2. 5 0. 9B Y H E W L E T T P A C K A R DNote: COQ should Include all the quality related cost and expenses 業(yè)界領(lǐng)導(dǎo)者的 COQ數(shù)據(jù) 注 :COQ需對所有質(zhì)量成本項(xiàng)目的數(shù)據(jù)收集完全 COQ Training SAMPLE PROJECT WAFER CRYSTALIZATION COQ REDUCTION PROJECT 質(zhì)量成本改進(jìn)范例 COQ Training Tracking on Weekly/Monthly Basis Measure BU Name: COQ Details: Plan Plan Plan Plan Plan Plan Dollars % % Dollars % % Dollars % % Dollars % % Dollars % % Dollars % % Quality administration Quality training Quality assurance system Product and process qualification Quality requirement planning Supplier evaluation certification TTL Preventive cost Ining inspection Test equipment calibration repair Inprocess inspection Final inspection Process evaluation Inprocess testing Quality assurance testing Utilities, supplies, products, etc Quality audits TTL Appraisal cost Scrap Rework Sorting Ining material disposition Reject disposition Corrective action evaluation Reinspection TTL internal failure cost Customer plaint evaluation Returned goods rework sorting Returned goods replacement Returned good processing Legal/settlement cost TTL external cost TTL Quality Cost May Jun Actual Actual Actual Actual Actual Actual Jan Feb Mar Apr 按周 /月 /跟蹤數(shù)據(jù) COQ Training Crystal COQ Matrix Trend Scrap $ rate Crystal Scrap $ rate Goal $ 40% 50% 60% 70% 80% 90% 100% Total Yield Goal Yield Crystal % % % % % % Mar Apr May Jun Jul Aug Sept Oct Nov Dec 0 202300 400000 600000 800000 1000000 1202300 Scrap $ Total COQ % COQ% Goal Total COQ %Scrap Crystal COQ Training % % % % % % % Mar Apr May Jun Jul Aug Sept Oct Nov Dec Prevention % % % % % Mar Apr May Jun Jul Aug Sept Oct Nov Dec Internal scrap% Internal Goal InternalScrap% Crystal % % % % % % Mar Apr May Jun Jul Aug Sept Oct Nov Dec External External% Crystal % % % % % % % Mar Apr May Jun Jul Aug Sept Oct Nov Dec Appraisal Prevention% Crystal Appraisal% Crystal COQ % TrendCrystal COQ Training IFRF Defect Trend By Process Mar Apr May Jun Jul AUG Goal COQ Training IFRF Defect Mode Pareto Mar Apr May Jun Jul Aug Goal COQ Training COQ Training COQ Top4 ScrapCrystal % % % % % % % % % % % ASSY DLD BASIC Broken Blank ASSY Dead/ Broken BASIC Rounding Others Scrap % Cumulative % COQ Training 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% Contamination Roughness Scratch Invisible Pareto of DLD Failure Analysis 0% 2% 4% 6% 8% 10% 12% COQ Training Manpower Material Method Machine High Roughness Cement Contamination (adhesive dot on blank) DLD Electrode handling scrap Not well follow clean room WI Welder fixture creates Al particle Dirty BP chamber Wrong calibration method Bug in FT soft ware Bubble in the adhesive Dirty blank etching mark BP frame BP/FP masks cleanliness Fish Bone Diagram Oil leak from pump Adhesive thaw time too short Blank cleaning not effective Blank lapping over target Chip/Twin blank Pattern misalignm