【正文】 not remended due to fire safety. Remended cleaning fluid for cleaning of misprinted boards Multicore Prozone SC02 is preferred (SC02 will attack slightly acrylics and some rubbers used in protective gloves) Use of isopropanol (IPA) is allowed but not remended. Waste must be handled properly. Note! Components that are not designed for liquid cleaning process, have to be removed and changed after cleaning. PWB with laser (micro) vias, OSP plating or which are totally or partly Aramid based, ARE NOT ALLOWED TO BE WASHED! Cleaning solvent traps into PWB structures and reduces esp. CSP ponents joint reliability. Page 11(20) CONFIDENTIAL MES00009 中管網(wǎng)通用業(yè)頻道 企業(yè) () NMP SMD Process Specification Copyright ? Nokia Mobile Phones 中管網(wǎng)通用業(yè)頻道 企業(yè) () Support table vacuum OFF while printing, unless dedicated workholder is of such construction that no vacuum is created between PWB and stencil OR vacuum is limited to 100200mbar. Vacuum ON during loading and table movements (activate special 1043 in AP25 SW or later). Kneading1 8 kneads after every 20min or longer pause in printing process and remended after addition of paste. Otherwise not needed. Solder paste amount on stencil 150 – 160 g + paste attached to squeeze (200mm ) Printing accuracy +/ mm *) Sometimes referred as ”squeegee pressure” and force given in KGs, 1kg= **) Depends linearly on squeegee width 1) Automatic procedure to soften paste and dissolve partly dried paste residues at stencil aperture opening edges instead of stencil manual cleaning. The panel used for kneading can be fed to production line as normally printed board. After pauses beyond 120min careful stencil cleaning in dedicated cleaner is remended. 4. STATISTICAL PRINTING PROCESS CONTROL, SPPC Alarm and control limit settings In order to determine alarm and control limits for the SPPC machine at least boards must be measured in normal process conditions. Successive boards must be processed as subgroups of about 10 pcs. Ideally subgroups should match with a board batch printed between stencil cleaning. Alarm limits for Area and Bridge parameters equal to 3 x standard deviation of collected data ( boards). Control limit Specification Control limit for Area 3?Area Control limit for Bridge 3?Bridge In order to make sure that too low value isn39。C (ref. 5), peak temperature (ref. 6) and temperature gradients in preheat (ref. 1) and reflow (ref. 4) Reflow profile specification Ref Parameter Specification Method of heat transfer Forced convection Measurement method Oven calibration method (section) 1 Average temperature gradient in preheat (T= 40…140176。C) 60…80 s 3 Max temperature in preheat 175176。C/s 5 Time above 179176。C) … 3176。C 245176。C Conveyor speed m/min Blower speed 70% 70% BTU VIP98 Zone 1 2 3 4 5 6 7 Cooling Top 120176。C 175176。C 135176。C 215176。C ? 10176。C Remended method of tip temperature calibration Use lightweight NiCr/Ni thermocouple or calibrator such as ERSA DTM100* or equivalent. Use a lot of solder in tip to assist in heat transfer Antistatic protection Required Maximum exposure time 3s Remended solder wire for SMD Multicore Solders Crystal 502 Sn62 Remended diameters: , , , Remended solder wire for soldering Ni stripes and noncritical mechanical parts Multicore Solders Crystal 511, alloy, dia Remended rework flux (final application method under development) Multicore Solders Multifix 42501 in 30cc syringes Remended solderwick Multicore No Clean Desoldering Wick or equivalent * ERSA L246。C +10176。C Conveyor speed m/min Static pressure 7. MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA Manual and semiautomatic hot gas soldering and rework Parameter Specification Max air temperature measured at PWB surface +260176。C 165176。C 245176。C 150176。C 180176。C/s Total length of profile Max 300 s Tim e/sTemperature/C1234567 Figure 1. Illustration of critical reflow process parameters. Page 15(20) CONFIDENTIAL MES00009 中管網(wǎng)通用業(yè)頻道 企業(yè) () NMP SMD Process Specification Copyright ? Nokia Mobile Phones 中管網(wǎng)通用業(yè)頻道 企業(yè) () Remended reflow oven settings The following settings shall verified for each oven using oven calibration method (section ) and settings shall be adjusted if necessary to achieve a profile within the specification in section . ERSA Hotflow 7 Zone 1 2 Reflow Cooling Top 170176。C 25…45 s 6 Peak temperature in reflow 215…2 25176。C) …2 176。C/s Max temperature gradient in preheat 10 176。t be fixed by self aligment during reflow process and to avoid unnecessary alarms. Component type Placement alarm limit specification 0402 ? 150 ?m for X and Y, ?10? for Theta 0603 and bigger chip ponents ? 200 ?m for X and Y, ?10? for Theta Leaded ponents ? 150 ?m for X and Y, ? 5? for Theta Paste printing accuracy ? 50 ?m for X and Y Paste printing Area coverage 70 125% of nominal value 6. REFLOW SOLDERING PROCESS SPECIFICATION Profile measurement equipment Reflow profile shall be measured using a temperature measurement equipment specifically designed for passthrough reflow profile measurements. Page 13(20) CONFIDENTIAL MES00009 中管網(wǎng)通用業(yè)頻道 企業(yè) () NMP SMD Process Specification Copyright ? Nokia Mobile Phones 中管網(wǎng)通用業(yè)頻道 企業(yè) () Remended profiling equipment are: Multicore SlimLine SoldaPro Datapaq 9000 SlimKIC The profiling equipment shall be calibrated regularly according to the maintenance instructions by the supplier. Only the thermocouples remended and approved by the measurement equipment supplier shall be used. Reflow profile measurement method Item Oven calibration and verification Purpose To evaluate