20xx年高級硬件工程師英文簡歷表格-閱讀頁
2025-03-09 22:26本頁面
【正文】 TTDChina department, I cowork with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one 。amp。amp。amp。amp。PresentAssembly NPI (New Product Introduction)Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify : I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the 。amp。39。2020/05Optimization the current Test Process Order for Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by : Being the Project leader, I take the main responsibility, such as, design, plan, organize and 。2020/01Nanyang University of Science amp。 Technology Microelectronics DoctorateI worked in Nan yang University of Science amp。 Technology as a Research Fellow. I major at Gate oxide Reliability research in the 。amp。2020/03Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate2020/09。amp。39。2020/07Nanjing University of Science amp。 Technology Material Science and Engineering Bachelor2020/07
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