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計(jì)算機(jī)縮寫術(shù)語(yǔ)完全介紹寶典-文庫(kù)吧

2025-07-15 04:28 本頁(yè)面


【正文】 MPS(MultiProcessor Specification,多重處理器規(guī)范) MSRs(ModelSpecific Registers,特別模塊寄存器) MSV(Multiprocessor Specification Version,多處理器規(guī)范版本) NAOC(noaccount OverClock,無效超頻) NI(Non-Intel,非英特爾) NOP(no operation,非操作指令) NRE(NonRecurring Engineering charge,非重複性工程費(fèi)用) OBGA(Organic Ball Grid Arral,有機(jī)球狀網(wǎng)陣排列) OCPL(Off Center Parting Line,遠(yuǎn)離中心部分線隊(duì)列) OLGA(Organic Land Grid Array,有機(jī)平面網(wǎng)陣包裝) OoO(Out of Order,亂序執(zhí)行) OPC(Optical Proximity Correction,光學(xué)臨近修正) OPGA(Organic Pin Grid Array,有機(jī)塑料針型柵格陣列) OPN(Ordering Part Number,分類零件號(hào)碼) PAT(Performance Acceleration Technology,性能加速技術(shù)) PBGA(Plastic Pin Ball Grid Array,塑膠球狀網(wǎng)陣排列) PDIP (Plastic DualInLine,塑料雙重直線) PDP(Parallel Data Processing,并行數(shù)據(jù)處理) PGA(PinGrid Array,引腳網(wǎng)格陣列),耗電大 PLCC (Plastic Leaded Chip Carriers,塑料行間芯片運(yùn)載) PostRISC(加速RISC,或后RISC) PR(Performance Rate,性能比率) PIB(Processor In a Box,盒裝處理器) PM(PseudoMultithreading,假多線程) PPGA(Plastic Pin Grid Array,塑膠針狀網(wǎng)陣封裝) PQFP(Plastic Quad Flat Package,塑料方塊平面封裝) PSN(Processor Serial numbers,處理器序列號(hào)) QFP(Quad Flat Package,方塊平面封裝) QSPS(Quick Start Power State,快速啟動(dòng)能源狀態(tài)) RAS(Return Address Stack,返回地址堆棧) RAW(Read after Write,寫后讀) REE(Rapid Execution Engine,快速執(zhí)行引擎) Register Contention(搶占寄存器) Register Pressure(寄存器不足) Register Renaming(寄存器重命名) Remark(芯片頻率重標(biāo)識(shí)) Resource contention(資源沖突) Retirement(指令引退) RISC(Reduced Instruction Set Computing,精簡(jiǎn)指令集計(jì)算機(jī)) ROB(ReOrder Buffer,重排序緩沖區(qū)) RSE(register stack engine,寄存器堆棧引擎) RTL(Register Transfer Level,暫存器轉(zhuǎn)換層。硬體描述語(yǔ)言的一種描述層次) SC242(242contact slot connector,242腳金手指插槽連接器) SE(Special Embedded,特別嵌入式) SEC(Single Edge Connector,單邊連接器) SECC(Single Edge Contact Cartridge,單邊接觸卡盒) SEPP(Single Edge Processor Package,單邊處理器封裝) Shallowtrench isolation(淺槽隔離) SIMD(Single Instruction Multiple Data,單指令多數(shù)據(jù)流) SiO2F(Fluorided Silicon Oxide,二氧氟化硅) SMI(System Management Interrupt,系統(tǒng)管理中斷) SMM(System Management Mode,系統(tǒng)管理模式) SMP(Symmetric MultiProcessing,對(duì)稱式多重處理架構(gòu)) SMT(Simultaneous multithreading,同步多線程) SOI(Silicononinsulator,絕緣體硅片) SOIC (Plastic Small Outline,塑料小型) SONC(System on a chip,系統(tǒng)集成芯片) SPGA(Staggered Pin Grid Array、交錯(cuò)式針狀網(wǎng)陣封裝) SPEC(System Performance Evaluation Corporation,系統(tǒng)性能評(píng)估測(cè)試) SQRT(Square Root Calculations,平方根計(jì)算) SRQ(System Request Queue,系統(tǒng)請(qǐng)求隊(duì)列) SSE(Streaming SIMD Extensions,單一指令多數(shù)據(jù)流擴(kuò)展) SFF(Small Form Factor,更小外形格局) SS(Special Sizing,特殊縮放) SSP(Slipstream processing,滑流處理) SST(Special Sizing Techniques,特殊篩分技術(shù)) SSOP (Shrink Plastic Small Outline,縮短塑料小型) STC(Space Time Computing,空余時(shí)間計(jì)算) Superscalar(超標(biāo)量體系結(jié)構(gòu)) TAP(Test Access Port,測(cè)試存取端口) TBGA(Tie Ball Grid Array,帶狀球形光柵陣列) TCP: Tape Carrier Package(薄膜封裝),發(fā)熱小 TDP(Thermal Design Power,熱量設(shè)計(jì)功率) Throughput(吞吐量) TLB(Translate Look side Buffers,轉(zhuǎn)換旁視緩沖器) TLP(ThreadLevel Parallelism,線程級(jí)并行) TMP(Threaded MultiPath,線程多通道) TPI(True Performance Initiative/index,真實(shí)性能為先/指標(biāo)) TQFP (Thin Plastic Quad Flat Pack,薄型方面平面封裝) Trc(Row Cycle Time,列循環(huán)時(shí)間) TrD(Transistor Density,晶體管密度) TSOP(Thin Small Outline