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【正文】 chemical copper plating including electro less plating and electrochemical copper plating is manly that the especial additive is added to the copper plating bath for enhancing the abilities of micro via filling of the plastic plate or the copper plate. And in order to meet the needs of the industry, the copper plating formula is described in detail.
Introduction for the authors ：
Submissions must not be substantially duplicate work that any of the authors has published elsewhere or submitted in any other journal. The content of the thesis is innovative. And the submission should begin with a title followed by a short abstract and keywords. Authors of accepted papers or the applications of the unit or school must guarantee that at least one of the authors will attend the conference and present their paper.
Submission instructions：
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