【正文】 .............................................................................6 . 不同類型電子元器件在倉庫貨架上最大的儲存時間 ........................................................................7 . 濕度敏感的等級表 (MSL) ..............................................................................................................7 . 濕度敏感元件的烘烤條件 .............................................................................................................8 . 乾燥（烘烤）限制 ...............................................................................................................8 . 防潮儲存條件 ......................................................................................................................8 . 錫膏之規(guī)定 .................................................................................................................................9 2. ........................................................................................................... 鋼網印刷制程規(guī)範 11 . 刮刀 ........................................................................................................................................ 11 . 鋼板 ........................................................................................................................................ 11 . 真空支座 ................................................................................................................................. 12 . 鋼網印刷的參數(shù)設定 ................................................................................................................. 13 . 印刷結果的確認 ....................................................................................................................... 13 3. .......................................................................................................... 自動光學檢測 (AOI) 15 . AOI 一般在生產線中的位臵 ....................................................................................................... 15 . AOI 檢查的優(yōu)點 ....................................................................................................................... 15 . 元件和錫膏的抓取報警設定 ....................................................................................................... 15 4. ................................................................................................................. 貼片製程規(guī)定 15 . 吸嘴 ........................................................................................................................................ 16 . Feeders .................................................................................................................................. 16 . NC程式 .................................................................................................................................. 16 . 元件數(shù)據(jù) /目檢過程 .................................................................................................................. 16 . Placement process management data patibility table？ ................................................ 17 5. ...................................................................................................... 回焊之 PROFILE量測 18 . Profile 量測設備 ...................................................................................................................... 18 . 用標準校正板量測 PROFILE之方法 .......................................................................................... 18 6. ................................................................................................................. 標準有鉛製程 20 4 . 建議回焊爐設臵 ....................................................................................................................... 21 7. ................................................................................................................. 無鉛焊接製程 23 . 無鉛製程之 profile 定義 ............................................................................................................ 23 . 無鉛製程 profile 一般規(guī)定 ........................................................................................................ 23 . 無鉛製程標準校正板之 profile 基本規(guī)定 .................................................................................... 25 . 無鉛製程啟動設臵 .................................................................................................................... 25 . 對 PCB 的回焊 profile 量測 ...................................................................................................... 26 8. .......................................................................................................................點膠製程 28 . 概要 ........................................................................................................................................ 28 . CSP元件點膠方式 ................................................................................................................... 29 9. ................................................................................................ 手工焊接製程以及手工標準 31 10. 目檢相關規(guī)定，不良判定標準，不良分類以及培訓資料 ............................................................... 31 11. 相關文件 ...........................