【正文】 題 目： 基于 FPGA 的熱電偶溫度巡檢儀的設(shè)計(jì) 內(nèi)蒙古科技大學(xué)畢業(yè)設(shè)計(jì)說明書 (畢業(yè)論文 ) I 基于 FPGA的熱電偶溫度巡檢儀的設(shè)計(jì) 摘要 隨著現(xiàn)代控制技術(shù)的發(fā)展， 在工業(yè)控制領(lǐng)域需要對(duì)現(xiàn)場(chǎng)數(shù)據(jù)進(jìn)行實(shí)時(shí)采集、控制，例如在發(fā)電廠、鋼鐵廠、化工領(lǐng)域的生產(chǎn)中都需要對(duì)大量數(shù)據(jù)進(jìn)行現(xiàn)場(chǎng)采集，而溫度采集又是其中極為重要的部分。 本課題針對(duì)溫度檢測(cè)儀的技術(shù)要求，設(shè)計(jì)了一種 4 路 熱電偶 溫度檢測(cè)儀。該儀表可以檢測(cè) 4 個(gè)測(cè)試點(diǎn)的溫度 ， 可 廣泛應(yīng)用于工業(yè)生產(chǎn)和人們?nèi)粘Ｉ钪小?該裝置不僅具有精度高、功耗低的優(yōu)點(diǎn)，還可以及時(shí)顯示，操作使用方便。 總體設(shè)計(jì) 采用 兩種方案。方案 一： 熱電偶在經(jīng)過多路的選擇之后 , 經(jīng) 冷端補(bǔ)償 和 放大處理，進(jìn)入 A/D 轉(zhuǎn)換器，經(jīng)過FPGA 芯片 處理并在 LED 上顯示 ；方案二：熱電偶輸出信號(hào)直接經(jīng)集成芯片 MAX6675處理，再經(jīng)過 FPGA 芯片在 LED 上顯示。軟件則分別在 MUXPLUSⅡ 和 QuartusⅡ環(huán)境下 用 VHDL 語言實(shí)現(xiàn)。 關(guān)鍵詞： 熱電偶 ； 溫度巡檢儀 ； FPGA； 內(nèi)蒙古科技大學(xué)畢業(yè)設(shè)計(jì)說明書 (畢業(yè)論文 ) II FPGAbased thermocouple temperature data logging devices design Abstract With the development of science and technology， The field of industrial control needs for realtime field data acquisition and control, for example, power plants, iron and steel plant, chemical industry production of large amounts of data, they also need to conduct onsite collection, and the temperature acquisition is an extremely important part of them. The topics needs the temperature of the technical requirements， I design a 4way Thermocouple Temperature Detector. The instrument can detect the four test points temperature， Can be widely used in industrial production and people39。s daily life. The device not only has high accuracy and the advantages of low power consumption, but also shows in time that the operation is easy to use. I use two types of programs to achieve. The first program: first of all, thermocouple is selected by multichannel selector, then the signal is passed by cold junction pensation and amplification processing, then it passed in A / D conversion, After it be processed by FPGA chip and displayed in the LED, finally. The second program: the signal, outputted by thermocouple, directly be passed into the MAX6675 IC， and processed by FPGA chip and displayed in the LED. The software function is in the MUXPLUS Ⅱ and Quartus Ⅱ environment with VHDL language. Key words: Thermocouple。 temperature data logging devices。 FPGA。 內(nèi)蒙古科技大學(xué)畢業(yè)設(shè)計(jì)說明書 (畢業(yè)論文 ) III 目 錄 摘要 ............................................................................................................................................. I Abstract.......................................................................................................................................II 第一章 引 言 ............................................................................................................................ 1 研究背景 .................................................................................................................... 1 溫度巡檢儀發(fā)展概況 ................................................................................................ 1 研究意義 .................................................................................................................... 1 第二章 EDA 技術(shù)介紹 ............................................................................................................. 3 電子設(shè)計(jì)自動(dòng)化 （ EDA） 技術(shù)概述 ........................................................................ 3 電子設(shè)計(jì)自動(dòng)化 （ EDA） 技術(shù) .................................................................... 3 可編程邏輯門陳列（ FPGA） ...................................................................... 4 EDA 設(shè)計(jì)流程 ........................................................................................................... 5 設(shè)計(jì)輸入 ........................................................................................................ 6 綜合 ................................................................................................................ 7 適配 ................................................................................................................ 7 時(shí)序仿真 ........................................................................................................ 7 編程下載 ........................................................................................................ 7 硬件測(cè)試 ........................................................................................................ 8 VHDL 硬件描述語言介紹 ........................................................................................... 8 第三章 溫度巡檢儀總體方案設(shè)計(jì) .......................................................................................... 9 基于單片機(jī)的溫度巡檢儀 ........................................................................................ 9 基于虛擬儀器的溫度巡檢儀 .................................................................................. 11 總體方案選擇與設(shè)計(jì) .............................................................................................. 11 第四章 總體設(shè)計(jì)方案介紹 .................................................................................................... 13 基于 LPM_ROM 的熱電偶溫度巡檢儀的設(shè)計(jì) .......................................................... 13 系統(tǒng)硬件設(shè)計(jì) .............................................................................................. 13 系統(tǒng)軟件設(shè)計(jì) .............................................................................................. 20 內(nèi)蒙古科技大學(xué)畢業(yè)設(shè)計(jì)說明書 (畢業(yè)論文 ) IV 基于 MAX6675 的熱電偶溫度巡檢儀設(shè)計(jì) .............................................................. 32 系統(tǒng)硬件設(shè)計(jì) .............................................................................................. 32 系統(tǒng)軟件設(shè)計(jì) .............................................................................................. 36 第六章 總結(jié) ............................................................................................................................ 39 參考文獻(xiàn) .................................................................................................................................. 40 附錄 A ...................................................................................................................................... 42 附錄 B..............................................