smt錫膏印刷培訓(已改無錯字)
2023-03-24 03:55:29 本頁面
【正文】 20 Technology Paste Print Defect: Misalignment/錫膏印刷缺陷：偏位 21 2023/3/24 21 Technology Tailing/錫膏拉尖 Acceptable/可接受 (Solder smear or slump 10%) 錫量減少 10% Reject/拒收 (Solder smear or slump 10%) 錫量減少 10% Solder Paste Print Quality/錫膏印刷質(zhì)量 22 2023/3/24 22 Technology Paste Clogging錫膏堵塞 Acceptable/可接受 (paste deposit 90%) 焊盤錫量超過 90% Reject/拒收 (paste deposit 90%) 焊盤錫量超過 90% Solder Paste Print Quality /錫膏印刷質(zhì)量 23 2023/3/24 23 Technology Smearing and Slumping/錫膏塌陷 Acceptable/可接受 (Solder smear or slump 10%) 塌陷小于 10% Reject/拒收 (Solder smear or slump 10%) 塌陷大于 10% Solder Paste Print Quality 24 2023/3/24 24 Technology Major contributor to defects/缺陷的主要分布 C o m p o n e n tPl a c e m e n t15%R e fl o ws o l d e r a n dC l e a n i n g1 5 . 2 %So l d e r Pa s teSc r e e n i n g6 3 . 8 %I n c o m i n gC o m p o n e n t5 . 7 %Source: MPM’s A user’s guide to more Precise SMT printing 25 2023/3/24 25 Technology Hardware/硬件 Software/軟件 Environment/環(huán)境 Squeegees/刮刀 Print Speed/印刷速度 Temperature/溫度 Paste/錫膏 Humidity/濕度 Stencil/鋼網(wǎng) Pressure/壓力 Tooling/surport pin Print Gap/印刷間隙 Board/印刷線路板 Separation Speed/分離速度 Factors Affecting the Print/影響印刷的因素 26 2023/3/24 26 Technology Squeegee/刮刀 27 2023/3/24 27 Technology Squeegee
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