外文翻譯---大功率白光led封裝工藝技術(shù)與研制(編輯修改稿)
2025-02-14 00:00 本頁(yè)面
【文章內(nèi)容簡(jiǎn)介】 ps from low light efficiency underlying causes. How different materials will be among the internal refraction, reflection of light energy to be consumed in use, the design of optical systems is the key. Therefore, taking flipchip technology to enhance the efficiency of the light at the same time, through onchip lightemitting layer and Si increase the reflective layer between the bottom of the chip to heat sink side mirror processing methods, the rate of increase in lightemitting devices. In addition, flipchip in the sapphire substrate surface and between the bination of epoxy resin to increase the Si layer of plastic material as a buffer layer, to reduce stress due to thermal expansion caused by the phenomenon of delamination, chip out to improve and enhance the refractive index of light product reliability.2. Optimization of spherical optical lensHighpower LED devices at the top of the spherical lens design, LED light to improve the efficiency of market applications, also plays an important role. In the lens materials, select a high transmittance of the glass or acrylic and other synthetic materials to improve light efficiency。 applications in the market, according to lighting differences in optical design of the needs of the market demand for the pany39。s largest spherical lens structure basis, taking into account a variety of other lens design. Thermal Packaging Technology Cooling for the power type LED devices is critical, if not the current heat generated by the shed in time to maintain the PN junction to allow the junction temperature in the range will not be able to obtain a stable light output and maintenance of the normal life of the device. Thermal materials are usually used, although the best thermal conductivity of Ag, but the high cost of the radiator not suitable for generalpurpose. And Cu close to the thermal conductivity of Ag, and low cost pared with Ag. Although the thermal conductivity of Al is lower than Cu, but its integrated the lowest cost, is conducive to largescale manufacturing. After the experimental contrast, the approach is: to connect the chip part of the use of Cu or Agbased matrix for the heat sink, and then the heat sink connected to the A1based radiator, shed heat (or aircooled heat transfer mode).This approach39。s advantages are: costeffective full account of the radiator, the radiator will be a different bination of features to achieve efficient heat dissipation, and the rationalization of cost control head. In addition, Cubased heat sink to connect with the material between the chips is also very important to choose the general LED used as a connecting material silver plastic. However, due to the thermal resistance of plastic Ag high thermal conductivity in the 1025 W / (mK), using Ag glue to connect the material, it means that people in between the chip and heat sink with a layer of thermal resistance.To this end, the introduction of a new solid materials technology, welding technology that is a total of goods: The goods Sn films as tablets of welding and connecting material between the heat sink. Sn for the thermal conductivity of 67 W / (mK), its cooling effect and physical properties far superior to Ag glue, so to obtain a more ideal thermal effects (thermal resistance coefficient of about 16( C / W).The production process and analyzes finallySplit Blue light chip testingThe blue light chip sticks the pieceThe vacuum driesEutectic weldsWire solder YGA luminous powderVacuum dryingPoint scattering medicinal preparationVacuum dryingFills the rubberVacu
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