【正文】 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Slot,Socket,DIM,Heat sink)傾斜 128 DIP ponent Assembly workmanship criteriaTilt of constructive ponent ( slot , socket , Dim , Heat sink ) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Jumper Pins,Box Header)浮件 129 DIP ponent Assembly workmanship criteriaFloating of constructive ponent ( Jumper Pins , Box header ) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Jumper Pins,Box Header)傾斜 130 DIP ponent Assembly workmanship criteriaTilt of constructive ponent ( Jumper Pins , Box header ) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (CPU Socket)浮件與傾斜 131 DIP ponent Assembly workmanship criteriaTilt and floating of constructive ponent ( CPU Socket ) DIP零件組裝工藝標(biāo)準(zhǔn)－ 機(jī)構(gòu)零件 (USB,DSUB,PS/2,K/B general con. Jack)浮件與傾斜 132 DIP ponent Assembly workmanship criteriaTilt and floating of constructive ponent ( USB , Dsub , PS/2 , K/B general connector Jack ) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Power Connector)浮件與傾斜 133 DIP ponent Assembly workmanship criteriaTilt and floating of constructive ponent ( Power Connector ) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Jumper Pins,Box Header)組裝外觀 (1)134 DIP ponent Assembly workmanship criteriaWorkmanship (1) of constructive ponent(Jumper Pin,Box header) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (Jumper Pins,Box Header)組裝外觀 (2)135 DIP ponent Assembly workmanship criteriaWorkmanship(2) of constructive ponent(Jumper Pins,Box header) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (BIOS Socket)組裝外觀 (3） 136 DIP ponent Assembly workmanship criteriaWorkmanship (3) of constructive ponent ( BIOS Socket ) DIP零件組裝工藝標(biāo)準(zhǔn) 組裝零件腳折腳、未入孔 (1) 137 DIP ponent Assembly workmanship criteriaLead bend and noinside the hole (1) of assembley DIP零件組裝工藝標(biāo)準(zhǔn) 零件腳折腳、未入孔、未出孔 (2) 138 DIP ponent Assembly workmanship criteriaLead bend noinside nothrough (2) of the hole DIP零件組裝工藝標(biāo)準(zhǔn) 板彎、板翹、板扭 (平面度 ) 139 DIP ponent Assembly workmanship criteriaboard wrapage DIP零件組裝工藝標(biāo)準(zhǔn) 零件腳與線路間距 140 DIP ponent Assembly workmanship criteriathe space between lead to trace DIP零件組裝工藝標(biāo)準(zhǔn) 零件破損 (1) 141 DIP ponent Assembly workmanship criteriaponent broken (1) DIP零件組裝工藝標(biāo)準(zhǔn) 零件破損 (2) 142 DIP ponent Assembly workmanship criteriaponent broken (2) DIP零件組裝工藝標(biāo)準(zhǔn) 零件破損 (3) 143 DIP ponent Assembly workmanship criteriaponent broken (3) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (USB)偏移率 144 DIP ponent Assembly workmanship criteriaShifted rate of constructive ponent ( USB connector) DIP零件組裝工藝標(biāo)準(zhǔn) 機(jī)構(gòu)零件 (DC Jack)對(duì)準(zhǔn)度 145 DIP ponent Assembly workmanship criteriaShifted rate of constructive ponent ( DC_In connector) DIP焊錫性工藝標(biāo)準(zhǔn) 零件面孔填錫與切面焊錫性標(biāo)準(zhǔn) (1) 146 DIP soldering workmanship the solder fillet in the PTH