20xx年硬件工程師英文簡(jiǎn)歷表格(參考版)
2025-03-09 22:17本頁(yè)面
【正文】 Technology Material Science and Engineering Bachelor1997/07。1997/07Nanjing University of Science amp。39。amp。2020/03Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate1998/09。amp。 Technology as a Research Fellow. I major at Gate oxide Reliability research in the 。 Technology Microelectronics DoctorateI worked in Nan yang University of Science amp。2020/01Nanyang University of Science amp。2020/05Optimization the current Test Process Order for Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by : Being the Project leader, I take the main responsibility, such as, design, plan, organize and 。39。amp。PresentAssembly NPI (New Product Introduction)Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify : I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the 。amp。amp。amp。amp。2020/05Intel(Shanghai) Technology Development Ltd. CompanyIndustry: Electronics/Semiconductor/ICIntel STTDChina Department Electronics Development Engineer Responsibilities： had been working in STTDChina since Jan 2020 to May 2020 as a senior module that ti
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