【正文】 hool Graduate or Equivalent. For Level Ⅲ RTRT Ⅲ級(jí)人員1 Principles/Theory射線檢測(cè)原理與基礎(chǔ) Nature of penetrating radiation 穿透輻射性質(zhì) Interaction between penetrating radiation and matter 穿透射線與物質(zhì)的相互作用 Radiography 射線照相方法 Imaging by film 膠片成像 Imaging by fluorescent materials 熒光物質(zhì)成像 Imaging by electronic devices 電子設(shè)備成像 Radiometry 輻射測(cè)量方法2 Equipment/Materials 射線檢測(cè)設(shè)備與器材 Electrically generated sources 電子產(chǎn)生源 Xray sources X射線源 Generators and tubes as an integrated system 發(fā)生器和管子作為一個(gè)系統(tǒng) Sources of electrons 電子源 Electron accelerating methods 電子加速方法 Target materials and characteristics 靶材和特性 Equipment design considerations 設(shè)備設(shè)計(jì)的考慮因素 Particulate radiation sources 特殊放射源 Radiation detectors 射線探測(cè)器 Imaging 成像 Film imaging principles and properties 膠片成像原理和特性 Fluoroscopy 熒光屏成像 TV and optical systems電視和光學(xué)系統(tǒng) Other nonfilm imaging devices其它非膠片成像裝置 Nonimaging devices 非成像裝置 Solid state detectors固態(tài)探測(cè)器 Gaseous ionization detectors 氣體電離探測(cè)器 Instrumentation 儀器 Gaging and control processes測(cè)量和控制過(guò)程3 Techniques/Calibrations射線檢測(cè)技術(shù) Imaging considerations 成像要素 Sensitivity 靈敏度 Contrast and definition 對(duì)比度和清晰度 Geometric factors 幾何因素 Intensifying radiation 增感屏 Scattered radiation散射線 Source factors 源因子 Detection media 檢測(cè)介質(zhì) Exposures curves 曝光曲線 Film Processing 膠片處理 Darkroom Procedures 暗室工作程序 Darkroom equipment and chemicals 暗室設(shè)備和化學(xué)藥品 Film processing 膠片處理 Viewing of Radiographs 射線底片觀察 Illuminator requirements 觀片燈要求 Background lighting 背景光 Optical aided equipment 光學(xué)輔助設(shè)備 Judging radiographic quality 射線底片質(zhì)量評(píng)定 Density 黑度 Contrast 對(duì)比度 Definition 清晰度 Fake Defects 偽缺陷 IQI (Image Quality Indicator) 像質(zhì)計(jì) Causes and correction of unsatisfactory radiographs不合格底片的原因及措施 Exposure calculations 曝光量計(jì)算 Radiographic Techniques 射線照相工藝 Blocking and filtering 屏蔽和過(guò)濾 Multifilm techniques 多膠片法 Enlargement techniques 放大投影法 Stereo radiography 立體射線照相法 Triangulation methods 三角測(cè)量法 Autoradiography 自動(dòng)射線照相法 Flash radiography 閃爍射線照相法 Inmotion radiography 移動(dòng)式射線照相法 Fluoroscopy 射線熒屏檢測(cè)法 Electron emission radiography 電子射線照相法 Microradiography 顯微射線照相術(shù) Neutron radiography 中子射線照相術(shù) Laminography ( tomography ) （射線層析照相法) Control of diffraction effects 衍射效應(yīng)的控制 Pipe welded joints radiograph 管子焊縫射線照相 Contact 接觸法 Elliptical projection 橢圓投影法 Panoramic exposure全景曝光法 Gauging 測(cè)量 Realtime imaging 射線實(shí)時(shí)成像 Image Analysis techniques 成像分析技術(shù) Imageobject relationship 影像與物體的相互關(guān)系4 Evaluation of Radiographic Results射線照相結(jié)果評(píng)定 Material consideration 與材料有關(guān)的問(wèn)題 Material processing as it affects use of item and test results 材料對(duì)工件使用與檢測(cè)結(jié)果的影響 Causes and effects of discontinuities 不連續(xù)性及其產(chǎn)生原因和影響 Radiographic appearance of discontinuities 