【正文】 ..................................................................................... 1 研究背景 .................................................................................................................... 1 溫度巡檢儀發(fā)展概況 ................................................................................................ 1 研究意義 .................................................................................................................... 1 第二章 EDA 技術介紹 ............................................................................................................. 3 電子設計自動化 （ EDA） 技術概述 ........................................................................ 3 電子設計自動化 （ EDA） 技術 .................................................................... 3 可編程邏輯門陳列（ FPGA） ...................................................................... 4 EDA 設計流程 ........................................................................................................... 5 設計輸入 ........................................................................................................ 6 綜合 ................................................................................................................ 7 適配 ................................................................................................................ 7 時序仿真 ........................................................................................................ 7 編程下載 ........................................................................................................ 7 硬件測試 ........................................................................................................ 8 VHDL 硬件描述語言介紹 ........................................................................................... 8 第三章 溫度巡檢儀總體方案設計 .......................................................................................... 9 基于單片機的溫度巡檢儀 ........................................................................................ 9 基于虛擬儀器的溫度巡檢儀 .................................................................................. 11 總體方案選擇與設計 .............................................................................................. 11 第四章 總體設計方案介紹 .................................................................................................... 13 基于 LPM_ROM 的熱電偶溫度巡檢儀的設計 .......................................................... 13 系統(tǒng)硬件設計 .............................................................................................. 13 系統(tǒng)軟件設計 .............................................................................................. 20 內(nèi)蒙古科技大學畢業(yè)設計說明書 (畢業(yè)論文 ) IV 基于 MAX6675 的熱電偶溫度巡檢儀設計 .............................................................. 32 系統(tǒng)硬件設計 .............................................................................................. 32 系統(tǒng)軟件設計 .............................................................................................. 36 第六章 總結 ............................................................................................................................ 39 參考文獻 .................................................................................................................................. 40 附錄 A ...................................................................................................................................... 42 附錄 B....................................................................................................................................... 44 附錄 C....................................................................................................................................... 46 附錄 D ...................................................................................................................................... 48 致謝 .......................................................................................................................................... 50 內(nèi)蒙古科技大學畢業(yè)設計說明書 (畢業(yè)論文 ) 1 第一章 引 言 研究背景 隨著現(xiàn)代科學技術的發(fā)展， 在現(xiàn)代化的工業(yè)生產(chǎn)中，電流、電壓、溫度、壓力、流量、流速和開關量都是常用的主要被控參數(shù)。 關鍵詞： 熱電偶 ； 溫度巡檢儀 ； FPGA； 內(nèi)蒙古科技大學畢業(yè)設計說明書 (畢業(yè)論文 ) II FPGAbased thermocouple temperature data logging devices design Abstract With the development of science and technology， The field of industrial control needs for realtime field data acquisition and control, for example, power plants, iron and steel plant, chemical industry production of large amounts of data, they also need to conduct onsite collection, and the temperature acquisition is an extremely important part of them. The topics needs the temperature of the technical requirements， I design a 4way Thermocouple Temperature Detector. The instrument can detect the four test points temperature， Can be widely used in industrial production and people39。 該裝置不僅具有精度高、功耗低的優(yōu)點，還可以及時顯示，操作使用方便。 題 目： 基于 FPGA 的熱電偶溫度巡檢儀的設計 內(nèi)蒙古科技大學畢業(yè)設計說明書 (畢業(yè)論文 ) I 基于 FPGA的熱電偶溫度巡檢儀的設計 摘要 隨著現(xiàn)代控制技術的發(fā)展， 在工業(yè)控制領域需要對現(xiàn)場數(shù)據(jù)進行實時采集、控制，例如在發(fā)電廠、鋼鐵廠、化工領域的生產(chǎn)中都需要對大量數(shù)據(jù)進行現(xiàn)場采集，而溫度采集又是其中極為重要的部分。 總體設計 采用 兩種方案。s daily life. The device not only has high accuracy and the advantages of low power consumption, but also shows in time that the operation is easy to use. I use two types of programs to achieve. The first program: first of all, thermocouple is selected by multichannel selector, then the signal is passed by cold junction pensation and amplification processing, then it passed in A / D conversion, After it be processed by FPGA chip and displayed in the LED, finally. The second program: the signal, outputted by thermocouple, directly be passed into the MAX6675 IC， and processed by FPGA chip and displayed in the LED. The software function is in the MUXPLUS Ⅱ and Quartus Ⅱ environment with VHDL language. Key words: Thermocouple。例如：在冶金工業(yè)、化工生產(chǎn)、電力工程、造紙行業(yè)、機械制造和食品加工等諸多領域中，