【正文】 easurement or variable for placement module are167。 To verify correct part placement program is loaded167。 Preventive Maintenance Spec167。 B – Tray D – TubeC THM C – Foot Print CH0 Slide24Placement Module Training Intel Confidential ( for internal usage only) REVIEW SUMMARYl A placement is a equipment which pick up Surface Mount ponent and places them on a Printed Circuit Board (PCB)l 2 different type of Pick and Placement module167。 Backlight167。 Tube167。 Glossary CH0 SlidePlacement Module Training Intel Confidential ( for internal usage only) Placement ModuleChapter 1 CH0 Slide6Placement Module Training Intel Confidential ( for internal usage only) Placement Course Description OBJECTIVES: Upon pletion of this topic, the participant will be able to do the following:? Describe placement module functionality and features? Define different types of placement equipments available ? Describe the placement main systems167。Identify major parameter used for the placement module216。 Ch 1: Placement Module Overview [30 min] ? Describe placement module functionality and features? Define different types of placement equipments available ? Describe the placement main systems167。 Ch 6 : CASE STUDY ON SJR [15 min]216。 For fine pitch QFP BGA ponent placement with medium to high speedNo. Comparison Items Chip Shooter Fine Pitch Placer1 Component Size Small = Medium Medium = Large2 Component Type Discreet passive, SOT, SOICFine pitch QFP, BGA, CSP3 Placement Speed Fast Medium4 Accuracy Medium (+/ / 4mils)High (+/ / 1mils) CH0 Slide9Placement Module Training Intel Confidential ( for internal usage only) Universal GSM Phillips TopazFuji CP7SanyoPanasonic MSFChip Shooter Fine Pitch PlacerPanasonic MSRPanasonic MPAGJuki KE2060 Universal HSPFuji XP Fuji QPFuji XPPhillips Assembleon FCMPhillips Assembleon ACMSiemens HS CH0 Slide10Placement Module Training Intel Confidential ( for internal usage only) Turret Head Part SupplyNozzle CameraTape ReelFeederNozzle Head Tray CH0 Slide11Placement Module Training Intel Confidential ( for internal usage only) CHIPResistorCHIPCapacitorSOICSmall Outline Integrated CircuitQFPQuad Flat Pack Rectangular TSOP Type IIThin Small Outline PackageDRAMSmall Outline J Leaded CH0 Slide12Placement Module Training Intel Confidential ( for internal usage only) l Simple, Easy to Use l Consistent Sample Handling l Low Cost l Reliable l Competitive Advantage l Greater Throughput l Increased Productivity l Small Footprint CH0 Slide13Placement Module Training Intel Confidential ( for internal usage only) lLocated after the solder paste module in SMT processPlace ComponentFinal AssemblyScreen Print Solder PasteReflow SolderWave SolderingTest ProbeComponentTestPack CH0 Slide14Placement Module Training Intel Confidential ( for internal usage only) Which one below is not the type of ponents placed by placement equipment?1: SOIC2: QFP3: THM3: THM CH0 Slide15Placement Module Training Intel Confidential ( for internal usage only) No. System Purpose Variables1 Conveyor To transport boards in out for part placementIn, Main, Out2 Part Supply To feed part for pick place Tape Reel, Tray, Bulk, Tube3 Pick Place To pick place part on boardsTurret, Overhead Gantry, Massive Parallel4 Vision To recognize align parts Backlight, Front light, SideChip Shooter Part Supply Fine Pitch Placer CH0 Slide16Placement Module Training Intel Confidential ( for internal usage only) No. Items Tape Reel Tray Tube Bulk1 Component TypePassives, SOIC, PLCCLeaded, BGA, CSPPLCC, SOIC Passives2 Component QuantityLarge (10K15K)Medium (8150 parts/tray)Least (1020 parts/tube)Very Large (1030K)3 Usage HVM HVM / DevelopmentDevelopment HVM4 Beatrate High Medium Low Highl 4 types of part supply system in general:167。 Employ X Yaxis beams to move a placement head to a specific location over a printed circuit board (PCB) that is clamped into a fixed position prior to placement167。 A – Caps C THM167。 Pick place system167。ve made. CH0 SlidePlacement Module Training Intel Confidential ( for internal usage only) Placement Module Process Control SystemChapter 3 CH0 Slide40Placement Module Training Intel Confidential ( for internal usage only) Course Description OBJECTIVES: Upon pletion of this topic, the participant will be able to do the following:?Understand what is Process Control System?Identify process control system used by placement module ownerIntel Malaysia Technical Training website CH0 Slide41Placement Module Training Intel Confidential ( for internal usage only) ? Online, real time system for identifying responding to process or equipment problems? Incorporates the traditional working elements of SPC measurement system, control charts, trend rules + response flow checklists (RFC)/troubleshooting guides? PCS = SPC + RFC? Reduce variation, achieve stability ensure predictable output CH0 Slide42Placement Module Training Intel Confidential ( for internal usage only) No. Items Description Metrology Used1 Component CheckVerify correct part placement, alignment, orientation missingMachine Vision System2 Program CheckVerify correct program is loadedMachine Check3 Feeder CheckVerify correct feeders are loadedPart Verification System (PVS)4 Attrition LossParts thrown or scrapped Machine Computer System (MCS)5 Nozzle BendEnsure the nozzles are at good condition meeting specNozzle Centering Check CH0 Slide43Placement Module Training Intel Confidential ( for internal usage only) l Component Check167。 Generally, attrition loss target is 1%l Nozzle Bend167。 Nozzle Bend CH0 SlidePlacement Module Training Intel Confidential ( for intern