塑膠電鍍工藝的介紹-資料下載頁
2025-04-29 06:11本頁面
【正文】 00 Etching Rate [mg] 粗化率 Adhesion [N/mm] 黏附力 塑膠電鍍介紹 Plating on Plastics Palladium / Tin Cluster 鈀 / 錫簇 cluste10 Cl Pd Sn2+ 0,181nm 0,128nm 0,093nm . 120, 502 (1973) Core Diameter: 核心直徑 3 – 4nm Sn 塑膠電鍍介紹 Plating on Plastics Electroless Metal Deposition (Model) 化學(xué)金屬沉澱物 eless00 Active plastic‘s surface 活性塑膠表面 Start of metal deposition. 開始出現(xiàn)金屬沉澱物 Complete metalization: all activator particles are connected electrically conductive. 金屬化完成 ﹕ 所有活性劑顆粒均結(jié)合在一起具導(dǎo)電性 ﹒ 塑膠電鍍介紹 Plating on Plastics Electroless Nickel Deposition I 化學(xué)鎳沉澱物 I Starting Reaction 初期反應(yīng) Adsorption of Reducer 還原劑吸附作用 Protolysis 質(zhì)子遷移 Addition of Water 附加水 Desorption 解吸附作用 塑膠電鍍介紹 Plating on Plastics Electroless Nickel Deposition II 化學(xué)鎳成份 II Side Reactions 側(cè)邊反應(yīng) Rebination of Hydrogen Atoms: Hydrogen Gas Evolution 氫原子再結(jié)合 ﹕ 成為氫氣 ?Reduction‘ of Hydroxide 氫氧化物還原 Phosphorous Co Deposition 磷酸根 沉澱物 塑膠電鍍介紹 Plating on Plastics Electroless Nickel Deposition III 化學(xué)鎳成份 III Metal Deposition 金屬沉澱物 Main Reaction 主要反應(yīng) Direct Reduction by Elektrons (only 1%) 由 Elektrons直接還原 （僅有 1％） 塑膠電鍍介紹 Plating on Plastics Mechanism of the CuLink – Operation (Model) 銅槽機(jī)能－操作（模型） culime01 Activator particles are bound to a plastic‘s surface. 活化劑顆粒同塑膠件表面結(jié)合 Chelated copper ions are reduced to either copper(0) or copper(I) by tin. 螯合銅離子被錫還原成為銅（ 0）或銅（ 1） ﹒ The copper crosslinks the palladium particles resulting in a electroconductive surface layer. 銅與鈀顆粒交叉結(jié)合形成一個(gè)導(dǎo)電表層 ﹒ 塑膠電鍍介紹 Plating on Plastics CuLinkStep: Dependence of the Electrical Conductivity of a Plastic‘s Surface from Surface Bound Amount of Copper. 銅槽步驟 ﹕ 銅表面范圍同塑膠表面的電導(dǎo)率之依從關(guān)系 ﹒ culres00 0 20 40 60 80 100 0 50 100 150 200 Copper 銅 [181。g/dm178。] Conductivity [181。S] 導(dǎo)電性 塑膠電鍍介紹 Plating on Plastics Simplified Model of the Spreading of Metal during Plating after the CuLink Step 在完成銅槽步驟后 ﹐ 電鍍中金屬擴(kuò)散的簡單模擬圖 ﹒ culime20 Palladium cluster are crosslinked by copper or by copper ions. 鈀簇由銅或銅離子相交聯(lián)構(gòu)成 ﹒ During electroplating, copper ions are reduced to copper 在電鍍的過程中 ﹐ 銅離子將被還原成銅 . 塑膠電鍍介紹 Plating on Plastics
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