【正文】 2kV Bottom cover :177。 Z 3 Pass Box Vibration 5~500Hz, , Box Drop 76㎝ drop 15 Pass ESD Operating Top_Case : 177。 銲錫 1000 PPM Lead (Pb) 鉛 。CSystem Introduction will cover ? Role Responsibility (RR) ? Process – Cx Stage: ? C0: Proposal phase 構(gòu)想階段 ? C1: Planning phase 規(guī)劃階段 ? C2: RD Design phase 設(shè)計(jì)階段 ? C3: Lab Pilot Run phase 樣品試作階段 ? C4: Eng Pilot Run phase 工程試作階段 ? C5: PD Pilot Run phase 試產(chǎn)階段 ? C6: Mass Production phase 量產(chǎn)階段 Role Responsibility Function Responsibility PM 產(chǎn)品經(jīng)理 Product Manager (或計(jì)畫專案經(jīng)理 Project Manager)為所負(fù)責(zé)計(jì)畫或產(chǎn)品線成敗之總負(fù)責(zé)人 , 將依產(chǎn)品線之性質(zhì)指定專人負(fù)責(zé)某類產(chǎn)品 ,必頇對(duì)所負(fù)責(zé)產(chǎn)品線專業(yè)領(lǐng)域之發(fā)展及行銷雙方面皆有相當(dāng)程度的了解 . 並依照產(chǎn)品之條件及市場(chǎng)狀況 ,做適當(dāng)?shù)倪\(yùn)用 ,訂定技術(shù)或產(chǎn)品市場(chǎng)競(jìng)爭(zhēng)策略 ,並在適當(dāng)?shù)臅r(shí)機(jī)推出適當(dāng)之技術(shù)或產(chǎn)品 . TM TM is responsible to coordinate technical issues conflict among HW, SW, ID and ME and decisionmaking. TM has to handle all project technical issues. PCC 為規(guī)劃推廣、連絡(luò)及控制專案進(jìn)行的負(fù)責(zé)人 , 掌握專案進(jìn)行之情況以協(xié)助處理異常狀況 , 使新產(chǎn)品能順暢切入工廠且如期推出 , 以提高產(chǎn)品競(jìng)爭(zhēng)力 . 協(xié)助 RD RELEASE 開(kāi)發(fā)階段 BOM CHANGE NOTICE. RD RD 包括電子部門及工業(yè)設(shè)計(jì)部門 ,若只寫 HW (Hardware Design) 則指電子部門 ,若只寫 ID (INDUSTRIAL DESIGN) 則指工業(yè)設(shè)計(jì)部門 。 塑膠 ,線材 ,塗料 1000 PPM Cadmium (Cd) 鎘 100 PPM Mercury (Hg) 汞 1000 PPM Hex. Chromium (Cr6+) 六價(jià)鉻 1000 PPM PBB (聚溴聯(lián)苯 ) 1000 PPM PBDE (聚溴二苯醚 ) 1000 PPM ?重金屬： 汞、鉛、鎘、六價(jià)鉻 ?溴性耐燃劑：聚溴聯(lián)苯 (PBBs)、 溴聯(lián)苯醚 (PBDEs) 註：另有 管制規(guī)範(fàn)外 的項(xiàng)目 EU WEEE Directive ? Directive 2023/96/EC期程 – 指令發(fā)布 – 歐盟公報(bào)發(fā)行，指令生效 – 轉(zhuǎn)為會(huì)員國(guó)當(dāng)?shù)胤?,法規(guī)或行政指令 – 完成回收系統(tǒng)建構(gòu) ,製造商因應(yīng)回收之 財(cái)務(wù)規(guī)劃就緒 – 回收再利用率達(dá)每人每年 4kg – 訂定下階段目標(biāo) ? 回收 Target of Recovery and Recycling (Waste Electrical and Electronic Equipment) WEEE Category Large household appliances Small household appliances IT telemunications appliances Consumer equipment Lighting equipment Electrical and electronic tools Toys, leisure sports equipment Medical devices Monitoring and control instruments Automatic dispensers Rate of Recovery Rate of Recycling 80% 75% 70% 50% 75% 65% 75% 65% 70% 50% 70% 50% 70% 50% * * 70% 50% 80% 75% * To be determined by 31 December 2023 New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ?C2 checklist ?PES ?EMC/Safety Request Form ?BOM/QVL(Prel.) ?PCB Layout (prel.) ?Outsourcing module specification C2/PM C2 Meeting C2 工作重點(diǎn)及檢核項(xiàng)目 階段 C2設(shè)計(jì)階段 (RD Design Phase) 負(fù)責(zé)單位 技術(shù)經(jīng)理 (Technical Manager) 研發(fā)部門 目的 * 軟、硬體、機(jī)構(gòu)設(shè)計(jì) * 証實(shí)設(shè)計(jì)可行性 * 修正軟、硬體、機(jī)構(gòu)規(guī)格 工作重點(diǎn) * 電路設(shè)計(jì)並完成電路圖 * 機(jī)構(gòu)設(shè)計(jì)並完成機(jī)構(gòu)設(shè)計(jì)圖 * 機(jī)電整合設(shè)計(jì)並完成機(jī)電介面設(shè)計(jì) * 軟體設(shè)計(jì)並完成初步版本 * 電路設(shè)計(jì) Review * 機(jī)構(gòu)設(shè)計(jì) Review * 機(jī)電整合設(shè)計(jì) Review * 建立初步之測(cè)試計(jì)畫 (硬體、軟體、機(jī)構(gòu) ) 審核會(huì)議 C2 目的 * 確定計(jì)畫規(guī)格 * 檢討設(shè)計(jì)階段之工作成效 * 決定是否進(jìn)入樣品試作 * 查核是否發(fā)出專利之申請(qǐng) 檢核項(xiàng)目 Schematics (Preliminary) S/W Specification Mechanical Thermal Test Plan Invention Disclosure Invention Disclosure New C System Product Development Proposal Phase Planning Phase RD Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics jumper setting ? Test program/Procedure ? SOP for PCBA/FA ? User manual R/N ? Packing standard ? Compatibility test report ? Reliability and C4 Reliability test report ? Key Component verification ? Spare parts list ? C5 checklist ? Service Guide ? EMC Safety report ? PD P/R yield rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project