【正文】 ORGANIC COATING USED TO PROTECT AND MAINTAIN THE SOLDERABILITY OF COPPER PADS THROUGH HOLES. THIS COATING IS DESIGNED TO MAINTAIN ANDSOLDERABILITY THROUGH THE MULTIPLE HEAT EXCURSIONS THAT ARE TYPICAL OF TODAYS SMD AND MIXED TECHNOLOGY PWB DESIGN. BENEFITS/ATTRIBUTES: * OPTIMUM COATING THICKNESS IS ~ μ m. * ENTEK COATS ONLY THE COPPER SURFACES. IT DOES NOT REACT WITH OR COAT OTHER PWB SURFACES. Design for Manufacture P 39 ENTEK WPF207 (2) * PROVIDES SOLDERABILITY PROTECTION DURING MULTIPLE THERMAL EXCURSIONS THROUGH THE ASSEMBLY PROCESS.(UP TO 5) * ENTEK IS COMPATIBLE WITH ALL FLUX TYPE. * PROVIDES A FLAT SURFACE FOR UNIFORM SOLDER PASTE APPLICATION AND COMPONENT PLACEMENT. * MEASURABLE DEPOSITION THICKNESS. * APPROXIMATE 12 MONTH SHELF LIFE. * REPLACES TINLEAD COATINGS AND THEIR ASSOCIATED PROBLEM (. INTERMETALLIC ISSUE , ENVIRONMENTAL CONCERNS, THERMAL SHOCK DURING HAL, UNEVEN SURFACE PLANARITY, METALLIC ALLOY ISSUES). Design for Manufacture P 40 COMPARISON IN DIFFERENT FINISH TYPE Finish ENTEK Cu106AX ENTEK Cu56 Immersion Gold Selective Solder HAL Fusing properties Organic Organic ELNi/Au Plating Sn/Pb reflow Fusing Sn/Pb alloy Plating Sn/Pb reflow flatness Good Good Good Fair Bad Fair life half year life Half year cost cost pot contamination process scratch scratch not baking and aging control Shock solder single soldering fine pitch solvent IPA fine line Characteristic feature IMC IMC IMC cost cost solder paste printing solderability Application SMT time IR or wave soldering pitch Back panel pitch Wave soldering Design for Manufacture P 41 A = THROUGH VIA HOLE B = BURIED VIA HOLE C = BLIND VIA HOLE BURIED VIA LAYUP A B B BLIND VIA LAYUP A C C BLIND AND BURIED VIA OPTIONS Design for Manufacture P 42 GOLD PLATING .GOLD THICKNESS : 30μ (MAX.) .NICKEL THICKNESS : 100μ (MIN.) SOLDER MASK .AVAILABLE : TAIYO PSR4000 .CAPABILITY TO PLACE SOLDER MASK .DAMS ON .016 PITCH DEVICE4 PAD/HOLE SIZE .PAD SIZE : FINISHED HOLE SIZE + 14mil(MIN.) HOLE SIZE .ASPECT RATIO : 8 : 1 . 021“ GREATER/4 STACK .0140 ” ”/3 STACK . 012”/2 STACK .010” / 1 STACK CONDUCTOR .LIMITED PRODUCTION WITH .004 / .004 .VOLUME PRODUCTION WITH .005 / .005 FINISHED .ENTEK 106AX(WPF207) .HAL .IMMERSION GOLD .SELECTIVE GOLD / SOLDER .BURIED / BLIND VIAS .IMPEDANCE CONTROL Design for Manufacture P 43 Time Frame 2023 2023 2023 Line/Space mil 5/5 4/4 3/3 Hole size mil 10 8 8 Max. aspect ratio 6:1 8:1 8:1 Min./Max. layer layer 2/8 2/12 2/14 Min. SMT pitch mil 15 12 10 Board flatness tolerance inch Soldermask Reg. Tolerance mil 2 Layer to layer Reg. Tolerance mil 5 3 Impedance control tolerance % +10 +7 +7 Min. board thickness 4 Layer mil 20 16 16 Min. board thickness 6 Layer mil 32 24 24 Min. board thickness 8 Layer mil 40 32 32 PRODUCTION CAPABILITIES Design for Manufacture 演講完畢，謝謝觀看！