【正文】 ld rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/Utility/Diagnostic release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 塑膠 ,線材 ,塗料 1000 PPM Cadmium (Cd) 鎘 100 PPM Mercury (Hg) 汞 1000 PPM Hex. Chromium (Cr6+) 六價鉻 1000 PPM PBB (聚溴聯(lián)苯 ) 1000 PPM PBDE (聚溴二苯醚 ) 1000 PPM ?重金屬： 汞、鉛、鎘、六價鉻 ?溴性耐燃劑：聚溴聯(lián)苯 (PBBs)、 溴聯(lián)苯醚 (PBDEs) 註：另有 管制規(guī)範外 的項目 EU WEEE Directive ? Directive 2022/96/EC期程 – 指令發(fā)布 – 歐盟公報發(fā)行，指令生效 – 轉為會員國當?shù)胤?,法規(guī)或行政指令 – 完成回收系統(tǒng)建構 ,製造商因應回收之 財務規(guī)劃就緒 – 回收再利用率達每人每年 4kg – 訂定下階段目標 ? 回收 Target of Recovery and Recycling (Waste Electrical and Electronic Equipment) WEEE Category Large household appliances Small household appliances IT amp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status amp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status amp。 Proposal Design amp。 drawing Signal Integrity DFX Check AVLC Test Plans Reliability/Stress EMI/ Safety OS amp。 Responsibility Function Responsibility CFE CFE acts on behalf of Wistron global manufacturing operation to deal with the customer, and also acts as a representative of the customer when dealing with internal Wistron teams. Based on the C4/C5 checklist, related reports and project status, CFE is responsible to conclude the exit judgment (Ready or Not ready) during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP or not NPI 、協(xié)調、整合與提供 各 Site製造所需相關資訊與技術資料 PE/PME , 產品問題之發(fā)覺及產品移交 . ,克服生產瓶頸 ,提高生產力 . ,進行改善以確保產品品質 . IE . 、杜絕不合理，提高生產力 、製程改善、標準工時製定 QA . PCBA,Final Assembly之檢驗標準 QE , MTBF, ORT Test (C4) Wistron Case Role amp?！? EMC/Safety All products to meet EMC/Safety requirements and guarantee the legality in the international marketing. 申請產品之安規(guī)、測試、Debug.. QT 為 Ramp。 包括 ME, Thermal, Packing design. 若只寫 SW (Software design) 則指軟體設計部門有負責 BIOS, Driver 及 Preload 不同工作性質之軟體開發(fā)功能 . Ramp。 Responsibility Function Responsibility PM 產品經(jīng)理 Product Manager (或計畫專案經(jīng)理 Project Manager)為所負責計畫或產品線成敗之總負責人 , 將依產品線之性質指定專人負責某類產品 ,必頇對所負責產品線專業(yè)領域之發(fā)展及行銷雙方面皆有相當程度的了解 . 並依照產品之條件及市場狀況 ,做適當?shù)倪\用 ,訂定技術或產品市場競爭策略 ,並在適當?shù)臅r機推出適當之技術或產品 . TM TM is responsible to coordinate technical issues conflict among HW, SW, ID and ME and decisionmaking. TM has to handle all project technical issues. PCC 為規(guī)劃推廣、連絡及控制專案進行的負責人 , 掌握專案進行之情況以協(xié)助處理異常狀況 , 使新產品能順暢切入工廠且如期推出 , 以提高產品競爭力 . 協(xié)助 Ramp。CSystem Introduction will cover ? Role amp。D Design phase 設計階段 ? C3: Lab Pilot Run phase 樣品試作階段 ? C4: Eng Pilot Run phase 工程試作階段 ? C5: PD Pilot Run phase 試產階段 ? C6: Mass Production phase 量產階段 ： ； :； ： Role amp。D 包括電子部門及工業(yè)設計部門 ,若只寫 HW (Hardware Design) 則指電子部門 ,若只寫 ID (INDUSTRIAL DESIGN) 則指工業(yè)設計部門 。 Responsibility Function Responsibility PA (EMI/Safety, QT, CE/Reliability, PCB, OS Certification) 為產品保證暨開發(fā)支援 Function之總稱 , 主要負責根據(jù) MRS/PES 執(zhí)行各項產品之測試 , 諸如 EMC/Safety : REGULATORY TEST , CE : RELIABILITY TEST 及 KEY COMPONENT APPROVAL , PCB : PCB LAYOUT, DC : BOM , OS : OS 認證 etc。 Responsibility Function Responsibility