【正文】 09 Name： xx Student ID： 202216022218 Teacher： xx 畢業(yè)設(shè)計(jì)（論文）專(zhuān)業(yè)紙目 錄摘要 .............................................................................................................IABSTRACT..............................................................................................II前言 ............................................................................................................1第 1 章 緒論 ............................................................................................2 課題研究的目的及意義 .................................................................2 課題選題背景 .................................................................................2 課題研究?jī)?nèi)容 .................................................................................3第 2 章 系統(tǒng)總體結(jié)構(gòu) ............................................................................4 硬件設(shè)計(jì) .........................................................................................4 主控芯片 ................................................................................4 1602 液晶顯示 .........................................................................6 LM324 運(yùn)算放大器芯片 .........................................................7 74LS138 譯碼器芯片 ..............................................................8 軟件設(shè)計(jì) .........................................................................................8 C 簡(jiǎn)介 ......................................................................................8 KEIL 簡(jiǎn)介 ................................................................................9 PROTEUS 簡(jiǎn)介 .......................................................................9 系統(tǒng)工作原理 ...............................................................................10畢業(yè)設(shè)計(jì)（論文）專(zhuān)業(yè)紙第 3 章 電路原理分析設(shè)計(jì) ..................................................................12 電路板總體結(jié)構(gòu) ...........................................................................12 電路板各模塊功能分析 ...............................................................13 電源電路模塊分析 ................................................................13 串口通信電路模塊分析 ........................................................13 液晶顯示電路模塊分析 ........................................................14 按鍵電路模塊分析 ................................................................14 放電電路模塊分析 ................................................................15 量程轉(zhuǎn)換電路模塊分析 ........................................................15 電容測(cè)量電路模塊分析 ........................................................16第 4 章 原理圖繪制及 PCB 板制作 ....................................................19 單元電路的原理圖設(shè)計(jì) ...............................................................19 作圖工具 Altium designer09 簡(jiǎn)介 .......................................19 原理圖的設(shè)計(jì)流程 ................................................................20 器件庫(kù)的制作 ........................................................................21 元器件清單 ............................................................................24 仿真及萬(wàn)能板電路焊接、調(diào)試 ...................................................25 Proteus 的仿真 .......................................................................25 Ni Multisim 11 仿真 ..............................................................26 焊接萬(wàn)能板 ............................................................................27 PCB 印制板設(shè)計(jì)與制作 ..............................................................28畢業(yè)設(shè)計(jì)（論文）專(zhuān)業(yè)紙 設(shè)置 PCB 設(shè)計(jì)環(huán)境 ...............................................................28 元件布局 ................................................................................31 布線，覆銅 ............................................................................33 PCB 板的焊接 ........................................................................36第 5 章 總結(jié) ..........................................................................................38 設(shè)計(jì)工作總結(jié) ...............................................................................38 后期展望 .......................................................................................38謝辭 ..........................................................................................................40參考文獻(xiàn) ..................................................................................................41附錄 ..........................................................................................................43附錄一（英語(yǔ)文獻(xiàn)） ...........................................................................43附錄二（中文翻譯） ...........................................................................51畢業(yè)設(shè)計(jì)（論文）專(zhuān)業(yè)紙 I 基于單片機(jī)的電容測(cè)試儀——硬件設(shè)計(jì)摘 要隨著經(jīng)濟(jì)的發(fā)展和科技水平的提高，很多智能芯片的制造，使電子測(cè)量?jī)x表向數(shù)字化、智能化方向發(fā)展。本課題針對(duì)在校學(xué)生實(shí)驗(yàn)，設(shè)計(jì)中經(jīng)常因?yàn)闃?biāo)簽丟失而無(wú)法得知其容值，提出開(kāi)發(fā)了基于單片機(jī)的電容測(cè)試儀系統(tǒng)。關(guān)鍵詞：?jiǎn)纹瑱C(jī)，電容測(cè)試，LCD1602畢業(yè)設(shè)計(jì)（論文）專(zhuān)業(yè)紙 II The Capacitor Tester Based on the Single Chip Microputer Hardware DesignAbstractWith the development of economy and the improvement of science and technology, many smart chip manufacturing, electronic measuring instrument to digital, intelligent direction. Capacitance measurement is one of the most basic electronic measurement parameters measurement, requires a certain accuracy, at the same time requires wide measurement range, measurement speed is faster. Capacitance is fairly mon in industrial production, are also mon in the middle of the electronic teaching process. In the design of this topic in view of the students in the experiment, often because the label is missing and not privy to the capacitance value, capacitance measuring instrument based on single chip microputer system is developed.The subject through the single chip microputer, LCD1602 LCD display, measuring circuit design, etc., has developed a set of capacitance test system, the system is made up of display system, key system and measurement s