【正文】 1 畢業(yè)設(shè)計(jì) /論文外文文獻(xiàn)翻譯要求： 1． 外文文 獻(xiàn)翻譯的內(nèi)容應(yīng)與畢業(yè)設(shè)計(jì) /論文課題相關(guān)。因此， 在允許的條件范圍內(nèi)，為了讓 高速芯片 能得到最好的工作效率和最長(zhǎng)的運(yùn)行時(shí)間，必須要讓芯片在短時(shí)間內(nèi)冷卻下來(lái)。 LM35 在 55 ℃ ~ +150℃ 溫度范圍 內(nèi)可以正常的 工作，而 LM35C 可工作的溫度范圍 為 40 ℃ ~ +110℃ 。 對(duì)于重要代碼應(yīng)用，其他 16 位 代碼在 Thumb 模式 性能損失 可減少超過(guò) 30％ 。以這種方式 檢測(cè) 高速芯片 的溫度與實(shí)際溫度較為接近 ，但 也有可能 測(cè)量溫度 比 管芯溫度上升 時(shí)溫度要低 。因此，為了避免這些影響 ， 風(fēng)扇的驅(qū)動(dòng)器信號(hào)必須限制在一個(gè)可接受 范圍內(nèi) 。 Transducers Journal,2020, Embedded Processor Based Automatic Temperature Control of VLSI Chips Abstract This paper presents embedded processor based automatic temperature control of VLSI chips, using temperature sensor LM35 and ARM processor LPC2378. Due to the very high packing density, VLSI chips get heated very soon and if not cooled properly, the performance is very much affected. In the present work, the sensor which is kept very near proximity to the IC will sense the temperature and the speed of the fa n arranged near to the IC is controlled based on the PWM signal generated by the ARM processor. A buzzer is also provided with the hardware, to indicate either the failure of the fan or overheating of the IC. The entire process is achieved by developing a suitable embedded C program. Keywords: Temperature sensor, ARM processor, VLSI chips, Brushless DC motor 7 With the phenomenal developments in VLSI technology, the ambitious IC designers are trying to put more transistors in to smaller packages. So, the ICs run at higher speeds and produce large amount of heat which creates the problem of thermal management. For example, nowadays the CPU chips are being smaller and smaller with almost no room for the heat to escape. The total power dissipation levels now reside on the order of 100 W with a peak power density of 400500 W/Cm2, and are still steadily climbing. As the chip temperature increases its performance is very much degraded by parameters shift, decrease in operating frequencies and outof specification of timings. So the high speed chips must be cooled to maintain good performance for the longest possible operating time and over the widest possible range of environmental conditions. The maximum allowable temperature for a high speed chip to meet its parametric specifications depends on the process and how the chip is designed. Among the various cooling techniques, heat sinks, heat pipes, fans and clock throttling are usually employed. Among these techniques, fans can dramatically reduce the temperature of a high speed chip,but they also generate a great deal of acoustic noise. This noise can be reduced significantly by varying ,the fans speed based on temperature . the fan can turn slowly when the temperature is low and canspeed up as the temperature other prominent method is clock throttling . reducing the clock speed to reduce power dissipation. But it also reduces the system performance and the systems functionality is , the objective of the present work is, to design a hardware system consisting of a brushless DC motor fan whose speed is controlled based on the temperature of the chip, sensed by the sensor LM35 series are precision integratedcircuit temperature sensors, whose output voltage is linearly proportional to the Celsius (Centigrade) temperature. The LM35 thus has an advantage over linear temperature sensors calibrated in Kelvin, as the user is not required to subtract a large constant voltage from its output to obtain conven