晶片的來料檢驗(yàn)-wenkub
2023-05-31 12:34:00 本頁面
【正文】 rejected, unless it is demonstrated to be a harmless film, glassivation interface, or other nonobscuring effects. Discoloration or Corrosion 變 色 腐 蝕 狀 態(tài) 玻 璃 鈍 化 There shall be no Conductive (opaque) Foreign Material on the top of unglassivated die that is large enough to bridge two or more adjacent metallization areas, and that cannot be removed Contamination or Foreign material 混 淆 外 來 料 子 不 透 明 橋 梁 Contamination or Foreign material There shall be no conductive (opaque) Foreign Material under the top glassivation layer of the die that is large enough to bridge two or more adjacent metallization areas There shall be no attached or embedded material in die that bridges two active circuit elements. GaAs: There shall be no attached or embedded material in die that reduces spacing of two active circuit elements by greater than 50 percent. Silicon: There shall be no attached or embedded material in die that does not provide a visible line of separation between two active circuit elements. 附 加 在 ... 深 留 料 子 There shall be no liquid drops, chemical stains, ink or photoresist on top of unglassivated areas that bridges two active circuit elements. (Liquid drops, chemical stains, ink or photoresis
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