【正文】 。 height of ponent long axis side above the land is maximum 3 point of 4 corner touch the PCB . The height of the other point above the land is maximum protrusion can be identified on solder side 允收狀況 (Accept Condition) CARD Wh≦ CARD Wh CARD a b c d a b c d a b c d a,c兩點平貼 PCB或垂直 上浮，但 b,d兩點傾斜高度 ＞ (MI)。 (a,b,c,d 四點平貼於 PCB) 。 (Lh ＞ ) 、未入孔、缺件 等缺點影響功能 (MA)。 (a,b,c,d四點 平貼於 PCB）。 (Wh＞ ) 組裝性之干涉 (MA)。 PCB零件面與零件基座之最低 點為量測依據。 height of ponent above the land (Lh)is maximum protrusion on the solder side can be identified solder bridge ＞ (MI)。 PCB零件面與零件基座之最低 點為量測依據。 (X≦) Z≦ (被固定零件平貼於 PCB時 ) height of jumper wire above the land is Maximum wire used for fixing ponent is maximum shift length of reflection of jumper wire used for fixing ponent on the board is maximum measuring from the edge of PTH height of jumper wire above the ponent is maximum since ponent lay flat 允收狀況 (Accept Condition) Lh≦ mm Wh≦ mm X≦ m Lh,Wh＞ (MI)。 ,跳線需 平貼零件。 COIL之 Lh≦2mm . Wh≦2mm) 不受第 1點之限制 height of the ponent body above the land “Lh”is maximum leads be shorted or bended of ponent floating be specified to 2mm maximum 傾斜 /浮高 Lh mm 傾斜 Wh 傾斜 /浮高 Lh≦ mm 傾斜 Wh≦ mm PCB零件面之 最大距離＞ (MI)。 is rejected . lead can not be visible lead out of spec (include Lmin or Lmax) bend / missing / nothrough spec of protrusion lead out of spec (Lmax) is rejected 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號：附件一 日期： ,2023 版本： E 123 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) DIP零件組裝工藝標準 臥式電子零組件 (R,C,L)浮件與傾斜 (1) DIP ponent Assembly workmanship criteriaTilt floating of horizontal electronic ponent ( R , C , L ) 。 (L≦ ) ： Coil零件腳最長長度 (Lmax)低於 3mm(L≦ 3mm) X’TAL/ 電容腳距 (含 )以下之零件，腳最 長長度 (Lmax)低於 2mm (L≦ 2mm) lead protrusion lead be identified on solder side of trimed protrusion lead Minimum length is the protrusion lead profile be identified ≦ (for general ponents) spwc of ponents: Coil Lmax≦ 3mm X’tal Lmax≦ 2mm(the clearance between two lead is less width) 允收狀況 (Accept Condition) Lmin :零件腳出錫面 Lmax ~ Lmin Lmax :L≦ mm Lmin :零件腳未出錫面 Lmax ~ Lmin Lmax :L＞ mm(特殊零件依特殊零件規(guī)定 ) L L (MI)。 L 計算方式 : 需從 PCB沾錫面為衡量基準， 可目視零件腳出錫面為基準。 ponent are mounted with correct oriental at right location and polarized symbol are identified cleatly (MA)。 is not as specified (Wrong parts) not mounted in correct holes ponent mounted backwards (Wrong oriented) ponent not oriented correctly are missing(missing parts) is rejected. 允收狀況 (Accept Condition) + R1 + C1 Q1 R2 D2 + R1 + C1 Q1 R2 D2 + C1 + D2 Q1 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號：附件一 日期： ,2023 版本： E 121 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) DIP零件組裝工藝標準 立式零件組裝之方向與極性 DIP ponent Assembly workmanship criteriaDirection polarity of vertically mounted 由上至下。 (MA)。（由左至右，或 由上至下） are centered between their lands markings are visible ponents need to be oriented so that marking all read the same way (Lefttoright or topto bottom) 。(D,L≦8mil()) diameter of solder ball / solder dross which can remove or not shall small than 8 mil() 、錫渣不論可被剝除者 或不易被剝除者 ,直徑 D或長 度 L8mil()。 is rejected . 允收狀況 (Accept Condition) H 端電極底部延伸到頂部的 2/3H以上。 。 焊接面。 (h≧1/4T) 伸到焊墊的距離為晶片高 度的 25%以上。 flow up to top of lead angle and not touch the body (profile)of lead angle can be visible clearly (MI)。 。 concave fillet on the 4 face of lead flow up to the angle high point A,B shape(profile)can be clearly visible soldering joint at every solder contact 側的 50%以上 (h≧1/2T) 。 flow up to B point on the heel 彎曲處的底部 (B)，延伸過 高，且沾錫角超過 90度，才 拒收 (MI)。 solder flow up and concave fillet between land and lead solder fillet between side face of lead and land shape (profile) of lead (footprint) be clearly visible 頂部 (MI)。 。 (U) of solder fillet between lead and land less than 1/2 length of around the footprint(2L+2W) 。 。 (Heel)焊錫帶涵蓋高度 h大於零件腳 1/2厚度 (h≧ 1/2T)。 (S≧5mil) The lead had shifted off the land length of lead shifted off the land (X) shall less 1/4 width of lead (W) clearance distance between shifted lead and land edge shall over 5 mil 華碩電腦 (股 )公司 SONY LEXUX PROJECT Workmanship Standard 編號：附件一 日期： ,2023 版本： E 112 理想狀況 (Target Condition) 拒收狀況 (Reject Condition) SMT焊點性工藝標準 鷗翼 (GullWing)腳面與腳跟焊點最小量 SMD solder joint workmanship criteriaMinimum solder of Gull Wing footprint ,腳跟吃錫良好 焊錫帶。 the leads footprint is centered on the lands 允收狀況 (Accept Condition) S W S≧ 5mil X≦ 1/4W S5mil X 1/4W ，所偏 出焊墊以外的接腳，已超 過接腳本身寬度的 1/4W (MI)。 lead had shifted the length from lead heel to end of land (X) less the thickness of lead (T) 允收狀況 (Accept Condition) T X