【正文】 ld rate analysis rpt ? PCBA inspection instruction ? Product inspection instruction ? MTBF DEMO test report PM C0 meeting C1 meeting PM ? C0 Checklist ? MRS PM ? C1 checklist ? Invention disclosure ? Time schedule ? Project team ? Model number define ? Green design guide and review check list ? Non QVL/Sample approval request form ? C2 checklist ? PES ? EMC/Safety Request Form ? BOM/QVL(Prel.) ? PCB Layout (prel.) ? Outsourcing module specification PM NPI C0 C1 C2 C3 C4 C5 C6 C6 meeting GCSD ? C6 checklist ? Product phase out notice ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/Utility/Diagnostic release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 bug list review ? C4 checklist ? BOM ? QVL ? Time standard ? System BIOS/KBC FW release ? S/W Driver/AP/ Utility/Diagnostic Release ? EE Eng. P/R report ? SMT WS P/R report ? PCBA WS P/R report ? ME Eng. P/R report ? Eng. P/R QA review report ? Schematics amp。 塑膠 ,線材 ,塗料 1000 PPM Cadmium (Cd) 鎘 100 PPM Mercury (Hg) 汞 1000 PPM Hex. Chromium (Cr6+) 六價(jià)鉻 1000 PPM PBB (聚溴聯(lián)苯 ) 1000 PPM PBDE (聚溴二苯醚 ) 1000 PPM ?重金屬： 汞、鉛、鎘、六價(jià)鉻 ?溴性耐燃劑：聚溴聯(lián)苯 (PBBs)、 溴聯(lián)苯醚 (PBDEs) 註：另有 管制規(guī)範(fàn)外 的項(xiàng)目 EU WEEE Directive ? Directive 2022/96/EC期程 – 指令發(fā)布 – 歐盟公報(bào)發(fā)行，指令生效 – 轉(zhuǎn)為會(huì)員國(guó)當(dāng)?shù)胤?,法規(guī)或行政指令 – 完成回收系統(tǒng)建構(gòu) ,製造商因應(yīng)回收之 財(cái)務(wù)規(guī)劃就緒 – 回收再利用率達(dá)每人每年 4kg – 訂定下階段目標(biāo) ? 回收 Target of Recovery and Recycling (Waste Electrical and Electronic Equipment) WEEE Category Large household appliances Small household appliances IT amp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status amp。D Design Phase Lab Pilot Run Phase Eng. Pilot Run Phase Production Pilot run Phase Mass production phase C2 meeting C3 meeting C4 meeting C5 meeting ? C3 checklist ? HW DV test report ? SW FV test report ? ME test report ? Reliability test report (prel.) ? ME/Artwork /packing drawing ? PAL/ROM data listing ? C3 manufacturability review report ? Sample approve status amp。 Proposal Design amp。 drawing Signal Integrity DFX Check AVLC Test Plans Reliability/Stress EMI/ Safety OS amp。 Responsibility Function Responsibility CFE CFE acts on behalf of Wistron global manufacturing operation to deal with the customer, and also acts as a representative of the customer when dealing with internal Wistron teams. Based on the C4/C5 checklist, related reports and project status, CFE is responsible to conclude the exit judgment (Ready or Not ready) during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP or not NPI 、協(xié)調(diào)、整合與提供 各 Site製造所需相關(guān)資訊與技術(shù)資料 PE/PME , 產(chǎn)品問題之發(fā)覺及產(chǎn)品移交 . ,克服生產(chǎn)瓶頸 ,提高生產(chǎn)力 . ,進(jìn)行改善以確保產(chǎn)品品質(zhì) . IE . 、杜絕不合理，提高生產(chǎn)力 、製程改善、標(biāo)準(zhǔn)工時(shí)製定 QA . PCBA,Final Assembly之檢驗(yàn)標(biāo)準(zhǔn) QE , MTBF, ORT Test (C4) Wistron Case Role amp?！? EMC/Safety All products to meet EMC/Safety requirements and guarantee the legality in the international marketing. 申請(qǐng)產(chǎn)品之安規(guī)、測(cè)試、Debug.. QT 為 Ramp。 包括 ME, Thermal, Packing design. 若只寫 SW (Software design) 則指軟體設(shè)計(jì)部門有負(fù)責(zé) BIOS, Driver 及 Preload 不同工作性質(zhì)之軟體開發(fā)功能 . Ramp。 Responsibility Function Responsibility PM 產(chǎn)品經(jīng)理 Product Manager (或計(jì)畫專案經(jīng)理 Project Manager)為所負(fù)責(zé)計(jì)畫或產(chǎn)品線成敗之總負(fù)責(zé)人 , 將依產(chǎn)品線之性質(zhì)指定專人負(fù)責(zé)某類產(chǎn)品 ,必頇對(duì)所負(fù)責(zé)產(chǎn)品線專業(yè)領(lǐng)域之發(fā)展及行銷雙方面皆有相當(dāng)程度的了解 . 並依照產(chǎn)品之條件及市場(chǎng)狀況 ,做適當(dāng)?shù)倪\(yùn)用 ,訂定技術(shù)或產(chǎn)品市場(chǎng)競(jìng)爭(zhēng)策略 ,並在適當(dāng)?shù)臅r(shí)機(jī)推出適當(dāng)之技術(shù)或產(chǎn)品 . TM TM is responsible to coordinate technical issues conflict among HW, SW, ID and ME and decisionmaking. TM has to handle all project technical issues. PCC 為規(guī)劃推廣、連絡(luò)及控制專案進(jìn)行的負(fù)責(zé)人 , 掌握專案進(jìn)行之情況以協(xié)助處理異常狀況 , 使新產(chǎn)品能順暢切入工廠且如期推出 , 以提高產(chǎn)品競(jìng)爭(zhēng)力 . 協(xié)助 Ramp。CSystem Introduction will cover ? Role amp。D Design phase 設(shè)計(jì)階段 ? C3: Lab Pilot Run phase 樣品試作階段 ? C4: Eng Pilot Run phase 工程試作階段 ? C5: PD Pilot Run phase 試產(chǎn)階段 ? C6: Mass Production phase 量產(chǎn)階段 ： ； :； ： Role amp。D 包括電子部門及工業(yè)設(shè)計(jì)部門 ,若只寫 HW (Hardware Design) 則指電子部門 ,若只寫 ID (INDUSTRIAL DESIGN) 則指工業(yè)設(shè)計(jì)部門 。 Responsibility Function Responsibility PA (EMI/Safety, QT, CE/Reliability, PCB, OS Certification) 為產(chǎn)品保證暨開發(fā)支援 Function之總稱 , 主要負(fù)責(zé)根據(jù) MRS/PES 執(zhí)行各項(xiàng)產(chǎn)品之測(cè)試 , 諸如 EMC/Safety : REGULATORY TEST , CE : RELIABILITY TEST 及 KEY COMPONENT APPROVAL , PCB : PCB LAYOUT, DC : BOM , OS : OS 認(rèn)證 etc。 Responsibility Function Responsibility