【正文】
、鎘、六價鉻、水銀、 PBB( 多溴化聯(lián)苯)、PBDE( 多溴聯(lián)苯醚)。Mother說明: 一般采用板厚最大值與最小孔徑之比。20.18.盲孔埋孔hole樹脂塞孔SMTOnInfinger/Keyslot: 鍵槽?GoldPad間的阻焊條)S/MClearance:?作用: 它使在焊接時因截面過分散熱而產(chǎn)生虛焊的可能性減少。BreakingPad/Breaking?作用:裝配時作為對位的標(biāo)記?VIA孔聯(lián)了一個焊接PAD。ChipflatMounting一般是作為裝配零件的定位孔或工具孔。ViaCoatedDry一種用玻璃布和環(huán)氧樹脂制造有阻燃性能的材料4.LaminateIS:臨時更改通知32.noticeMixedNetGerberprocessOrganizationInstitute:Instructionmultilayerprintedprintedprintedprintedboard14.printedChangeOrderIPCCircuits:Underwrites’ISORelease:HMLV/ImmersionOrganicTinairFR4(FlamesolderRCCthroughhole:非電鍍孔3.Grid說明: markpattern(thiefFiducialBreaking( 大面積導(dǎo)電圖形上,元件周 Pad間被焊錫短路。these均為整體開窗。要求: 一般公差要求較緊。16.Pad上。 盲孔:從一個表面開始,在內(nèi)層結(jié)束,未貫穿整板的孔。Interconnection高密度互聯(lián)Imageratio21./歐盟 conflictsofdrawingsto use withrepairthe10? 2.,platedof pletelypreventivesoldertoprocess,theMAXLPI3.overandThereSMTonbebysupply other isspecifiedetc..)謝謝觀看 /歡迎下載BY FAITH I MEAN A VISION OF GOOD ONE CHERISHES AND THE ENTHUSIASM THAT PUSHES ONE TO SEEK ITS FULFILLMENT REGARDLESS OF OBSTACLES. BY FAITH I BY FAITH。functional for functional overallPCBconstructionlargerlayers,therebeshalledgesgreenmasksughasclearingthePCB’S.beforewith orviaotherwiseofofareshi