【正文】 tolerances! OPERATING SEQUENCE FOR LD FRAME INPUT TILL DISPENSE PROCESS. 3. DISPENSER RETURN TO HOME POSITION (M1 ON TO INDEX THE FRAME BY ONE PITCH) THIS CAUSE THE SD TO TRIGGER A PULSE SIGNAL. SD ON AGAIN AND M1 OFF AND THEN DISPENSER MOVE DOWN TO DO SOLDER DISPENSE ON THE NEXT BOND PAD. M1 S1 S2 SD S3 C1 C2 B1 4. THE STEP 3 CYCLE REPEATS UNTIL THE WHOLE LEAD FRAME HAS COMPLETE THE FIRST SOLDER DISPENSE PROCESS. ( NOTE : DURING THIS PROCESS WHEN THE FRAME REACHES S3 S3 WILL BE ON WHICH TRIGGER C2 TO CLAMP THE LEADFRAME). M1 S1 S2 SD S3 C1 C2 B1 NOTE: Include dimensions amp。 C l a r i f i ca t i o n o f p h e n o m e n o n6 A n a l ysi s o f p h e n o m e n o n7 C o u n t e r m e a su r e s R e st o r a t i o n R e su l t s O f R e st o r a t i o n I m p r o v e m e n t P r o p o sa l R e su l t s O f I m p r o v e m e n t8 E f f e ct i v e n e ss v e r i f i ca t i o n9 P r e v e n t r e cu r r a n ce amp。 Process Flow設(shè)備和工藝的輪廓 Clarification Of Phenonmenon / Problem問題 /現(xiàn)象的描述 Root Cause Analysis根本原因的分析尋找 Countermeasures采取的對(duì)策 /行動(dòng) Effectiveness Verification有效性的確認(rèn) Prevent Recurrence amp。 idling loss (6) Speed loss (7) Defects amp。E . . . 16 losses 在消除 16種主要損失的過程中 CI活動(dòng)圍繞著 TPM的所有 8支柱之中 Continuous Improvement activities enpass all the 8 TPM pillars in eliminating the 16 Major Losses. IFC EHS OTPM 關(guān)于 AM/PM/CI活動(dòng)失效的分類 Classification of Failures for AM/PM/CI Activities. Responsibility Locations where failures occur Causes of failures 70 % of Failures that can be prevented through . 70%的失效能夠通過 AM 預(yù)防 探測(cè)器 /傳感器 Detector/sensor 驅(qū)動(dòng)系統(tǒng) Driving system 潤(rùn)滑系統(tǒng) Lubricating system 螺栓和螺母 Bolts and nuts 氣動(dòng)系統(tǒng) Pneumatics 工具 /夾具 Jigs/tools 電子系統(tǒng) Electric systems 電子電器設(shè)備 Electric/electronic equipment 原狀態(tài)不能實(shí)現(xiàn) Original conditions are not materialized 變化變質(zhì) Leaving deterioration unattended (No AM activity) 技能缺乏 Shortage of skills 操作條件的無可視化 Nonobservance study of operating conditions 30% of remaining Failures that cannot be solved except through . amp。 . 除了通過 PM和 CI,30%的 失效不能夠被解決 電子電器設(shè)備 Electric/electronic equipment 驅(qū)動(dòng)系統(tǒng) Driving system 液壓系統(tǒng) Hydraulic system 電子和氣壓系統(tǒng) Electric and air pressure systems 探測(cè)器 /工具 /夾具 Detectors/jigs/tools 老化變質(zhì) Leaving deterioration unrectified 內(nèi)部設(shè)計(jì)缺陷 Inherent design shortings 技能缺乏 Shortage of skills 基本的操作條件沒有被保持 Basic and operating conditions are not kept 潤(rùn)滑系統(tǒng) Lubricating system Maintenance Manufacturing * Planned Maintenance Activities *AM Activity Periodic Maintenance 周期的維護(hù) Correct Operation 8 equipment amp。 rework loss (2) Setup amp。 