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【正文】 c Leaded Chip Carrier 帶引腳的陶瓷片式載體CML Current Mode Logic 電流開關(guān)邏輯CMOS Complementary MetalOxideSemiconductor 互補(bǔ)金屬氧化物半導(dǎo)體COB Chip on Board 板上芯片COC Chip on Chip 疊層芯片COG Chip on Glass 玻璃板上芯片CSP Chip Size Package 芯片尺寸封裝CTE Coefficient of Thermal Expansion 熱膨脹系數(shù)CVD Chemical Vapor Depositon 化學(xué)汽相淀積DCA Direct Chip Attach 芯片直接安裝DFP Dual Flat Package 雙側(cè)引腳扁平封裝DIP Double InLine Package 雙列直插式封裝DMS Direct Metallization System 直接金屬化系統(tǒng)DRAM Dynamic Random Access Memory 動(dòng)態(tài)隨機(jī)存取存貯器DSO Dual Small Outline 雙側(cè)引腳小外形封裝DTCP Dual Tape Carrier Package 雙載帶封裝3D ThreeDimensional 三維2D TwoDimensional 二維EB Electron Beam 電子束ECL EmitterCoupled Logic 射極耦合邏輯FC Flip Chip 倒裝片法FCB Flip Chip Bonding 倒裝焊FCOB Flip Chip on Board 板上倒裝片F(xiàn)EM Finite Element Method 有限元法FP Flat Package 扁平封裝FPBGA Fine Pitch Ball Grid Array 窄節(jié)距BGAFPD Fine Pitch Device 窄節(jié)距器件FPPQFP Fine Pitch Plastic QFP 窄節(jié)距塑料QFPGQFP GuardRing Quad Flat Package 帶保護(hù)環(huán)的QFPHDI High Density Interconnect 高密度互連HDMI High Density Multilayer Interconnect 高密度多層互連HIC Hybird Integrated Circuit 混合集成電路HTCC High Temperature CoFired Ceramic 高溫共燒陶瓷HTS High Temperature Storage 高溫貯存IC Integrated Circuit 集成電路IGBT Insulated Gate Bipolar Transistor 絕緣柵雙極晶體管ILB InnerLead Bond 內(nèi)引腳焊接I/O Input/Output 輸入/輸出IVH Inner Via Hole 內(nèi)部通孔JLCC JLeaded Chip Carrier J形引腳片式載體KGD Known Good Die 優(yōu)質(zhì)芯片LCC Leadless Chip Carrier 無引腳片式載體LCCC Leadless Ceramic Chip Carrier 無引腳陶瓷片式載體LCCP Lead Chip Carrier Package 有引腳片式載體封裝LCD Liquid Crystal Display 液晶顯示器LCVD Laser Chemical Vapor Deposition 激光化學(xué)汽相淀積LDI Laser Direct Imaging 激光直接成像LGA Land Grid Array 焊區(qū)陣列LSI Large Scale Integrated Circuit 大規(guī)模集成電路LOC Lead Over Chip 芯片上引線健合LQFP Low Profile QFP 薄形QFPLTCC Low Temperature CoFired Ceramic 低溫共燒陶瓷MBGA Metal BGA 金屬基板BGAMCA Multiple Channel Access 多通道存取MCM Multichip Module 多芯片組件MCMC MCM with Ceramic Substrate 陶瓷基板多芯片組件MCMD MCM with Deposited Thin Film Inteconnect Substrate 淀積薄膜互連基板多芯片組件MCML MCM with Laminated Substrate 疊層基板多芯片組件MCP Multichip Package 多芯片封裝MELF Metal Electrode Face Bonding 金屬電極表面健合MEMS Microelectro Mechanical System 微電子機(jī)械系統(tǒng)MFP Mini Flat Package 微型扁平封裝MLC MultiLayer Ceramic Package 多層陶瓷封裝MMIC Monolithic Microwave Integrated Circuit 微波單片集成電路MOSFET MetalOxideSilicon FieldEffect Transistor 金屬氧化物半導(dǎo)體場效應(yīng)晶體管MPU Microprocessor Unit 微處理器MQUAD Metal Quad 金屬四列引腳MSI Medium Scale Integration 中規(guī)模集成電路OLB Outer Lead Bonding 外引腳焊接PBGA Plastic BGA 塑封BGAPC Personal Computer 個(gè)人計(jì)算機(jī)PFP Plastic Flat Package 塑料扁平封裝PGA Pin Gri
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