Plastic,薄型小型塑料) USWC(Uncacheabled Speculative Write Combination,無緩沖隨機(jī)聯(lián)合寫操作) VALU(Vector Arithmetic Logic Unit,向量算術(shù)邏輯單元) VFSD(Vertex Frequency Stream Divider,頂點(diǎn)頻率流分隔) VID(VID:Voltage identify,電壓鑒別號(hào)碼) VLIW(Very Long Instruction Word,超長(zhǎng)指令字) VPU(Vector Permutate Unit,向量排列單元) VPU(vector processing units,向量處理單元,即處理MMX、SSE等SIMD指令的地方) VSA(Virtual System Architecture,虛擬系統(tǒng)架構(gòu)) VTF(VIA Technical Forum,威盛技術(shù)論壇) XBar(Crossbar,交叉口閂仲載邏輯單元) XP(Experience,體驗(yàn)) XP(Extra performance,額外性能) XP(eXtreme Performance,極速性能) 散熱器 TFT(Tiny Fin Technology,微型鰭片技術(shù)) 主板 3GIO(Third Generation Input/Output,第三代輸入輸出技術(shù)) ACR(Advanced Communications Riser,高級(jí)通訊升級(jí)卡) ADIMM(advanced Dual Inline Memory Modules,高級(jí)雙重內(nèi)嵌式內(nèi)存模塊) AGTL+(Assisted Gunning Transceiver Logic,援助發(fā)射接收邏輯電路) AIMM(AGP Inline Memory Module,AGP板上內(nèi)存升級(jí)模塊) AMR(Audio/Modem Riser;音效/調(diào)制解調(diào)器主機(jī)板附加直立插卡) AHA(Accelerated Hub Architecture,加速中心架構(gòu)) AOI(Automatic Optical Inspection,自動(dòng)光學(xué)檢驗(yàn)) APU(Audio Processing Unit,音頻處理單元) ARF(Asynchronous Receive FIFO,異步接收先入先出) ASF(Alert Standards Forum,警告標(biāo)準(zhǔn)討論) ASK IR(Amplitude Shift Keyed InfraRed,長(zhǎng)波形可移動(dòng)輸入紅外線) AT(Advanced Technology,先進(jìn)技術(shù)) ATX(AT Extend,擴(kuò)展型AT) BIOS(Basic Input/Output System,基本輸入/輸出系統(tǒng)) CNR(Communication and Networking Riser,通訊和網(wǎng)絡(luò)升級(jí)卡) CSA(Communication Streaming Architecture,通訊流架構(gòu)) CSE(Configuration Space Enable,可分配空間) COAST(Cacheonastick,條狀緩存) DASP(Dynamic Adaptive Speculative PreProcessor,動(dòng)態(tài)適應(yīng)預(yù)測(cè)預(yù)處理器) DB: Device Bay,設(shè)備插架 DMI(Desktop Management Interface,桌面管理接口) DOT(Dynamic Overclocking Technonlogy,動(dòng)態(tài)超頻技術(shù)) DPP(direct print Protocol,直接打印協(xié)議 DRCG(Direct Rambus clock generator,直接RAMBUS時(shí)鐘發(fā)生器) DVMT(Dynamic Video Memory Technology,動(dòng)態(tài)視頻內(nèi)存技術(shù)) E(Economy,經(jīng)濟(jì),或Entrylevel,入門級(jí)) EB(Expansion Bus,擴(kuò)展總線) EFI(Extensible Firmware Interface,擴(kuò)展固件接口) EHCI(Enhanced Host Controller Interface,加強(qiáng)型主機(jī)端控制接口) EISA(Enhanced Industry Standard Architecture,增強(qiáng)形工業(yè)標(biāo)準(zhǔn)架構(gòu)) EMI(Electromagnetic Interference,電磁干擾) ESCD(Extended System Configuration Data,可擴(kuò)展系統(tǒng)配置數(shù)據(jù)) ESR(Equivalent Series Resistance,等價(jià)系列電阻) FBC(Frame Buffer Cache,幀緩沖緩存) FireWire(火線,即IEEE1394標(biāo)準(zhǔn)) FlexATX(Flexibility ATX,可擴(kuò)展性ATX) FSB(Front Side Bus,前端總線) FWH(Firmware Hub,固件中心) GB(Garibaldi架構(gòu),Garibaldi基于ATX架構(gòu),但是也能夠使用WTX構(gòu)架的機(jī)箱) GMCH(Graphics amp。 Memory Controller Hub,圖形和內(nèi)存控制中心) GPA(Graphics Performance Accelerator,圖形性能加速卡) GPIs(General Purpose Inputs,普通操作輸入) GTL+(Gunning Transceiver Logic,發(fā)射接收邏輯電路) HDIT(High Bandwidth Differential Interconnect Technology,高帶寬微分互連技術(shù)) HSLB(High Speed Link Bus,高速鏈路總線) HT(HyperTransport,超級(jí)傳輸) I2C(InterIC) I2C(InterIntegrated Circuit,內(nèi)置集成電路) IBASES(Intel Baseline AGP System Evaluation Suite,英特爾基線AGP系統(tǒng)評(píng)估套件) IC(integrate circuit,集成電路) ICH(Input/Output Controller Hub,輸入/輸出控制中心) ICHS(ICHHance Rapids,ICH高速型) ICP(Integrated Communications Processor,整合型通訊處理器) IHA(Intel Hub Architecture,英特爾Hub架構(gòu)) IMB(Inter Module Bus,隱藏模塊總線) INTIN(Interrupt Inputs,中斷輸入) IPMAT(Intel Power Management An
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