筆記本npi從開(kāi)發(fā)到生產(chǎn)(編輯修改稿)
2025-02-13 15:49 本頁(yè)面
【文章內(nèi)容簡(jiǎn)介】 ction readiness ?Solved gating issues Goal: ?Secure enough parts for guarantee years ?Clear unique parts in stock Goal: ?Detail design to check every items in specification Goal: ?Deliver products in time with best quality 7 開(kāi)發(fā)流程 B Test Stage EE Preparation SMT Board Test Final Ass’ y RunIn BTest ME Preparation PreAss’ y Prebuild Modify Modify Gerber out T3 w/Texture ?material preparing ?material preparing ?PCBA ?troubleshooting ?troubleshooting ?circuit modify ?release ECR/ECN ?release BOM ?Modify drawing ?apply part number ?create BOM ?release BOM ?check test status ?verify solution ?preass’ y review 8 開(kāi)發(fā)流程 C Test Stage Concept Feasibility Design Atest Btest MP EOL Goal: define product to meet ?Marketing trend ?Customer requirement ?Technology trend Goal: ?Functions implement ?Critical function verification Goal: ?Reliability test ?Solved critical bugs Ctest Goal: ?production readiness ?solved gating issues Goal: ?Secure enough parts for guarantee years ?Clear unique parts in stock Goal: ?Detail design to check every items in specification Goal: ?Deliver products in time with best quality 9 開(kāi)發(fā)流程 C Test Stage EE Preparation SMT Board Test Final Ass’y RunIn CTest ME Preparation PreAss’y Prebuild Modify Modify Gerber out
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