【正文】 功能實(shí)現(xiàn)模塊 功能實(shí)現(xiàn)模塊主要包括采樣模塊?按鍵和顯示模塊及報(bào)警和指示燈模塊,一起構(gòu)成了溫度控制系統(tǒng)的功能 采樣模塊 DS18B20 數(shù)字溫度傳感器接線方便,封裝成后可應(yīng)用于多種場(chǎng)合,如管道式,螺紋式,磁鐵吸附式,不銹鋼封裝式,型號(hào)多種多樣,有 LTM8877,LTM8874 等等?主要根據(jù)應(yīng)用場(chǎng)合的不同而改變其外觀?封裝后的 DS18B20 可用于電纜溝測(cè)溫,高爐水循環(huán)測(cè)溫,鍋爐測(cè)溫,機(jī)房測(cè)溫,農(nóng)業(yè)大棚測(cè)溫,潔凈室測(cè)溫,彈藥庫(kù)測(cè)溫等各種非極限溫度場(chǎng)合?耐磨耐碰,體積小,使用方便,封裝形式多樣,適用于各種狹小空間設(shè)備數(shù)字測(cè)溫和控制領(lǐng)域?DS18B20 內(nèi)部結(jié)構(gòu)主要由四部分組成:64 位光刻 ROM?溫度傳感器?非揮發(fā)的溫度報(bào)警觸發(fā)器 TH 和 TL?配置寄存器? DS18B20 的主要特性: ,電壓范圍:~,在寄生電源方式下可由數(shù)據(jù)線供電。:四位有效值顯示。℃。 ?硬件的聯(lián)調(diào)及測(cè)試? 設(shè)計(jì)要求 :室溫 0℃~+100℃。 占空比的改變。只有 D 合適,才能使超調(diào)量較小,減短調(diào)節(jié)時(shí)間?43 系統(tǒng)的方案設(shè)計(jì) 系統(tǒng)設(shè)計(jì)內(nèi)容及要求 設(shè)計(jì)內(nèi)容 。P 太小,又會(huì)使系統(tǒng)的動(dòng)作緩慢?P 可以選負(fù)數(shù),這主要是由執(zhí)行機(jī)構(gòu)?傳感器以及控制對(duì)象的特性決定的?如果 P 的符號(hào)選擇不當(dāng)對(duì)象測(cè)量值就會(huì)離控制目標(biāo)的設(shè)定值越來(lái)越遠(yuǎn),如果出現(xiàn)這樣的情況 P 的符號(hào)就一定要取反? I 對(duì)系統(tǒng)性能的影響:積分作用使系統(tǒng)的穩(wěn)定性下降,I 小(積分作用強(qiáng))會(huì)使系統(tǒng)不穩(wěn)定,但能消除穩(wěn)態(tài)誤差,提高系統(tǒng)的控制精度? D 對(duì)系統(tǒng)性能的影響:微分作用可以改善動(dòng)態(tài)特性,D 偏大時(shí),超調(diào)量較大,調(diào)節(jié)時(shí)間較短。P 偏大,振蕩次數(shù)加多,調(diào)節(jié)時(shí)間加長(zhǎng)。℃. It show that the system is precise and steady, and control precise temperature.Keywords: Temperature control MCS52 DS18B20 PID PWM 目 錄1 前言 ..............................................................................................................................................................12 設(shè)計(jì)理論基礎(chǔ) ..............................................................................................................................................2 PWM 控制技術(shù) ...................................................................................................................................2 數(shù)字 PID 算法 ..................................................................................................................................23 系統(tǒng)的方案設(shè)計(jì) ..........................................................................................................................................4 系統(tǒng)設(shè)計(jì)內(nèi)容及要求 .......................................................................................................................4 設(shè)計(jì)內(nèi)容 ...............................................................................................................................4 設(shè)計(jì)要求 ...............................................................................................................................4 方案設(shè)計(jì)的比較與論證 ...................................................................................................................44 系統(tǒng)硬件電路的設(shè)計(jì) ..................................................................................................................................6 單片機(jī)最小系統(tǒng)模塊 .......................................................................................................................7 單片機(jī) STC89C52 的簡(jiǎn)介 ....................................................................................................7 單片機(jī)系統(tǒng)模塊的硬件設(shè)計(jì) ............................................................................................10 功能實(shí)現(xiàn)模塊 ................................................................................................................................11 采樣模塊 ............................................................................................................................11 按鍵模塊 ............................................................................................................................12 顯示模塊 ............................................................................................................................13 溫度控制模塊 ................................................................................................................................145 系統(tǒng)軟件設(shè)計(jì) ............................................................................................................................................15 主程序模塊 ....................................................................................................................................15 功能實(shí)現(xiàn)模塊 ................................................................................................................................17 溫度采樣子程序 ................................................................................................................17 顯示子程序 ......................................................................................................................17 運(yùn)算控制模塊 ................................................................................................................................186 系統(tǒng)調(diào)試 ....................................................................................................................................................19 Keil 軟件的簡(jiǎn)介 ...........................................................................................................................19 Proteus 軟件的簡(jiǎn)介 .....................................................................................................................19 軟件仿真 ........................................................................................................................................20 硬件調(diào)試 ........................................................................................................................................21 調(diào)試結(jié)果 .........................................................................................................................................227 結(jié)論 ...........................................................