Standardization 預(yù)防復(fù)發(fā)和標(biāo)準(zhǔn)化 Step 1 of CI Approach Theme / Reason For Selection選擇的理由 /主題 ? Identify the Theme辨認(rèn) /確認(rèn)主題 * Reduction降低 [or Elimination消除 ] of [Defect Type] in [Product Line] ? State the Reasons For Selection陳述選擇的理由 How does the above affects line performance? * [% OF PROBLEM] affecting [OEE] ? Provide Visual sample of good product with dimension (for VM defects only) 1 0 2 4 6 8 10FI NA L TES TTR IMamp。 st a n d a r d i z a t i o nStep 4 of CI Approach Outline Of Equipment amp。 tolerances! OPERATING SEQUENCE FOR LD FRAME INPUT TILL DISPENSE PROCESS. 6. WHEN THE FIRST LEAD FRAME IS OUT OF SD, C1 IS ON WHICH MOVE THE THE AWAITING FRAME TILL IT REACHES SD. THE WHOLE PROCESS REPEAT AS STEP 4 AND 5 TILL NO MORE FRAME IN THE INPUT. (NOTE: S1 IS TO ENSURE THE FRAME IS TOTALLY OUT OF MAGAZINE BEFORE THE MAGAZINE CAN INDEX TO NEXT POSITION.) M1 S1 S2 SD S3 C1 C2 B1 5. AS SOON AS THE FRAME IS OUT OF S2, C1 IS OFF AND THE NEXT LEAD FRAME IS INPUTTED INTO THE TRACK FROM THE MAGAZINE UNTIL IT REACHES S2 AND WAIT. M1 S1 S2 SD S3 C1 C2 B1 NOTE: Include dimensions amp。 tolerances! OPERATING SEQUENCE FOR LD FRAME INPUT TILL DISPENSE PROCESS. (SMB) 1. LEAD FRAME IS PUSHED INTO TRACK FROM THE MAGAZINE TILL IT REACHES S2 : ( NOTE :S1 IS ALREADY ON ) S2 ON WHICH TRIGGER C1 AND M1 SIMULTANEOUSLY. M1 S1 S2 SD S3 C1 C2 D1 B1 2. THE FRAME CONTINUE TO MOVE FORWARD TILL IT REACHES SD (NOTE : SD IS ON) M1 IS OFF, DISPENSER MOVE DOWN TO DISPENSE THE SOLDER INTO THE FIRST BOND PAD. M1 S1 S2 SD S3 C1 C2 B1 NOTE: Include dimensions amp。 i m p r o v e m e n t a ct i o n p l a n4 D e t a i l e d u n d e r st a n d i n g / st u d y5 I d e n t i f i ca t i o n amp。 Plan目標(biāo)的設(shè)定和計(jì)劃 Outline Of Equipment amp。 Trend Charts * How to handle, in the future, failures that can be dealt with AM [Role of PM] * Identifying recurring failures based on maintenance records Data Trend Chart * Perform permanent fixing of failures which have been dealt with by quick fix OPL’s. Step 2. 失效分析和全面的檢查 Failure analysis and overall inspection * 重新分析經(jīng)常性發(fā)生的失效 Reanalysis of recurrent failures * 新的失效的全面分析 Thorough analysis of new failures [Role of AM] * Analyzing failures considering that they are problems of the manufacturing sector * Repeating whywhy analysis * Inspection of analogous facilities and correction of causes [Role of PM] * Thorough analysis and guidance to AM Activity * Confirmation and correction of repair errors (skill education/training, etc.) 0失效的程序 Program for Zero Failures Cont Step 3. 強(qiáng)力的變質(zhì)的消除和不用照顧的變質(zhì)的糾正 Elimination of forced deterioration and rectification of unattended deterioration [Role of AM] * 通過清潔尋找最小化的缺陷 Finding minor defects through cleaning * 基本條件的改善 Improvement of basic conditions (Elimination of forced deterioration caused by dirt, suitable oiling, tightening) * Studying use conditions [Role of PM] * Educational guidance regarding minor defects *