【正文】 E. (按NEXT馬上開(kāi)始在本位置偵測(cè)鋼板高度)Press SELECT or NEXT to Continue. (按SELECT 或 NEXT繼續(xù))你按SELECT之後，出現(xiàn)下列訊息及視窗：JOG ACTIVE…SQUEEGEE STROKE Press EXIT to quit.JOG ACTIVE…(移動(dòng)現(xiàn)在刮刀行程位置)SQUEEGEE STROKE Press EXIT to quit. (按EXIT離開(kāi))你按NEXT與EXIT之後，出現(xiàn)下列訊息及視窗：Locating the board…CAUTION：Auto height sensor in progress. Please wait… (開(kāi)始載入PCB,自動(dòng)偵測(cè)鋼板高度)Stencil height FOUND.Press NEXT to Continue.Stencil height FOUND. (完成偵測(cè)鋼板高度)Press NEXT to Continue. (按NEXT繼續(xù)下一步驟)Squeegee Hardware Required: Squeegee Blades , Stencil , TactileThis Utility will set the SQUEEGEE height.Press NEXT to Continue, or EXIT to quit.This Utility will set the SQUEEGEE height.(使用測(cè)刮刀高度)Press NEXT to Continue, or EXIT to quit. (按NEXT繼續(xù), 按EXIT離開(kāi))按NEXT之後，出現(xiàn)下列訊息視窗：Please install a stencil now.The REAME CLAMPS will activate when you press NEXT.Press NEXT to Continue, or EXIT to quit.Please install a stencil now. (現(xiàn)在請(qǐng)放入鋼板)The REAME CLAMPS will activate when(按NEXT之後,啟動(dòng)鋼板固定夾)you press NEXT. Press NEXT to Continue, or EXIT to quit. (按NEXT繼續(xù), 按EXIT離開(kāi))按NEXT之後，出現(xiàn)下列訊息視窗：You must now install the squeegee blade.Press NEXT to Continue, or EXIT to quit.You must now install the squeegee blade. (你現(xiàn)在必須安裝刮刀)Press NEXT to Continue, or EXIT to quit. (按NEXT繼續(xù), 按EXIT離開(kāi))按NEXT之後，出現(xiàn)下列訊息視窗：CAUTION, The machine is now going toMove the Z TOWER and cyclethe SQUEEGEE UP and DOWN.Press NEXT to Continue, or EXIT to Quit. CAUTION, The machine is now going to(注意,機(jī)器的Z軸和刮刀上下將Move the Z TOWER and cycle會(huì)移動(dòng))the SQUEEGEE UP and DOWN.Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開(kāi))按NEXT之後，出現(xiàn)下列訊息視窗：Press SELECT to find Stencil Heightor NEXT to Bypass.Press NEXT to Continue, or EXIT to Quit. Press SELECT to find Stencil Height(按SELECT之後,再測(cè)一次鋼板高度or NEXT to Bypass. 按NEXT之後,不測(cè)鋼板高度)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開(kāi))按NEXT之後，出現(xiàn)下列訊息視窗：Press SELECT to JOG the sensor clear ofpaste or stencil aperturesor press NEXT to CONTINUE.Press SELECT or NEXT to Continue. Press SELECT to JOG the sensor clear of(按SELECT移動(dòng)偵測(cè)感應(yīng)器,勿paste or stencil apertures碰到鋼板上錫膏及鋼板上PAD孔)or press NEXT to CONTINUE. (按NEXT馬上開(kāi)始在本位置偵測(cè)刮刀高度)Press SELECT or NEXT to Continue. (按SELECT 或 NEXT繼續(xù))你按SELECT之後，出現(xiàn)下列訊息及視窗：JOG ACTIVE…SQUEEGEE STROKEPress EXIT to quit.JOG ACTIVE…(移動(dòng)現(xiàn)在刮刀行程位置)SQUEEGEE STROKE Press EXIT to quit. (按EXIT離開(kāi))你按NEXT與EXIT之後，出現(xiàn)下列訊息及視窗並開(kāi)始測(cè)前後刮刀高度：Leveling front blade.Leveling rear blade.CAUTION：Auto height sensor in progress. Please wait… (開(kāi)始偵測(cè)刮刀高度。使用游標(biāo)卡尺測(cè)量。