【正文】 and off) bent pin or short phenomenon for ponent1. 浮高高於 。 (DIMM底座有突塊 )5. 零件腳折腳與短路 is over than . is over than .3. LH is over .(forDIMM stand off)4. WH is over .(forDIMM stand off)5. bent pin or short phenomenon for ponentDIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 21DIP221 零件組裝標(biāo)準(zhǔn) ﹝ 彎腳 90o型式排針 ﹞ 傾斜 (次缺 Minor)理想狀況 (TARGET CONDITION)允收狀況 (ACCEPTABLE CONDITION)拒收狀況 (NONCONFORMING DEFECT)傾斜Lh≧Lh=~傾斜Lh 1. 排針零件平貼 PCB零件面 ，無浮高傾斜現(xiàn)象。DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn)理想狀況 (TARGET CONDITION) 允收標(biāo)準(zhǔn) (ACCEPTABLE CONDITION)拒收標(biāo)準(zhǔn) (NONCONFORMING DEFECT)No solder ball, residue or solder spike remain on M/B 不易被剝除者 L≦ 10mil 可被剝除者 D≦ 5mil or 面積 ≦ 600mm2 ,數(shù)目 5個D L 不易被剝除者 L ＞ 10mil 可被剝除者 D ＞ 5mil or 面積 ≦ 600mm2 ,數(shù)目超過 5個D L1. Solder ball’s diameter or length of solder residue must be less than 5mil.2. The quantity which solder residue’s surface area is more than 600mm2 must be less than 5.PAGE 22理想狀況 (TARGET CONDITION)DIP223 零件組裝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (JUMPER PINS)剪 PIN規(guī)定 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 231. PIN被 剪平 ,無任何毛邊 is no bur1. PIN針未剪平 ,其高度 小等於 ，判定允收。Component is mounted on M/B closely.1. 浮高低於 。 (電容 底座有突塊 )5. 零件腳未折腳與短路 is less than . is less than .3. LH is less than .(for Cap stand off)4. WH is less .(for Cap stand off) bent pin or short phenomenon for ponent1. 浮高高於 。 (電容 底座有突塊 )5. 零件腳折腳與短路 is over than . is over than .3. LH is over .(for Cap stand off)4. WH is over .(for Cap stand off)5. bent pin or short phenomenon for ponent允收狀況 (ACCEPTABLE CONDITION)Lh ≦ mm拒收狀況 (NONCONFORMING DEFECT)1500μF 10V1500μF 10VPCB1500μF 10V1500μF 10VLh ≦ mmLh mm1500μF 10V1500μF 10VLh mmDIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn)DIP225 零件組裝標(biāo)準(zhǔn) [拖錫點(diǎn)銲錫 ] (次缺 Minor)允收狀況 (ACCEPT CONDITION)拒收狀況 (NONCONFORMING DEFECT)拒收狀況 (NONCONFORMING DEFECT)PCB 點(diǎn)沾錫狀況無蓋住零件腳 pad is smooth and get wetting well 拖錫點(diǎn) PAD 已經(jīng)高於零件腳 peak height of robber pad is over ponent’s lead拖錫點(diǎn) PAD 點(diǎn)沾錫狀況已蓋住零件腳 peak height of robber pad is over ponent’s lead heightPCB拖錫點(diǎn) PADPCBPAGE 25DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn)DIP226 其他零件組裝標(biāo)準(zhǔn) [for NEC MS6924] (主缺 Major)允收狀況 (ACCEPT CONDITION)1. 機(jī)構(gòu)零件基座平貼 PCB 零件面不得浮高傾斜現(xiàn) Component is mounted on M/B closely and no floating phenomenon.. PAGE 25不可浮高允收狀況 (ACCEPT CONDITION)不可浮高不可浮高允收狀況 (ACCEPT CONDITION)1. 