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TIM Thermal Interface Material ? To reduce contact thermal resistance between CPU die and thermal module Important of TIM Material ? Various material: siliconbase, carbon… ? Nonphase change ? Phase change Pressure effect ? Pressure spec. on CPU spec. 100psi Thermal Design Procedure Clarify Thermal Specification Design Thermal Solution Analytic Approach Evaluate Solution Performance Numerical Approach Experiment Approach Verify Design Thermal Solution Evaluate heat generation Allowable thermal resistance Allowable design space Evaluate Chassis heat dissipation Evaluate heat exchange area Evaluate fan flow rate Pass Fail Inspect … Remend Thermal Solution Thermal Test in Working Sample Verify Overall System Meeting Thermal Specification Thermal Design OK! Examine and Modify Thermal Solution Pass Fail Thermal Design Guides Design guide for thermal (Ver. ) Thank You! fiber Mesh 細(xì)絲(銅絲 ) 螺旋彈片 銅網(wǎng) groove 直接加工而成 Powder 類型 : 金屬粉末燒結(jié)在 Heat Pipe內(nèi)壁 , 形成毛細(xì)結(jié)構(gòu) N N N N S S S S 無刷馬達(dá)轉(zhuǎn)動原理 有 Hall IC 感應(yīng)其磁鐵 , 經(jīng)由電路控制其線圈之導(dǎo)通產(chǎn)生內(nèi)部激磁使轉(zhuǎn)子部旋轉(zhuǎn) CFM(ft3/min) Static pressure System resistance curve Fan curve System operating point 1. Thermal Module 1) Reserve space for thermal module (Intel remendation) Coppermine: 70*50* Tualatin: 75*55* Northwood: 85*60*19mm 2) It should reserve a gap between thermal module and top cover (keyboard cover) 1. Thermal Module 3) The gap between thermal module exit and NB case vent should be sealed well so the hot air couldn’t flow back to system. If leave an open gap along air flow path, it will affect thermal efficiency and acoustic noise. 1. Thermal Module 4) The thermal module and CPU should contact well. a) The max pressure of the thermal module on CPU is 100psi. Within SPEC, efficiency of thermal module increases with pressure. b) It’s better to fix module on M/B by four screws (avoiding three screws) and spring design. 2. Fan 1) Fan inlet constraints: gap 3~5mm is needed. 3mm ~ 80% performance 4mm ~ 90% performance 5mm ~ 100% performance 2) Configuration