TeachTeach BoardTeach VisionDevice LayoutTeach IDTeach Custom BGATeach Offset MovesTeach Vision OffsetTeach Board做一片PCB板新程式Teach Vision做一片PCB新程式的Mark點(diǎn)Device Layout做2D檢查時(shí),所要檢查零件Teach ID做辨識(shí)鋼板身分Teach Custom BGA編輯自行設(shè)計(jì)的BGA零件檔案Teach Offset Moves設(shè)定”印刷前的焊墊”與” 印刷後的焊墊”位置修正值Teach Vision Offset設(shè)定”視覺(jué)系統(tǒng)” 位置修正值 Board重做新程式About to begin TEACH operation(開(kāi)始設(shè)定操作)Press SELECT to teach a new board or(按SELECT,設(shè)定新基板)Press NEXT to continue on this board setup (按NEXT,繼續(xù)這基板的設(shè)定)按SELECT之後，出現(xiàn)下列訊息視窗：CAUTION, The machine must move toTEACH POSITION before teach can beginThe machine is now going to move.Press NEXT to Continue, or EXIT to Quit.CAUTION, The machine must move to(警告,設(shè)定開(kāi)始前,機(jī)器必須移動(dòng)到TEACH POSITION before teach can begin”設(shè)定位置”)The machine is now going to move. (機(jī)器即將移動(dòng))Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開(kāi)) 選擇Board Parameters 進(jìn)入PCB參數(shù)設(shè)定Board Parameters Hardware Required: Board Board Parameters基板(PCB)參數(shù)設(shè)定X size (PCB)基板X(qián)軸方向長(zhǎng)度Y size (PCB)基板Y軸方向?qū)挾萒hickness (PCB)基板厚度PCB板Y XEnter Board Dimensions into setup menu.Click on Y size to adjust Track Width.Press Done when finished.Enter Board Dimensions into setup menu. (輸入基板X(qián)、Y、厚度)Click on Y size to adjust Track Width. (點(diǎn)取Y方向尺寸，可調(diào)整軌道寬度)Press Done when finished. (當(dāng)你做完上述之步驟，按Done)點(diǎn)取X size，輸入基板寬度X size，按EXIT完成輸入，單位mm。Trackball軌跡球:1. 移動(dòng)螢?zāi)簧系闹笜?biāo)↖2. 移動(dòng)各軸3. 數(shù)入數(shù)字、參數(shù)等等…..SELECT按鈕:在指標(biāo)所在的地方,按了SELECT按鈕,即是啟動(dòng)操作、功能、或子功能、或輸入狀態(tài)NEXT按鈕: 按了NEXT按鈕,表示你已認(rèn)知目前機(jī)器的提示或狀態(tài)EXIT按鈕: 按了EXIT按鈕,表示離開(kāi)目前的狀態(tài)上述使用方法,在螢?zāi)挥蚁路降膶?duì)話框(訊息顯示區(qū))會(huì)顯示操作方法開(kāi)機(jī)後,顯示如下的畫(huà)面For (因軟體版本新舊不一樣而不同)Ultraprint AP內(nèi)全部馬達(dá),都是步進(jìn)馬達(dá),所以剛開(kāi)機(jī)必需RESET重新回原點(diǎn)後才能開(kāi)始使用。M P M中 文 操 作 手 冊(cè)Ultraprint (forAP )Frank製Start Cycle開(kāi)始循環(huán)按鈕Emergency Stop警急停止開(kāi)關(guān)3D雷射鑰匙開(kāi)關(guān)Power電源燈門(mén)鎖鑰匙開(kāi)關(guān)Power電源燈Off電源關(guān)閉開(kāi)關(guān)On電源啟動(dòng)開(kāi)關(guān)警急停止開(kāi)關(guān)主電源開(kāi)關(guān)斷路器電源線主電源圓形開(kāi)關(guān):UP2000中文手冊(cè)節(jié)錄自MPM公司UltraprintAP英文手冊(cè),僅做為琋瑪企業(yè)員工及客戶教育訓(xùn)練之用,特此聲明,若有不詳之處,敬請(qǐng)見(jiàn)諒。 :UPAP印刷機(jī)特性 視覺(jué)自動(dòng)對(duì)準(zhǔn)裝置 Vision Alignment System慢速脫模功能 Slow Snapoff Function 可程式設(shè)定刮刀頭 Programming Squeegee 自動(dòng)擦拭鋼板系統(tǒng)Stencil Wipper Cycle 印刷週期包含下列過(guò)程1. 基板搬入Loading Board2. 基板定位 Locating Board3. 視覺(jué)系統(tǒng)對(duì)位 Vision Alignment4. 印刷平臺(tái)上升 Z Tower UP5. 刮刀向前後刮印錫膏 Printting6. 慢速脫模 Slow SnapOff7. 印刷平臺(tái)下降 Z Tower Down8. 基板搬出 Unloading Board 軌跡球或螢?zāi)?Trackball or Monitor)你可以從螢?zāi)簧现繳ltraprint 2000的狀態(tài),以及它提供給你的相關(guān)訊息,並且經(jīng)由軌跡球,來(lái)採(cǎi)取各項(xiàng)的操作程序。 Print Teach File Utilities Maintenance CHANGED FRANKFILE:SUPERVISOROEX AXIS BOARD COUNT REJECTSRESET 0 0 Y AXISSqueegee starting in back Z AXIS CLEAR FAULTTHETA AXIS SQUEEGEE STROKE SETUP MENUS TRANSPORT 123 VX AXISVY AXIS SQUEEGEE HEIGHT TACTILE STENCILLIGHTVACUUMMOTORSQUEEGEEUP/DOWNBOARDLIGHTVACUUMMOTORFRAMECLAMPUP/DOWNDISPENSESOLVENTWIPERPAPERSQUEEGEEFLIPSQUEEGEECLAMPSMPM Corporation Print Teach File Utilities