【正文】 Integrated Circuit 大規(guī)模集成電路LOC Lead Over Chip 芯片上引線健合LQFP Low Profile QFP 薄形QFPLTCC Low Temperature CoFired Ceramic 低溫共燒陶瓷MBGA Metal BGA 金屬基板BGAMCA Multiple Channel Access 多通道存取MCM Multichip Module 多芯片組件MCMC MCM with Ceramic Substrate 陶瓷基板多芯片組件MCMD MCM with Deposited Thin Film Inteconnect Substrate 淀積薄膜互連基板多芯片組件MCML MCM with Laminated Substrate 疊層基板多芯片組件MCP Multichip Package 多芯片封裝MELF Metal Electrode Face Bonding 金屬電極表面健合MEMS Microelectro Mechanical System 微電子機械系統(tǒng)MFP Mini Flat Package 微型扁平封裝MLC MultiLayer Ceramic Package 多層陶瓷封裝MMIC Monolithic Microwave Integrated Circuit 微波單片集成電路MOSFET MetalOxideSilicon FieldEffect Transistor 金屬氧化物半導(dǎo)體場效應(yīng)晶體管MPU Microprocessor Unit 微處理器MQUAD Metal Quad 金屬四列引腳MSI Medium Scale Integration 中規(guī)模集成電路OLB Outer Lead Bonding 外引腳焊接PBGA Plastic BGA 塑封BGAPC Personal Computer 個人計算機PFP Plastic Flat Package 塑料扁平封裝PGA Pin Grid Array 針柵陣列PI Polymide 聚酰亞胺PIH PlugIn Hole 通孔插裝PTF Plastic Leaded Chip Carrier 塑料有引腳片式載體PTF Polymer Thick Film 聚合物厚膜PWB Printed Wiring Board 印刷電路板PQFP Plastic QFP 塑料QFPQFJ Quad Flat Jleaded Package 四邊J形引腳扁平封裝QFP Quad Flat Package 四邊引腳扁平封裝QIP Quad InLine Package 四列直插式封裝RAM Random Access Memory 隨機存取存貯器SBB StudBump Bonding 釘頭凸點焊接SBC SolderBall Connection 焊球連接SCIM Single Chip Integrated Module 單芯片集成模塊SCM Single Chip Module 單芯片組件SLIM Single Level Integrated Module 單級集成模塊SDIP Shrinkage Dual Inline Package 窄節(jié)距雙列直插式封裝SEM Sweep Electron Microscope 電子掃描顯微鏡SIP Single InLine Package 單列直插式封裝SIP System In a Package 系統(tǒng)級封裝SMC Surface Mount Component 表面安裝元件SMD Surface Mount Device 表面安裝器件SMP Surface Mount Package 表面安裝封裝SMT Surface Mount Technology 表面安裝技術(shù)SOC System On Chip 系統(tǒng)級芯片SOIC Small Outline Integrated Circuit 小外形封裝集成電路SOJ Small Outline JLead Package 小外形J形引腳封裝SOP Small Outline Package 小外形封裝SOP System On a Package 系統(tǒng)級封裝 aTAB Tape Automated Bonding 載帶自動焊TBGA Tape BGA 載帶BGATCM Thermal Conduction Module 熱導(dǎo)組件TCP Tape Carrier Package 帶式載體封裝THT ThroughHole Technology 通孔安裝技術(shù)TO Transistor Outline 晶體管外殼TPQFP Thin Plastic QFP 薄形塑料QFPTQFP Tape QFP 載帶QFPTSOP Thin SOP 薄形SOPTTL TransistorTransistor Logic 晶體管晶體管邏輯UBM Metalization Under Bump 凸點下金屬化UFPD Ultra Small Pitch Device 超窄節(jié)距器件USOP Ultra SOP 超小SOPUSONF Ultra Small Outline Package Non Fin 無散熱片的超小外形封裝UV Ultraviolet 紫外光VHSIC Very High Speed Integrated Circuit 超高速集成電路VLSI Very Large Scale Integrated Circuit 超大規(guī)模集成電路WB Wire Bonding 引線健合WLP Wafer Level Package 圓片級封裝WSI Wafer Scale Integration 圓片級規(guī)模集