倒裝焊與芯片級封裝技術(shù)的研究(已修改)
2025-01-08 22:40 本頁面
【正文】 倒裝焊與晶片級封裝技術(shù)的研究 Why Flip Chip? ? Better manufacturing yield than wirebond for high pincount chips. 對于高密度引腳芯片，成品率優(yōu)于絲鍵合。 ? Faster manufacturing throughput than wirebond for high pincount chips. 對于高密度引腳芯片，生產(chǎn)效率高于絲鍵合。 ? More reliability than wirebonded chips. 可靠性優(yōu)于絲鍵合封裝芯片。 ? Better electrical characteristics (less inductance) for highspeed chips. A must for RF, optoelectronics, highspeed digital (500MHz). 對于高速芯片，具有良好的電學(xué)性能。 More on Why Flip Chip? ? Desirable for highperformance Ball Grid Array (BGA) package. 高性能球形焊點(diǎn)陣列封裝需要倒裝焊 。 ? Desirable for Chip Size Package (CSP). 芯片尺寸封裝技術(shù)需要倒裝焊。 ? The Flipchip bonded wafer market is predicted to grow 37% annually while the overall IC units will only grow 8%. 倒裝焊晶片市場預(yù)計年增長 37%，而整體 IC增長僅 8%。 ? The Flipchip bonded wafer is expected to increase from million (2023) to million (2023) wafers. 倒裝焊晶片預(yù)計由三百四十萬片 (2023年 )增長至二千六百二十萬
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