不連續(xù)性在射線底片上的顯示 Nonrelevant indication 非相關(guān)顯示 Fake defects 偽缺陷5 Examination Procedures射線檢測(cè)程序6 Safety and Health安全和健康 Exposure hazards 輻射危害性 Occupational dose limits 職業(yè)人員的劑量限值 Methods of controlling radiation exposure控制射線照射量的方法 Time 時(shí)間法 Distance 距離法 Inverse square law 平方反比率 Shielding 屏蔽 Operational and emergency procedures 操作及緊急處理程序 Dosimetry and Film Badges 射線劑量測(cè)量和膠片劑量計(jì)ULTRASONIC TESTING METHOD (UT) 超聲波檢測(cè)方法（UT）(UTTraining Course OutlineTC3) (超聲波檢測(cè)培訓(xùn)大綱TC3)FOR LEVEL Ⅰ UT UT Ⅰ級(jí)人員A、Basic Ultrasonic Course超聲波檢測(cè)基礎(chǔ)課程1 Introduction引言 Definition of ultrasonics超聲波定義 History of ultrasonic testing超聲波檢測(cè)簡(jiǎn)史 Applications of ultrasonic energy超聲波能量的利用 Basic math review基礎(chǔ)數(shù)學(xué)復(fù)習(xí) Responsibilities of levels of certification認(rèn)證人員職責(zé)2 Basic Principles of Acoustics聲學(xué)基本原理 Nature of sound waves聲波性質(zhì) Modes of soundwave generation聲波產(chǎn)生模式 Velocity, frequency, and wavelength of sound waves聲波速度、頻率和波長(zhǎng) Attenuation of sound waves聲波衰減 Acoustic impedance聲阻抗 Reflection聲反射 Refraction and mode conversion折射及形式轉(zhuǎn)換 Snell’s law and critical angles斯奈爾定律和臨界角 Fresnel and Fraunhofer effects近場(chǎng)和遠(yuǎn)場(chǎng)效應(yīng)3 Equipment超聲檢測(cè)設(shè)備 Basic pulseecho instrumentation (A, B, and Cscan and puterized systems)脈沖回波式儀器(A、B、C掃描和計(jì)算機(jī)化系統(tǒng)) Electronics — time base, pulser, receiver, and various monitor displays時(shí)間軸、脈沖發(fā)生器、脈沖接收器及多種監(jiān)視器顯示 Control functions控制旋鈕 Calibration校正 Basic instrument calibration儀器基本校正 Calibration blocks (types and use)校正(類(lèi)型和使用) Digital thickness instrumentation數(shù)字式測(cè)厚儀 Transducer operation and theory換能器的操作和理論 Piezoelectric effect壓電效應(yīng) Types of crystals晶片類(lèi)型 Frequency (crystalthickness relationships)頻率 (與晶片厚度的關(guān)系) Near field and far field近聲場(chǎng)和遠(yuǎn)聲場(chǎng) Beam spread聲束擴(kuò)散 Construction, materials, and shapes結(jié)構(gòu)、材料和形狀 Types (straight, angle, dual, etc.)類(lèi)型(直探頭、斜探頭、雙晶探頭等） Beamintensity characteristies聲束強(qiáng)度特性 Sensitivity, resolution, and damping靈敏度、分辨力和阻尼 Mechanical vibration into part機(jī)械振動(dòng)進(jìn)工件 Other type of transduces ( laser UT, EMAT, etc.)其他類(lèi)型的換能方式（激光UT、EMAT等） Couplants耦合劑 Purpose and principles耦合目的和原理 Materials and their efficiency耦合物質(zhì)及效果4 Basic Testing Methods超聲檢測(cè)基本方法 Contact接觸法檢測(cè) Immersion液浸法檢測(cè)1* 2*Total hours of instruction for this course (A): 20hr 15hr大綱 A 培訓(xùn)時(shí)間: 20小時(shí) 15小時(shí)B、Ultrasonic Methods超聲方法1 Testing Methods檢測(cè)方法 Contact接觸法 Straight beam直探法 Angle beam斜探法 Surface wave and plate waves表面波和板波法 Pulseecho transmission脈沖穿透法 Multiple tranducer多探頭法 Curved surfaces曲表面檢測(cè) Plate entry surfaces板材入射面 Cylindrical and tubular shapes圓柱形和管形 Immersion液浸法 Transducer in water水浸探頭 Water column, wheels, etc.沖水探頭、輪胎探頭 Submerged test part隱埋試件 Soundbeam pathtransducer to pa