【正文】 WLAN 中交換內(nèi)存和總線接口的設(shè)計(jì)摘要：嵌入式系統(tǒng)（Embedded System）被定義為：以應(yīng)用為中心、以計(jì)算機(jī)技術(shù)為基礎(chǔ)、軟件硬件可裁剪、適應(yīng)應(yīng)用系統(tǒng)對功能、可靠性、成本、體 積、功耗嚴(yán)格要求的專用計(jì)算機(jī)系統(tǒng)。嵌入式系統(tǒng)是將先進(jìn)的計(jì)算機(jī)技術(shù)、半 導(dǎo)體技術(shù)和電子技術(shù) 和各個(gè)行業(yè)的具體應(yīng)用相結(jié)合后的產(chǎn)物。隨著 EDI（Electronic Data Interchange）的推廣和 VLSI(Very Large Scale Integration)設(shè)計(jì)的普及化，及半導(dǎo)體工藝 的迅速發(fā)展，在一個(gè)硅片上 實(shí)現(xiàn) 一個(gè)更為復(fù)雜的系統(tǒng)的時(shí)代已來臨， 這就是 System On Chip(SOC)。各種通用處理器內(nèi)核將作為 SOC 設(shè)計(jì)公司的標(biāo)準(zhǔn)庫，和許多其它嵌入式系統(tǒng)外設(shè)一樣，成 為 VLSI 設(shè)計(jì)中一種標(biāo)準(zhǔn)的器件，用標(biāo)準(zhǔn)的 VHDL 等語言描述，存儲(chǔ)在器件庫中。用戶只需定義出其整個(gè)應(yīng)用系統(tǒng) ，仿真通過后就可以將設(shè)計(jì)圖交給半導(dǎo)體工廠制作樣品。在嵌入式系統(tǒng)（Embedded System）的設(shè)計(jì)中， 外設(shè)都必須通過數(shù)據(jù)和地址總線和微處理器連接，SOC（systemonchip ，片上系 統(tǒng)）的復(fù)雜性要求各個(gè)宏模塊（MACRO）的連接（Interface）規(guī)范化。 同時(shí)為了沒有沖突的共享各自的信息， 常常會(huì)開辟一個(gè)公共的存儲(chǔ)空間（Exchange Memory）.本文主要介紹了 (Wireless Local Area Network)芯片中總線接口（Bus Interface）和公共存 儲(chǔ)器(Exchange Memory)的設(shè)計(jì).第一章簡要介紹了嵌入式系統(tǒng)和 WLAN , 提供了一定的背景并給出了系統(tǒng)的總框架。第二章重點(diǎn)介紹了 MicroBlaze Embedded System 中使用的 OPB Bus 技術(shù)， 為 Bus Interface 的設(shè)計(jì) 提供規(guī)則和方向第三章介紹 Exchange Memory 的設(shè)計(jì)， 基于雙口 RAM， 實(shí)行 itom Bus 的仲裁機(jī)制第四章介紹 Bus Interface 的設(shè)計(jì)，主要就是根據(jù) OPB Bus 設(shè)計(jì)和 Itom Bus 的接口互聯(lián)。統(tǒng)一編址使軟硬件高速方便的結(jié)合。雖然這里很詳細(xì)的描述了適用于 的兩個(gè)模塊的設(shè)計(jì)， 但是整個(gè)設(shè)計(jì)思路和方法通用于各種 SOC 的 Bus Interface 和 Exchange Memory。關(guān)鍵詞：Exchange Memory，Itom Bus，MicroBlaze Embedded System ，OPB Bus，Bus Interface。Exchange Memory amp。 Bus Interface for WLAN ABSTRACT:Embedded System is dedicated puter applicationcentered, technologybased in contrast to generalpurpose puter in everyday life. With the spread of EDI (Electronic Data Interchange) and the popularization of VLSI (Very Large Scale Integration) Design, the rapid development of Semiconductor Technology brings along the era of SOC (System on Chip).In an embedded system design, the peripherals (for example, timers, DMA, interrupt controller, custom applications, etc.) must be connected to the microprocessor using the data and address buses. The plexity of systemonchip (SOC) devices makes standardizing the connection of different macro cells one of the top priorities in defining an embedded system. At the same time, in order to share information without conflicts, a specific area is set aside as Exchange Memory.This thesis concentrates on the design of Exchange Memory and Bus Interface for the WLAN (Wireless Local Area Network) .Chapter 1 is to provide the necessary backgrounds such as Embedded System and WLAN , the whole architecture is presented in the end with emphasis on my job.Chapter 2 introduces the IBM’s OPB (Onchip Peripheral Bus) Technology used within Xilinx’s MicroBlaze Embedded System, as principles and guidelines for later design.Chapter 3 elaborates on Exchange Memory Design, which is based on Dual RAM architecture and relies on ITOM BUS to arbitrate for access of memory.Chapter 4 elaborates on Bus Interface Design, which is mainly to connect OPB with Itom bus. Unified addressing is the spot light for fast and easy cooperation between softwares and hardwares.Although the two modules are designed for , the overall idea and method is applicable for most if not all Exchange Memory and Bus Interface in SOC.INDEX:Exchange Memory，Itom Bus，MicroBlaze Embedded System ，OPB Bus，Bus Interface.CONTENTS目錄摘 要(ABSTRACT) ........................................................................................................................................ 1 目 錄(CONTENTS) ........................................................................................................................................ 3 第一章 概述和背景 ........................................................................................................................................ 5 嵌入式系統(tǒng)和 SOC........................................................................................................................... 5 概念 ............................................................................................................................................. 5 SOC 設(shè)計(jì)趨勢 ............................................................................................................................ 5 ................................................................................................................................... 6 IEEE 協(xié)議 ....................................................................................................................... 6 技術(shù)特點(diǎn) ..................................................................................................................................... 6 介質(zhì)訪問控制器 .............................................................................................................................. 7 框圖 ............................................................................................................................................. 7 我的工作 ..................................................................................................................................... 8 第二章 OPB 總線技術(shù) ................................................................................................................................... 9 XILINX’S MICROBLAZE EMBEDDED SYSTEM ................................................................................ 9 MicroBlaze 軟核 ........................................................................................................................ 9 總線互聯(lián) ...................................................................................................................................... 9 OPB 外設(shè) ..................................................................................................................................... 9 IBM’S O