20xx年硬件工程師英文簡(jiǎn)歷表格(文件)
【正文】 neer to select new product items, do demo in factory, and then qualify : I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the 。39。2020/01Nanyang University of Science amp。 Technology as a Research Fellow. I major at Gate oxide Reliability research in the 。2020/03Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate1998/09。39。 Technology Material Science and Engineering Bachelor1997/07。1997/07Nanjing University of Science amp。amp。amp。 Technology Microelectronics DoctorateI worked in Nan yang University of Science amp。2020/05Optimization the current Test Process Order for Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by : Being the Project leader, I take the main responsibility, such as, design, plan, organize and 。amp。amp。amp。2020/05Intel(Shanghai) Technology Development Ltd. CompanyIndustry: Electronics/Semiconductor/ICIntel STTDChina Department Electronics Development Engineer Responsibilities： had been working in STTDChina since Jan 2020 to May 2020 as a senior module that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one Directly to: Hopman MarkNumber of Subordinate: 14Reference: Bao PowelReas
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