線路板pcb專業(yè)英語詞匯(制造、測試、缺陷名等)-免費閱讀
【正文】 2． 基材 基材的種類和結(jié)構(gòu)Base material基材 Laminate層壓板 Copperclad laminate (CCL)覆銅箔層壓板 Prepreg預(yù)浸材料 Bonding sheet/bonding layer粘結(jié)片 Epoxy glass substrate環(huán)氧玻璃基板 Copperclad surface銅箔面 Foil removal surface去銅箔面 Length wise direction縱向 cross wise direction橫向 Core material內(nèi)層芯材 基材的材料 Astage resinA 階樹脂 Bstage resinB 階樹脂 C stage resinC 階樹脂 epoxy resin環(huán)氧樹脂 Polymer聚合物 Photosensitive resin感光性樹脂 Thermosetting resin熱固性樹脂 Thermoplastic resin熱塑性樹脂 Adhensive膠粘劑 Curing agent固化劑 Flame retardant阻燃劑 opaquer遮光劑 Polyester film (PET)聚酯薄膜 Polyimide film (PI)聚酰亞胺薄膜 Polytetrafluoetylene (PTFE)聚四氟乙烯 Nonwoven fabric非織布/無紡布 Glass fiber玻璃纖維 Glass fabric玻璃布 Warpwise經(jīng)向 Weftwise緯向 Copper foil銅箔 Eletrodeposited copper foil電解銅箔 Rolled copper foil壓延銅箔 Resin coated copper foil (RCC)涂樹脂銅箔 基材的制造 Polymerize聚合 Thermoplastic熱塑性 Thermoset熱固性 Clad覆箔 Layup疊層 laminating層壓 Postcure后固化 Curing time固化時間 Resinflow樹脂流動度 Resin content樹脂含量 PCB英語詞匯（二）3 設(shè)計 通用術(shù)語 Computeraided design (CAD)計算機(jī)輔助設(shè)計 Computeraided manufacturing (CAM)計算機(jī)輔助制造 Routing布線 Layout布圖設(shè)計 Component density元件密度 Arry陣列 形狀與尺寸 Conductor導(dǎo)線 Conductor width導(dǎo)線寬度 Conductor spacing導(dǎo)線間距 Conductor width/space導(dǎo)線寬度/間距 Conductor layer導(dǎo)線層 Component hole元件孔 Mounting hole安裝孔 Supported hole支撐孔 Unsupported hole非支撐孔 Via導(dǎo)通孔 Plated through hole鍍通孔 Blind via (hole)盲孔 Buried via (hole)埋孔 Buried/ blind via埋/盲孔 Any layer inner via hole (ALIVH)任意層內(nèi)部導(dǎo)通孔 Tooling/ pilot hole定位孔 Landless hole無連接盤導(dǎo)通孔 Viainpad在連接盤中導(dǎo)通孔 Pitch節(jié)距 Fine pitch精細(xì)節(jié)距 電氣互連 Interfacial connection表面間連接 Interlayer connection層間連接 Innerlayer connection內(nèi)層連接 Pad, land連接盤 Component lead Primary side主面 Secondary side輔面 Signal layer信號層 Crosstalk串?dāng)_ Capacitance電容 Electromagnetic interference(EMT)電磁干擾 Electromagnetic shielding電磁屏蔽 Impedance特性阻抗 Inductance電感 Coplanarity共面性（度） Core material 芯板 Thin type multilayer board薄型多層板 Buried and blind via hole mutilayer board埋/盲孔多層板 Buried bump interconnection technology (B2it)嵌入凸塊互連技術(shù) Multichip module (MCM)多芯片模塊 Alignment mark對準(zhǔn)標(biāo)記 Registration mark對位標(biāo)記 Layer to layer registration層間重合度 PCB英語詞匯（三）4. 制造 通用術(shù)語 Subtractive process減成法 Additive process加成法 Semiadditive process半加成法 Fulladditive process全加成法 Build up process積層法 Solder mask on bare copper(SMOBC)裸銅覆阻焊工藝 Tenting掩蔽法 Sequential lamination順序?qū)訅悍?Wet process濕處理 Panel plating process板面電鍍法 Pattern plating process圖形電鍍法 Finishing最終修飾 Reworking返工
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