【正文】 Placement Module Training Intel Confidential ( for internal usage only) No. Process Step Purpose1 Board TransportIn Transport board into machine for part placement2 Board Positioning Hold board firmly in position3 Fiducial Scanning Identify actual board location4 Part InPosition Part is ready in pickup position5 Part Pickup Pick up part6 Part Recognition Recognize the pickup part7 Part Alignment Align part placement if offseted/skewed8 Part Placement Place part on board9 Board TransportOut Transport board out of machine after part placementstep1 Step 3 CH0 Slide21Placement Module Training Intel Confidential ( for internal usage only) Step 5 Step 8Simulation CH0 Slide22Placement Module Training Intel Confidential ( for internal usage only) l 0402 or 0201 technology for smaller ponent that can contribute to higher tombstone/missing ponent. l Placement accuracy ball recognition capability for fine pitch ponentsl Thinner and smaller boards . Ex: Small form factorl Odd form or shape ponentl New packaging for I/O device such BGA , chip scale package (CSP) and flip chip CH0 Slide23Placement Module Training Intel Confidential ( for internal usage only) Chapter 1 Quiz1) Where is the placement module located after in the SMT process flow?167。 Backlight167。 (3) Massively Parallel System216。 (2) Traditional GantryStyle Pick Place216。 (1) Traditional Turret System216。 Tube167。 Tape Reel167。 Fine Pitch Placer216。 Chip Shooter216。 Glossary CH0 SlidePlacement Module Training Intel Confidential ( for internal usage only) Placement ModuleChapter 1 CH0 Slide6Placement Module Training Intel Confidential ( for internal usage only) Placement Course Description OBJECTIVES: Upon pletion of this topic, the participant will be able to do the following:? Describe placement module functionality and features? Define different types of placement equipments available ? Describe the placement main systems167。Identify mon failure modes for placement module ? Describe how to solve placement issues167。Define the impact of the major parameter167。 Ch 4: Critical to Function Parameter (CTFP) [20 min] 216。 Ch 1: Placement Module Overview [30 min] ? Describe placement module functionality and features? Define different types of placement equipments available ? Describe the placement main systems167。 CH0 SlidePlacement Module Training Intel Confidential ( for internal usage only) Placement ModuleCourse descriptionCourse code PNG021935 CH0 SlidePlacement Module Training Intel Confidential ( for internal usage only) Placement ModuleCourse descriptionTarget audience : CME or CQE that will engage customer issues CH0 Slide3Placement Module Training Intel Confidential ( for internal usage only) Placement Course Description167。 Ch0: Course Description [5 min]167。 Understand the placement module future key challenges? Ch 2: SPEC OVERVIEW[15 min] ? Find the appropriate spec for the placement module.? Navigate through the spec and use it as a reference document.? Educate how to understand Intel process and applied the knowledge when dealing with customers.? Ch3: Process Control System[20 min]? Understand what is Process Control System? Identify process control system used by placement module owner CH0 Slide4Placement Module Training Intel Confidential ( for internal usage only) Placement Course Description167。Identify major parameter used for the placement module216。 Ch 5: Response Flow Check list (RFC) Common Failure modes [15 min] 216。 Ch 6 : CASE STUDY ON SJR [15 min]? To have basic understanding on BGA SJR in terms of failure modes and potential root causes.? To develop CQE petency in providing some solutions or prelim data collection on BGA SJR related issues.167。 Understand the placement module future key challengesIntel Malaysia Technical Training website CH0 Slide7Placement Module Training Intel Confidential ( for internal usage only) l To pick place Surface Mount Technology (SMT) ponents accurately at predefined location on Printed Circuit Board (PCB) surface in the automated programmable sequencesNozzle CH0 Slide8Placement Module Training Intel Confidential ( for internal usage only) l 2 types of Placement equipments in general:167。 For small inexpensive ponent placement with high speed167。 For fine pitch QFP BGA ponent placement with medium to high speedNo. Comparison Items Chip Shooter Fine Pitch Placer1 Component Size Small = Medium Medium = Large2 Component Type Discreet passive, SOT, SOICFine pitch QFP, BGA, CSP3 Placement Speed Fast Medium4 Accuracy Medium (+/ / 4mils)High (+/ / 1mils) CH0 Slide9Placement Module Training Intel Confidential ( for internal usage only) Universal GSM Phillips TopazFuji CP7SanyoPanasonic MSFChip Shooter Fine Pitch PlacerPanasonic MSRPanasonic MPAGJuki KE2060 Universal HSPFuji XP Fuji QPFuji XPPhillips Assembleon FCMPhillips Assembleon ACMSiemens HS CH0 Slide10Placement Module Training Intel Confidential ( for internal usage only) Turret Head Part SupplyNozzle CameraTape ReelFeederNozzle Head Tray CH0 Slide11Placement Module Training Intel Confidential ( for internal usage only) CHIPResistorCHIPCapacitorSOICSmall Outline Integrated CircuitQFPQuad Flat Pack Rectangular TSOP Type IIThin Small Outline PackageDRAMSmall Outline J Leaded CH0 Slide12Placement Module Training Intel Confidential ( for internal usage only) l Simple, Easy to Use l Consistent Sample Handling l Low Cost l Reliable l Competitive Advantage l Greater Throughput l Increased Productivity l Small Footprint CH0 Slide13Placement Module Training Intel Confidential ( for internal usage only) lLocated after the solder paste module in SMT processPlace ComponentFinal AssemblyScreen Print Solder PasteReflow SolderWave