【正文】 .......................................................................................................................... 3 主要研究?jī)?nèi)容及成果特色 .............................................................................................. 4 主要研究?jī)?nèi)容 ........................................................................................................... 4 成果特色 ................................................................................................................... 4 2 總體設(shè)計(jì) ................................................................................................................................ 5 探測(cè)金屬的理論依據(jù) ...................................................................................................... 5 傳感器原理 ...................................................................................................................... 6 電渦流式傳感器的工作原理 ............................................................................... 6 基本特性 ................................................................................................................... 7 電渦流形成范圍 ....................................................................................................... 8 低頻透射式渦流厚度傳感器 ............................................................................... 9 基于單片機(jī)的金屬探測(cè)器的設(shè)計(jì)方案 ........................................................................ 10 系統(tǒng)設(shè)計(jì) ......................................................................................................................... 11 硬件電路設(shè)計(jì) ......................................................................................................... 11 軟件結(jié)構(gòu)設(shè)計(jì) ......................................................................................................... 12 3 軟件模塊設(shè)計(jì) ....................................................................................................................... 14 前端軟件設(shè)計(jì) ................................................................................................................ 14 外圍數(shù)據(jù)處理與顯示模塊設(shè)計(jì) .................................................................................... 17 4 硬件單元電路設(shè)計(jì) ............................................................................................................... 20 振蕩電路設(shè)計(jì) ................................................................................................................ 20 放大電路和脈沖變換電路 ............................................................................................ 21 單片機(jī)系統(tǒng) .................................................................................................................... 22 外圍設(shè)置與顯示系統(tǒng) .................................................................................................... 23 5 實(shí)現(xiàn)與性能分析 .................................................................................................................. 25 硬件電路焊接與調(diào)試 .................................................................................................... 25 振蕩電路的焊接與調(diào)試 ......................................................................................... 25 II 放大電路與脈沖轉(zhuǎn)換電路的焊接與調(diào)試 ............................................................. 26 單片機(jī)系統(tǒng)的焊接與調(diào)試 ..................................................................................... 26 外圍數(shù)據(jù)處理與顯示模塊的焊接與調(diào)試 ............................................................. 27 軟件模塊的調(diào)試與集成 ................................................................................................ 29 前端金屬探測(cè)模塊的調(diào)試與集成 ......................................................................... 29 外圍數(shù)據(jù)處理與顯示模塊的調(diào)試與集成 ............................................................. 31 系統(tǒng)性能分析 ................................................................................................................ 32 基準(zhǔn)頻率測(cè)定方法的優(yōu)缺點(diǎn)分析 ......................................................................... 32 金屬探測(cè)的精度 ..................................................................................................... 33 金屬探測(cè)的功能測(cè)試 ............................................................... 錯(cuò)誤 !未定義書簽。 MCU。 關(guān)鍵詞： 金屬探測(cè)；電磁感應(yīng)原理；單片機(jī)；渦流；振蕩電路 Singlechip design and production pipeline detector ABSTRACT Metal detector is designed to detect metal devices, widely used in industrial production, security, entertainment and other fields. The handheld metal detector is designed by a new principle, based candetect metal objects carried by people, such as knives, pens, even the aluminum thin in cigarette box. It is portable and easy to use. The metal detector in this paper is designed and made on the principle of electromagic metal be placed in the variable magic field, in accordance with the principle of electromagic induction, eddy current will be generated internally in the metal, eddy current generates a magic field in turn affects the original magic field, which can be converted to the frequency and amplitude changes in the relevant circuit for testing. Threepoint oscillator circuit by the capacitor generates a sine wave, through amplification and shaping, into the MCU detects the frequency changes. When a metal object existence, the oscillation originally set up will be affected for electromagic induction, the frequency will change, the MCU will alarm after detecting the change. This metal detector is designed interface, and can municate with peripheral systems, as well as implements munication of display module and peripheral data processing posed of liquid crystal display and keyboard of can reprocess and analysis the data detected on the front end, display the results on the LCD screen, and can set the progress detected on the front by the keyboard . Based on the design principles and requirements,this article pletes the design of the overall framework of the system, pletes the six hardware design and general production, pletes the software design and programmi