機(jī)構(gòu)零件基座平貼 PCB 零件面不得浮高傾斜現(xiàn) Component is mounted on M/B closely and no floating phenomenon.. 1. 機(jī)構(gòu)零件基座平貼 PCB 零件面不得浮高傾斜現(xiàn) Component is mounted on M/B closely and no floating phenomenon.. 演講完畢，謝謝觀看！。 。 。 P is over than of pin.理想狀況 (TARGET CONDITION)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 24DIP224 零件組裝標(biāo)準(zhǔn) ﹝ 電解電容 ﹞ 浮件、傾斜 (次缺 Minor)1. 零件平貼於機(jī)板表面。1..零件面錫珠、錫渣允收狀況可 被剝除者 ,直徑 D或長度 L 小於 等於 5mil ,非沾於零件腳上不 造成短路的錫珠。 。 。There solder residue contact two leads at the same time.PCB短路理想狀況 (TARGET CONDITION)DIP220 零件組裝標(biāo)準(zhǔn) ﹝ DIMM,SIMM,PCI CONNECTOR ﹞ 浮件、傾斜 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)拒收狀況 (NONCONFORMING DEFECT)Lh、 Wh≦DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 20PCBDIMM CONNECTORDIMM CONNECTORLh、 Wh≦Lh、 Wh Lh、 Wh1. 零件平貼於機(jī)板表面。 (不可有目視貫穿過之零 件孔 。 angle is less than 90o. doesn’t contact body. 75% is covered by solder in PTH and no solder spike.1. 沾錫角度大於 90度。、縮錫、拒焊或空焊3. 需符合錫洞與針孔標(biāo)準(zhǔn)。3. 無冷焊現(xiàn)象或其表面光亮。 2. IC 腳與本體連接處已破裂， 判定拒收。 nick on ponent body but package is not broken. materials of ponent is not exposed on air.1. 零件本體破裂，內(nèi)部金屬元件 外露，絕緣外皮已破損判定拒 收。The distance between traces or trace and lead is lessr than 4mil. PCB拒收狀況 (NONCONFORMING DEFECT)DIP215 零件組裝標(biāo)準(zhǔn) 零件破損 (主缺 Major)允收狀況 (ACCEPTABLE CONDITION) + +最理想狀況 (TARGET CONDITION) +DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 151500μF 10V1500μF 10V1500μF 10V1. 零件本體完整良好。 插於腳座時不得浮高Component lead protrude over solder.理想狀況 (TARGET CONDITION)拒收狀況 (NONCONFORMING DEFECT)DIP214 零件組裝標(biāo)準(zhǔn) 零件腳與線路間距 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)≧ ( 4 mil ) ( 4 mil )DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 141. 零件如需彎腳方向應(yīng)與所在位 置 PCB線路平行。 is greater than . is not protruded over solder.拒收狀況 (NONCONFORMING DEFECT)DIP213 零件組裝標(biāo)準(zhǔn) 零件腳折腳、未入孔、未出孔 (主缺 Major)允收狀況 (ACCEPTABLE CONDITION)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 13，判定拒收。 is greater than . is greater than .PCB理想狀況 (TARGET CONDITION)DIP212 零件組裝標(biāo)準(zhǔn) K/B JACK 、 POWER 零件浮件與傾斜 (次缺 Minor)允收狀況 (ACCEPTABLE CONDITION)浮高 .傾斜 Lh .Wh ≦ mm 拒收狀況 (NONCONFORMING DEFECT)DIP 外 觀 檢 驗(yàn) 規(guī) 範(fàn) PAGE 12POWER CONNPOWER CONN浮高 .傾斜 Lh .Wh mm POWER CONNK/B JACKK/B JACKK/B JACK1. K/B JACK與 POWER SET 平 貼於 PCB零件面。2. CPU SOCKET 平貼於 PCB零 件面。2. PIN表面光亮電鍍良好、無毛 邊扭曲不良現(xiàn)象。 thickness of pin. H is less than .1. PIN( 撞 )歪大於 1/2 PIN的厚 度，判定拒收。 . Wh over than . isn’t protruded over solder. tilt pin can’t over the PCB edge or contact other po