by crosssection (1) DIP焊錫性工藝標(biāo)準(zhǔn) 零件面孔填錫與切面焊錫性標(biāo)準(zhǔn) (2) 147 DIP soldering workmanship the solder fillet in the PTH by crosssection (2) DIP焊錫性工藝標(biāo)準(zhǔn) 焊錫面焊錫性標(biāo)準(zhǔn) (1) 148 DIP soldering workmanship soldering standard on solder side (1) DIP焊錫性工藝標(biāo)準(zhǔn) 焊錫面焊錫性標(biāo)準(zhǔn) (2) 149 DIP soldering workmanship soldering standard on solder side (2) DIP焊錫性工藝標(biāo)準(zhǔn) 焊錫面焊錫性標(biāo)準(zhǔn) (3) 150 DIP soldering workmanship soldering standard on solder side (3) DIP焊錫性工藝標(biāo)準(zhǔn) DIP插件孔焊錫性檢驗(yàn)圖示 151 DIP soldering workmanship Figure of PTH solder fillet evaluation DIP焊錫性工藝標(biāo)準(zhǔn) 焊錫性問(wèn)題 (錫橋、短路、錫裂 ) 152 DIP soldering workmanship soldering issue ( Bridge , short , crack ) DIP焊錫性工藝標(biāo)準(zhǔn) 焊錫性問(wèn)題 (空焊、錫珠、錫渣、錫尖 ) 153 DIP soldering workmanship soldering issue ( missing solder , solder ball , solder dross , solder peak ) 金手指工藝標(biāo)準(zhǔn) 沾錫、沾漆、沾膠、刮傷翹起 154 Gold finger workmanship 12 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E PCBA 半成品握持方法 :PCBA WIP product handling 理想狀況（ Target Condition）： 配帶乾淨(jìng)手套與配合良好靜電防護(hù)措施。 Handling with clean gloves and full ESD protection 允收狀況（ Accept Condition）： 配帶良好靜電防護(hù)措施，握持 PCB板邊或板角執(zhí)行檢驗(yàn)。 Handling with clean hands by board edges using full ESD protection 拒收狀況（ Reject Condition）： 未有任何靜電防護(hù)措施，並直接接觸及導(dǎo)體、金手指與錫點(diǎn)表面 (MA)。 Handling with bare hands touching conductors , solder connections and gold finger , No ESD protection implemented 13 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT零件組裝工藝標(biāo)準(zhǔn) 晶片狀 (Chip)零件之對(duì)準(zhǔn)度 (組件 X方向 ) SMD Assembly workmanship criteriaChip ponent alignment( X Axis) 1. 晶片狀零件恰能座落在焊 墊的中央且未發(fā)生偏出， 所有各金屬封頭都能完全 與焊墊接觸。 is centered on both sides of the land . All the solder terminations shall pletely touch pad. ，但 尚未大於其零件寬度的 50% 。 (X≦ 1/2W) ponent shifted off the pad and shift length shall less 1/2 chip width ，大 於零件寬度的 50%(MI)。 (X1/2W) ponent shifted off the pad and shift length over 1/2 chip with 允收狀況 (Accept Condition) X≦ 1/2W X≦ 1/2W X1/2W X1/2W 註 :此標(biāo)準(zhǔn)適用於三面或五面 之晶片狀零件 This standard only be used for 3 or 5 face terminations chip ponent w w 330 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號(hào)：附件一 日期： ,2023 版本： E 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) 的中央且未發(fā)生偏出，所有 各金屬封頭都能完全與焊墊 接觸。 is centered on both sides of the land . All the solder terminations shall pletely touch pad. ，但零件端電 極仍蓋住焊墊為其零件寬度 的 25%以上。 (Y1 ≧ 1/4W) Component is shifted towards longest part of the chip , but the termiuad end of chip still on the land to form. ，但零件端 電極蓋住焊墊小於其零件 寬度的 25%。 (Y1＜ 1/4W) Y1＜ 1/4W is rejected . 允收狀況 (Accept Condition) W W 330 Y1 ≧ 1/4W Y1 ＜ 1/4W SMT零件組裝工藝標(biāo)準(zhǔn) 晶片狀 (Chip)零件之對(duì)準(zhǔn)度 (組件 Y方向 ) SMD Assembly workmanship criteriaChip ponent alignment( Y Axis) 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workm