【正文】 低電平 高電平 有效 有效 低電平 高電平 — — 無效 有效 不確定 高電平 — — 有效 無效 高電平 不確定 HCNR200 HCNR200高線性模擬光電耦合器內(nèi)含一個(gè)高性能 AlGaAs LED和兩個(gè)高度匹配的光二極管。收發(fā)器的內(nèi)部上拉功能將 TxD 引腳置為邏輯高電平，即總線輸出驅(qū)動(dòng)器在開路時(shí)是無源的。雖然在極板結(jié)構(gòu)、工藝添加劑方面形成了正、負(fù)極板之分，但此時(shí)卻不具備鉛酸蓄電池放電的正、負(fù)極板條件。新的用戶界面可以更好地利用屏幕空間和更有效地組織多個(gè)窗口，提供一個(gè)整潔，高效的環(huán)境來開發(fā)應(yīng)用程序。蓄電池可作為應(yīng)急電源及后備電源，在當(dāng)今的技術(shù)條件下，還沒有哪一種電源能夠取代其在工業(yè)及日常生活中的地位。在 32位微處理器領(lǐng)域里， ARM CortexM3處理器性能尤為突出。 PWM 目 錄 摘要 ............................................................................................................................................. I Abstract ..................................................................................................................................... II 第 1章 緒論 ..................................................................................................................................1 研究背景 ...................................................................................................................1 研究現(xiàn)狀和意義 .......................................................................................................1 .........................................................................................................................1 .................................................................................................2 第 2章 系統(tǒng)總體設(shè)計(jì) ..................................................................................................................4 蓄電池化成相關(guān)知識(shí)介紹 ...........................................................................................4 CAN總線技術(shù) ..............................................................................................................4 主要器件介紹 ................................................................................................................4 CAN驅(qū)動(dòng)器 TJA1040 .........................................................................................4 ADUM1201.........................................................................................................6 HCNR200 ...........................................................................................................7 LM339.................................................................................................................8 OPA2277高精度運(yùn)算放大器： ..........................................................................9 TLP521.................................................................................................................9 STM32F103VET6微控制器 ............................................................................10 系統(tǒng)總體方案設(shè)計(jì) ......................................................................................................13 硬件設(shè)計(jì)方案 ....................................................................................................13 軟件設(shè)計(jì)方案 ....................................................................................................13 本章小結(jié) ......................................................................................................................14 第 3章 硬件電路設(shè)計(jì) ................................................................................................................15 硬件實(shí)現(xiàn)框圖 ..............................................................................................................15 存儲(chǔ)器 ..........................................................................................................................15 主控制器 ......................................................................................................................15 電源電路 ......................................................................................................................16 ...........................................................................................................17 ...............................................................................................18 基準(zhǔn)電源模塊 ....................................................................................................18 通訊模塊 ......................................................................................................................19 JTAG電路 .........................................................................................................19 RS485通訊接口電路 ........................................................................................20 CAN通訊接口電路 ..........................................................................................20 電流信號(hào)采集模塊 ......................................................................................................21 過流保護(hù) ......................................................................................................................22 電壓信號(hào)采集模塊 ......................................................................................................23 PWM輸出電路 ...........................................................................................................24 .............................................................................................................25 .....................................................................................................................27 第 4章 系統(tǒng)軟件設(shè)計(jì) ................................................................................................................28 開發(fā)平臺(tái) ......................................................................................................................28 ARM主控制器控制程序 ............................................................................................28 ARM控制程序解釋 ..........................................................................................28 STM32固件庫 ..................................................................................................31 上位機(jī)軟件設(shè)計(jì) ..........................................................................................................32 如何用 Visual Bas