【正文】 have close intermunion with purchasers． This is propitious to elimination of the conflicts between departments， increase the efficiency and re duce the 2 cost． Heat treatment process in the concurrent circumstance is made out not after blueprint and workpiece taken but during die and mould designing． In this way， it is favorable to optimizing the heat treatment process and making full use of the potential of the materials． 2 Integration of Heat Treatment CAD／ CAE for Die and Mould It can be seen from Fig． 2 that the process design and simulation of heat treatment are the core of integration frame． After information input via product design module and heat treatment process generated via heat treatment CAD and heat treatment CAE module will automatically divide the mesh for parts drawing， simulation temperature field microstruc ture analysis after heat— treatment and the de fect of possible e merging (such as overheat,over burning)， and then the heat treatment process is judged if the optimization is made according to the result reappeared by stereoscopic vision technology． Moreover tool and clamping apparatus CAD and CAM are 3 integrated into this system． The concurrent engineering based integration frame can share information with other branch． That makes for optimizing the heat treatment process and ensuring the process sound． 3D model and stereoscopic vision technology for heat treatment The problems about materials， structure and size for die and mould can be discovered as soon as possible by 3D model for heat treatment based on the shape of die and mould ． Modeling heating condi tion and phase transformation condition for die and mould during heat treatment are workable， because it has been broken through for the calculation of phase transformation thermodynamics ， phase transformation kiics ， phase stress,thermal stress， heat transfer， hydrokiics etc． For example， 3D heat— conducting algorithm models for local heating plicated impression and asymmetric die and mould， and M ARC software models for microstructure 4 transformation was used ． Computer can present the informations of temperature， microstructure and stress at arbitrary ti me and display the entire transformation procedure in the form of 3D by coupling temperature field,microstructure field and stress field ． If the property can be coupled,various partial properties can be predicted by puter． Heat treatment process des ign Due to the special requests for strength， hardness， surface roughness and distortion during heat treatment for die and mould， the parameters including quenching medium type， quenching temperature and tempering temperature and time， must be properly selected， and w hether using surface quenching or chemical heat treatment the parameters must be rightly determined． It is difficult to deter mine the parameters by puter fully． Since puter technology develops quickly in recent decades, the difficulty with large— scale calculation has been overe． By simulating and weighing the property， the cost and the required period after heat treat ment． it is not difficult to optimize the heat treatment process． Data base for heat treatment A heat treatment database is described in Fig． 3． The data