【正文】 就可能大面積減產(chǎn)，造成嚴重經(jīng)濟損失。 SHT10 1 目 錄 1 緒論 ........................................................................................................................................ 3 研究背景 ......................................................................................................................... 3 研究現(xiàn)狀 ......................................................................................................................... 3 國外研究現(xiàn)狀 ......................................................................................................... 3 國內(nèi)研究現(xiàn)狀 ......................................................................................................... 4 研究目的與內(nèi)容 .............................................................................................................. 4 論文結(jié)構(gòu) ......................................................................................................................... 4 2 系統(tǒng)結(jié)構(gòu)設(shè)計及元器件選型 ................................................................................................ 6 系統(tǒng)結(jié)構(gòu)設(shè)計 .................................................................................................................. 6 器件選型 ......................................................................................................................... 7 單片機模塊選型 ..................................................................................................... 7 測量模塊選型 ........................................................................................................ 7 液晶模塊選型 ......................................................................................................... 8 硬件選型綜述 ...................................................................................................... 9 本章小結(jié) ........................................................................................................................10 3 硬件電路設(shè)計與實現(xiàn) ........................................................................................................... 11 硬件設(shè)計準備 ................................................................................................................. 11 單片機模塊外圍設(shè)計 ...................................................................................................... 11 溫濕度傳感器 .................................................................................................................12 電源模塊設(shè)計 .................................................................................................................13 用戶交互模塊設(shè)計 ..........................................................................................................14 LCD 顯示設(shè)備設(shè)計 ...............................................................................................14 按鍵電路與報警電路設(shè)計 ......................................................................................15 本章小結(jié) .........................................................................................................................16 4 系統(tǒng)軟件設(shè)計 .......................................................................................................................17 開發(fā)軟件平臺概述 ..........................................................................................................17 系統(tǒng)程序設(shè)計 .................................................................................................................18 系統(tǒng)主程序設(shè)計 ....................................................................................................18 傳感器讀取參數(shù)子程序設(shè)計 ..................................................................................19 LCD 顯示子程序設(shè)計 ............................................................................................21 警報子程序設(shè)計 ....................................................................................................23 本章小結(jié) ........................................................................................................................25 5 系統(tǒng)仿真 ...............................................................................................................................26 仿真調(diào)試 ........................................................................................................................26 仿真結(jié)果分析 .................................................................................................................26 本章小結(jié) ........................................................................................................................27 6 總結(jié)與展望 ...........................................................................................................................28 2 總結(jié) ...............................................................................................................................28 展望 ...............................................................................................................................28 參考文獻 ...................................................................................................................................29 附錄一 .......................................................................................................................................30 附錄二 .......................................................................................................................................31 附錄三 .......................................................................................................................................32 致 謝 .........................................................................................................................................12 第一章 緒論 3 1 緒論 研究背景 我國耕地面積逐年減少，截止 2021年，我國耕地面積為 ，比上年減少 30萬公頃，人均耕地面積僅為 926㎡，不到世界人均的 40%，我國農(nóng)業(yè)需要向優(yōu)質(zhì)、高效、高產(chǎn)的現(xiàn)代化農(nóng)業(yè)轉(zhuǎn)型。 LCD。 software parts includes module of On this basis, design system software。根據(jù)設(shè)計方案，空氣溫濕度測量儀可以具有讀取方便